On the DRA72x (J6Eco) EVM one PMIC SMPS is powering three SoC
core rails. This concept of using one SMPS to supply multiple
core domains (in various, although limited combinations, per
primary device use case) has now become common and is used by
many customer J6/J6Eco designs; it is supported by a number of
corresponding PMIC OTP versions.
This patch implements correct operation of the core voltages
scaling routine by ensuring that each SMPS that is supplying
more than one domain shall be written only once, and with the
highest voltage of those fused in the SoC (or of those defined
in the corresponding header if fuse read is disabled or fails)
for the power rails belonging to the group.
The patch also replaces some PMIC-related magic numbers with
the appropriate definitions. The default OPP_NOM voltages for
the DRA7xx SoCs are updated as well, per the latest DMs.
Signed-off-by: Lubomir Popov <l-popov@ti.com>
BeagleBoard-X15 is the next generation Open Source
Hardware BeagleBoard based on TI's AM5728 SoC
featuring dual core 1.5GHZ A15 processor. The
platform features 2GB DDR3L (w/dual 32bit busses),
eSATA, 3 USB3.0 ports, integrated HDMI (1920x108@60),
separate LCD port, video In port, 4GB eMMC, uSD,
Analog audio in/out, dual 1G Ethernet.
For more information, refer to:
http://www.elinux.org/Beagleboard:BeagleBoard-X15
Signed-off-by: Felipe Balbi <balbi@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Reviewed-by: Tom Rini <trini@ti.com>
this will allow for boards to overwrite those
in case memory setup is different.
Signed-off-by: Felipe Balbi <balbi@ti.com>
Reviewed-by: Tom Rini <trini@ti.com>
some boards might want to use USB1 for host,
without fiddling those registers it'll be
impossible.
Signed-off-by: Felipe Balbi <balbi@ti.com>
Reviewed-by: Tom Rini <trini@ti.com>
Those regulators don't have any coupling with
what they supply, so remove the suffixes in order
to not confuse anybody.
Signed-off-by: Felipe Balbi <balbi@ti.com>
Reviewed-by: Tom Rini <trini@ti.com>
This commit introduces a Kconfig symbol for each ARM CPU:
CPU_ARM720T, CPU_ARM920T, CPU_ARM926EJS, CPU_ARM946ES, CPU_ARM1136,
CPU_ARM1176, CPU_V7, CPU_PXA, CPU_SA1100.
Also, it adds the CPU feature Kconfig symbol HAS_VBAR which is selected
for CPU_ARM1176 and CPU_V7.
For each target, the corresponding CPU is selected and the definition of
SYS_CPU in the corresponding Kconfig file is removed.
Also, it removes redundant "string" type in some Kconfig files.
Signed-off-by: Georges Savoundararadj <savoundg@gmail.com>
Acked-by: Albert ARIBAUD <albert.u.boot@aribaud.net>
Cc: Masahiro Yamada <yamada.m@jp.panasonic.com>
Now the types of CONFIG_SYS_{ARCH, CPU, SOC, VENDOR, BOARD, CONFIG_NAME}
are specified in arch/Kconfig.
We can delete the ones in arch and board Kconfig files.
This commit can be easily reproduced by the following command:
find . -name Kconfig -a ! -path ./arch/Kconfig | xargs sed -i -e '
/config[[:space:]]SYS_\(ARCH\|CPU\|SOC\|\VENDOR\|BOARD\|CONFIG_NAME\)/ {
N
s/\n[[:space:]]*string//
}
'
Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
On DRA72x, EMIF supports DDR3 upto 667MHz.
Adding the required settings for DDR3 at 666MHz and enabling it.
Signed-off-by: R Sricharan <r.sricharan@ti.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
Becuase the board select menu in arch/arm/Kconfig is too big,
move the OMAP5 board select menu to omap5/Kconfig.
Move also common settings (CONFIG_SYS_CPU="armv7" and
CONFIG_SYS_SOC="omap5").
Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
Reviewed-by: Tom Rini <trini@ti.com>
Cc: Lokesh Vutla <lokeshvutla@ti.com>
Currently hw leveling is enabled by default on DRA7/72.
But the hardware team suggested to use sw leveling as hw leveling
is not characterized and seen some test case failures.
So enabling sw leveling on all DRA7 platforms.
Signed-off-by: Sricharan R <r.sricharan@ti.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
DRA72 has 1GB connected to EMIF1 only. Updating the details.
And also enable WA for BUG0039 only if corresponding EMIF is present.
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
Acked-by: Tom Rini <trini@ti.com>
TPS65917 is used in DRA722 evm. Update the address offsets accordingly.
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
Signed-off-by: Keerthy <j-keerthy@ti.com>
Acked-by: Tom Rini <trini@ti.com>
Copied from Linux sources "include/linux/sizes.h" commit
413541dd66d51f791a0b169d9b9014e4f56be13c
Signed-off-by: Alexey Brodkin <abrodkin@synopsys.com>
Cc: Vineet Gupta <vgupta@synopsys.com>
Cc: Tom Rini <trini@ti.com>
Cc: Stefan Roese <sr@denx.de>
Cc: Albert Aribaud <albert.u.boot@aribaud.net>
Acked-by: Tom Rini <trini@ti.com>
Acked-by: Stefan Roese <sr@denx.de>
[trini: Add bcm Kona platforms to the patch]
Signed-off-by: Tom Rini <trini@ti.com>
commit 194dd74ad9
(DRA7: add ABB setup for MPU voltage domain)
Made an offset typo error by using 0x4A003B24 as the efuse offset
for OPP_NOM. As per TI documentation, 0x4A003B24 is for OPP_OD, and
0x4A003B20 is for OPP_NOM. Fix the same.
Reported-by: Praveen Rao <prao@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
This commit changes the working directory
where the build process occurs.
Before this commit, build process occurred under the source
tree for both in-tree and out-of-tree build.
That's why we needed to add $(obj) prefix to all generated
files in makefiles like follows:
$(obj)u-boot.bin: $(obj)u-boot
Here, $(obj) is empty for in-tree build, whereas it points
to the output directory for out-of-tree build.
And our old build system changes the current working directory
with "make -C <sub-dir>" syntax when descending into the
sub-directories.
On the other hand, Kbuild uses a different idea
to handle out-of-tree build and directory descending.
The build process of Kbuild always occurs under the output tree.
When "O=dir/to/store/output/files" is given, the build system
changes the current working directory to that directory and
restarts the make.
Kbuild uses "make -f $(srctree)/scripts/Makefile.build obj=<sub-dir>"
syntax for descending into sub-directories.
(We can write it like "make $(obj)=<sub-dir>" with a shorthand.)
This means the current working directory is always the top
of the output directory.
Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
Tested-by: Gerhard Sittig <gsi@denx.de>
Patch adds modification to shared omap5 abb_setup() function, and
proper registers definitions needed for ABB setup sequence. ABB is
initialized for MPU voltage domain at OPP_NOM.
Signed-off-by: Nishanth Menon <nm@ti.com>
Reviewed-by: Tom Rini <trini@ti.com>
ES1.1 silicon is a very minor variant of ES1.0. Add priliminary support
for ES1.1 IDCODE change.
Signed-off-by: Nishanth Menon <nm@ti.com>
Reviewed-by: Tom Rini <trini@ti.com>
The commit
f3f98bb0 : "ARM: OMAP4/5: Do not configure non essential pads, clocks, dplls"
removed the config option aimed towards moving that stuff into kernel, which
renders some code unreachable. Remove that code.
Signed-off-by: Jassi Brar <jaswinder.singh@linaro.org>
As per the latest 0.6 version of DM for OMAP5430 ES2.0,
MPU_GCLK is given as 1000MHz. In order to achieve this DPLL_MPU
should be locked at 2000MHz. Fixing the same and cleaning the
previously used dpll values.
Reported-by: Nishanth Menon <nm@ti.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
Commit "armv7: hw_data: change clock divider setting"
updates the setting for m6 divider for 20MHz sys_clk frequency.
But missed to update for other sys_clk frequencies. Doing the same.
Reported-by: Rajendran, Vinothkumar <vinothr@ti.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
Certain EFUSE settings were recommended for the first
four lots of OMAP5 ES1.0 silicon. These are not applicable
for OMAP5 ES2.0 and DRA7 silicon. So removing these EFUSE settings.
Reported-by: Griffis, Brad <bgriffis@ti.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
When core power domain hits oswr, then DDR3 memories does not come back
while resuming. This is because when EMIF registers are lost, then the
controller takes care of copying the values from the shadow registers.
If the shadow registers are not updated with the right values, then this
results in incorrect settings while resuming. So updating the shadow registers
with the corresponding status registers here during the boot.
Signed-off-by: Sricharan R <r.sricharan@ti.com>
Currently the DDR3 memory on DRA7 ES1.0 evm board is enabled using
software leveling. This was done since hardware leveling was not
working. Now that the right sequence to do hw leveling is identified,
use it. This is required for EMIF clockdomain to idle and come back
during lowpower usecases.
Signed-off-by: Sricharan R <r.sricharan@ti.com>
Add the support for the dra7xx xhci usb host.
dra7xx does not contain an EHCI controller so the headers
can be removed from the board file.
The xHCI host on dra7xx is connected to a usb2 phy so need to
add support to enable those clocks.
Signed-off-by: Dan Murphy <dmurphy@ti.com>
Clock requirement for qspi clk is 192 Mhz.
According to the below formulae,
f dpll = f ref * 2 * m /(n + 1)
clockoutx2_Hmn = f dpll / (hmn+ 1)
fref = 20 Mhz, m = 96, n = 4 gives f dpll = 768 Mhz
For clockoutx2_Hmn to be 768, hmn + 1 should be 4.
Signed-off-by: Sourav Poddar <sourav.poddar@ti.com>
Reviewed-by: Jagannadha Sutradharudu Teki <jagannadh.teki@gmail.com>
Writing magic bits into LDO SRAM was suggested only for OMAP5432
ES1.0. Now these are no longer applicable. Moreover these bits should
not be overwritten as they are loaded from EFUSE. So avoid
writing into these registers.
Boot tested on OMAP5432 ES2.0
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
Locking DPLL_GMAC
[mugunthanvnm@ti.com:Configure only if CPSW is selected]
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
Signed-off-by: Mugunthan V N <mugunthanvnm@ti.com>
The omap_gpio driver is used by AM33XX, OMAP3/4, OMAP54XX and DRA7XX SoCs.
These SoCs have different gpio count but currently omap_gpio driver uses hard
coded 192 which is wrong.
This patch fixes this issue by:
1. Move define of OMAP_MAX_GPIO to all arch/arm/include/asm/arch-omap*/gpio.h.
2. Update gpio bank settings and enable GPIO modules 7 & 8 clocks for OMAP5.
Thanks for Lubomir Popov to provide valuable comments to fix this issue.
Signed-off-by: Axel Lin <axel.lin@ingics.com>
Tested-by: Lubomir Popov <lpopov@mm-sol.com>
Acked-by: Heiko Schocher <hs@denx.de>
auxclk0 and auxclk1 are utilized on some OMAP5 boards.
Define the infrastructure needed for accessing them
without using magic numbers.
Also remove unrelated TPS62361 defines from clocks.h
Signed-off-by: Lubomir Popov <lpopov@mm-sol.com>
DRA7 EVM board has the below configuration. Adding the
settings for the same here.
2Gb_1_35V_DDR3L part * 2 on EMIF1
2Gb_1_35V_DDR3L part * 4 on EMIF2
Signed-off-by: Sricharan R <r.sricharan@ti.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
Update PLL values.
SYS_CLKSEL value for 20MHz is changed to 2. In other platforms
SYS_CLKSEL value 2 represents reserved. But in sys_clk array
ind 1 is used for 13Mhz. Since other platforms are not using
13Mhz, reusing index 1 for 20MHz.
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
Signed-off-by: Sricharan R <r.sricharan@ti.com>
Slew rate compensation cells are not present for DRA7xx
Soc's. So return from function srcomp_enable() if soc is not
OMAP54xx.
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
DRA752 now uses AVS Class 0 voltages which are voltages in efuse.
This means that we can now use the optimized voltages which are
stored as mV values in efuse and program PMIC accordingly.
This allows us to go with higher OPP as needed in the system without
the need for implementing complex AVS logic.
Signed-off-by: Nishanth Menon <nm@ti.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
TPS659038 is the power IC used in DRA7XX boards.
Adding support for this and also adding pmic data
for DRA7XX boards.
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
Voltage scaling can be done in two ways:
-> Using SR I2C
-> Using GP I2C
In order to support both, have a function pointer in pmic_data
so that we can call as per our requirement.
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
