A64 OLinuXino board from Olimex has three variants with onboard eMMC:
A64-OLinuXino-1Ge16GW, A64-OLinuXino-1Ge4GW and A64-OLinuXino-2Ge8G-IND. In
addition, there are two variants without eMMC. One without eMMC and one with SPI
flash. This suggests the need for separate device tree for the three eMMC
variants.
The Linux kernel upstream has chosen to create and use a separate device tree
for the eMMC variants instead of adding eMMC support existing device tree. These
changes to Linux kernel are queued for Linux 5.4.
commit <02bb66b347ff8115f53948f86b884e008ba385b9> ("arm64: dts:
allwinner: a64: Add A64 OlinuXino board (with eMMC)")
This patch has been tested on A64-OLinuXino-1Ge16GW and is based on Linux
device-tree and a64-olinuxino_defconfig.
Signed-off-by: Sunil Mohan Adapa <sunil@medhas.org>
[jagan: updated linux-next commit details]
Signed-off-by: Jagan Teki <jagan@amarulasolutions.com>
Reviewed-by: Jagan Teki <jagan@amarulasolutions.com>
SoPine has winbond SPI-FLASH, so enable the same in defconfig
and add aliases for spi0 in -u-boot.dtsi
Signed-off-by: Jagan Teki <jagan@amarulasolutions.com>
Add support for System Controller available on e-a2197-00 base board.
System is very similar to p-a2197-00 board.
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
There are use cases where lpd watchdog can be configured for APU use. By
design this IP should be listed in zynqmp.dtsi to make sure that node is
properly enabled by DTG.
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
This patch updates the nand device tree node properties as per
updated driver.
Signed-off-by: Naga Sureshkumar Relli <naga.sureshkumar.relli@xilinx.com>
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
ina226 hwmon driver is deprecated and it is recommended to use new iio
based driver. The patch is enabling iio-hwmon driver to export
functionality from IIO to hwmon interface to be able to use lm-sensors
package.
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
Label property is adding capability to distiguish chips from each other
when iio framework is used.
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
ina226 hwmon driver is deprecated and it is recommended to use new iio
based driver. The patch is enabling iio-hwmon driver to export
functionality from IIO to hwmon interface to be able to use lm-sensors
package.
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
Add gpio phy reset via I2C expander TCA6416 on board ZCU102.
A warning call trace is observer in probe when this reset is called
from context that can sleep. Keep this commented until that is
resolved in phylib.
Signed-off-by: Harini Katakam <harini.katakam@xilinx.com>
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
The DP83867 strap control workaround is already present in Linux kernel
mainline binding. All these Xilinx boards require this quirk.
Signed-off-by: Harini Katakam <harini.katakam@xilinx.com>
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
ina226 hwmon driver is deprecated and it is recommended to use new iio
based driver. The patch is enabling iio-hwmon driver to export
functionality from IIO to hwmon interface to be able to use lm-sensors
package.
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
Label property is adding capability to distiguish chips from each other
when iio framework is used.
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
ina226 hwmon driver is deprecated and it is recommended to use new iio
based driver. The patch is enabling iio-hwmon driver to export
functionality from IIO to hwmon interface to be able to use lm-sensors
package.
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
The si570 clock frequency should be 156.25MHz as per datasheet.
Signed-off-by: Venkatesh Yadav Abbarapu <venkatesh.abbarapu@xilinx.com>
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
Label property is adding capability to distiguish chips from each other
when iio framework is used.
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
ina226 hwmon driver is deprecated and it is recommended to use new iio
based driver. The patch is enabling iio-hwmon driver to export
functionality from IIO to hwmon interface to be able to use lm-sensors
package.
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
Currently zcu102 Rev1.0 board includes RevA sdhci dt node which has
no-1-8-v property. Since Rev1.0 has level shifters delete this
property to enable support for 1.8v.
Signed-off-by: T Karthik Reddy <t.karthik.reddy@xilinx.com>
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
Mainline has done this switch and there is no reason not to switch it too.
Mainline U-Boot patch which has done that switch:
"dts: switch spi-flash to jedec, spi-nor compatible"
(sha1: ffd4c7c2ec)
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
Label property is adding capability to distiguish chips from each other
when iio framework is used.
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
ina226 hwmon driver is deprecated and it is recommended to use new iio
based driver. The patch is enabling iio-hwmon driver to export
functionality from IIO to hwmon interface to be able to use lm-sensors
package.
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
Added tps53679 compatible string to tps53681. They are both compatible to
each other and tps53679 has Linux driver already.
Signed-off-by: Nishant Mittal <nishant.mittal@xilinx.com>
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
Label property is adding capability to distiguish chips from each other
when iio framework is used.
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
ina226 hwmon driver is deprecated and it is recommended to use new iio
based driver. The patch is enabling iio-hwmon driver to export
functionality from IIO to hwmon interface to be able to use lm-sensors
package.
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
Ethernet phys based on devicetree specification should be using
ethernet-phy@ node name instead of pure phy@.
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
ZynqMP based System controller is present on Versal boards. This patch is
aligning names with Versal to follow the spec.
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
DT binding was reviewed in Linux by commit b0b41af12a1b
("dt-bindings: memory: Add pl353 smc controller devicetree binding
information") that's why this fragment can be also added to U-Boot
repository.
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
As the PHY driver now handles the transitions of USB power domain, we
must add this information in the node of each PHY.
Also, the phy are expected in the "phys" property, not "usb-phys".
Also add the aliases for the USB ports on boards with more than a single
port.
Signed-off-by: Jean-Jacques Hiblot <jjhiblot@ti.com>
J721e SoM as a 64MB HyperFlash on board. Add pinmux and DT node for the
same.
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
Reviewed-by: Stefan Roese <sr@denx.de>
Add DT node for HyperBus Memory Controller in the FSS. On J721e, its not
possible to use OSPI0 and HBMC simultaneously as they are muxed within
the Flash Subsystem hence disable HBMC by default as keep OSPI enabled.
Bootloader will fixup DT when it detects HyperFlash instead of OSPI.
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
Reviewed-by: Stefan Roese <sr@denx.de>
Rename meson-g12a-u-boot.dtsi into meson-g12-common-u-boot.dtsi to
match the new DT architecture and add meson-sm1-sei610-u-boot.dtsi
to handle the U-Boot specific DT for graphics.
Signed-off-by: Neil Armstrong <narmstrong@baylibre.com>
In Linux meson-g12-common.dtsi was introduced as well as new g12b nodes
and headers, as dependencies of new meson-g12b-a311d-khadas-vim3.dts.
Copied from da0c9ea146cb ("Linux 5.4-rc2")
Signed-off-by: Andreas Färber <afaerber@suse.de>
Signed-off-by: Neil Armstrong <narmstrong@baylibre.com>
Like the meson-gx support, add the U-Boot specific bits in DT
to support graphics on G12A SoCs.
Signed-off-by: Neil Armstrong <narmstrong@baylibre.com>
Reviewed-by: Anatolij Gustschin <agust@denx.de>
-------------------
Travis: https://travis-ci.org/sbabic/u-boot-imx/builds/597498628
- logicpd pinmux
- i.MX7ULP: imx_ddr_size
- fixes Toradex i.MX6/i.MX7
- pico-imx7d
- tpc70 converted to DM
- New Board: meerkat96
- add HAB version command
- i.MX8 :
imx8: Jump from alias to OCRAM address at SPL init
imx8qm/qxp: Set SPL TEXT base to OCRAM base
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Merge tag 'u-boot-imx-20191014' of https://gitlab.denx.de/u-boot/custodians/u-boot-imx
u-boot-imx-20191014
-------------------
Travis: https://travis-ci.org/sbabic/u-boot-imx/builds/597498628
- logicpd pinmux
- i.MX7ULP: imx_ddr_size
- fixes Toradex i.MX6/i.MX7
- pico-imx7d
- tpc70 converted to DM
- New Board: meerkat96
- add HAB version command
- i.MX8 :
imx8: Jump from alias to OCRAM address at SPL init
imx8qm/qxp: Set SPL TEXT base to OCRAM base
The new class dsi host allows the management of the bridge DPI to DSI.
This bridge is embedded in the chipset mp1 (come from synopsys company).
Signed-off-by: Yannick Fertré <yannick.fertre@st.com>
The new class dsi host allows the management of the bridge DPI to DSI.
This bridge is embedded in the chipset mp1 (come from synopsys company).
Signed-off-by: Yannick Fertré <yannick.fertre@st.com>
This commit adds new file - imx6q-kp-u-boot.dtsi with a set of u-boot
specific properties for imx6q KP device.
Signed-off-by: Lukasz Majewski <lukma@denx.de>
With the 256KB of OCRAM available to SPL now, there should be
enough room to enable the pinmuxing in SPL from the device tree.
This patch enables SPL_PINCTRL et al and adds the serial and
usdhc pin mux references to the -u-boot.dtsi file so the pins can be
configured from the device tree.
Signed-off-by: Adam Ford <aford173@gmail.com>
Reviewed-by: Fabio Estevam <festevam@gmail.com>
Reviewed-by: Peng Fan <peng.fan@nxp.com>
Main uart0 is used as debug console by both R5SPL and A72 bootloader and
Linux. So mark it as shared device so that power-domain request is
successful by both cores.
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
AM335x-ICE boards contain the CDCE913 clock synthesizer, and their
reset crystal capacitance load value of 10pF is wrong leading into
lost packets in certain networking tests. Add DT data for this
device, and probe it from the board file to program the crystal
capacitance load value to 0pF to avoid any problems.
Signed-off-by: Tero Kristo <t-kristo@ti.com>
AM43xx-IDK boards contain the CDCE913 clock synthesizer, and their
reset crystal capacitance load value of 10pF is wrong leading into
lost packets in certain networking tests. Add DT data for this
device, and probe it from the board file to program the crystal
capacitance load value to 0pF to avoid any problems.
Signed-off-by: Tero Kristo <t-kristo@ti.com>
AM57xx-IDK boards contain the CDCE913 clock synthesizer, and their
reset crystal capacitance load value of 10pF is wrong leading into
lost packets in certain networking tests. Add DT data for this
device, and probe it from the board file to program the crystal
capacitance load value to 0pF to avoid any problems.
Signed-off-by: Tero Kristo <t-kristo@ti.com>
This follows the linux header rules to avoid conflict bitfields.
Tested-by: Frank Wunderlich <frank-w@public-files.de>
Signed-off-by: Ryder Lee <ryder.lee@mediatek.com>
Signed-off-by: Frank Wunderlich <frank-w@public-files.de>
This adds PCIe and its PHY nodes for MT7623.
Tested-by: Frank Wunderlich <frank-w@public-files.de>
Signed-off-by: Ryder Lee <ryder.lee@mediatek.com>
Signed-off-by: Frank Wunderlich <frank-w@public-files.de>
This commit add a spi-nor device in the bcm96850xref device tree.
Signed-off-by: Philippe Reynes <philippe.reynes@softathome.com>
Reviewed-by: Kursad Oney <kursad.oney@broadcom.com>
This commit add a hsspi controller in the bcm6858 device tree.
Signed-off-by: Philippe Reynes <philippe.reynes@softathome.com>
Reviewed-by: Kursad Oney <kursad.oney@broadcom.com>
This change adds a spi nor flash device to the bcm963158 board.
Signed-off-by: Kursad Oney <kursad.oney@broadcom.com>
Reviewed-by: Philippe Reynes <philippe.reynes@softathome.com>
This change adds the hsspi controller to the 63158 dtsi.
Signed-off-by: Kursad Oney <kursad.oney@broadcom.com>
Reviewed-by: Philippe Reynes <philippe.reynes@softathome.com>
The AM65x SoCs has a single dual-core Arm Cortex-R5F processor
subsystem/cluster (MCU_R5FSS0) within the MCU domain. This cluster
can be configured at boot time to be either run in a LockStep mode
or in an Asymmetric Multi Processing (AMP) fashion in Split-mode.
This subsystem has 64 KB each Tightly-Coupled Memory (TCM) internal
memories for each core split between two banks - ATCM and BTCM
(further interleaved into two banks). There are some IP integration
differences from standard Arm R5 clusters such as the absence of
an ACP port, presence of an additional TI-specific Region Address
Translater (RAT) module for translating 32-bit CPU addresses into
larger system bus addresses etc.
Add the DT node for the MCU domain R5F cluster/subsystem, the two
R5 cores are added as child nodes to the main cluster/subsystem node.
The cluster is configured to run in Split-mode by default, with the
ATCMs enabled to allow the R5 cores to execute code from DDR with
boot-strapping code from ATCM. The inter-processor communication
between the main A72 cores and these processors is achieved through
shared memory and Mailboxes.
Signed-off-by: Suman Anna <s-anna@ti.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
The J721E SoCs have a single TMS320C71x DSP Subsystem in the MAIN
voltage domain containing the next-generation C711 CPU core. The
subsystem has 32 KB of L1D configurable SRAM/Cache and 512 KB of
L2 configurable SRAM/Cache. This subsystem has a CMMU but is not
used currently. The inter-processor communication between the main
A72 cores and the C711 processor is achieved through shared memory
and a Mailbox. Add the DT node for this DSP processor sub-system
in the common k3-j721e-main.dtsi file.
Signed-off-by: Suman Anna <s-anna@ti.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
The J721E SoCs have two TMS320C66x DSP Core Subsystems (C66x CorePacs)
in the MAIN voltage domain, each with a C66x Fixed/Floating-Point DSP
Core, and 32 KB of L1P & L1D configurable SRAMs/Cache and an additional
288 KB of L2 configurable SRAM/Cache. These subsystems do not have
an MMU but contain a Region Address Translator (RAT) sub-module for
translating 32-bit processor addresses into larger bus addresses.
The inter-processor communication between the main A72 cores and
these processors is achieved through shared memory and Mailboxes.
Add the DT nodes for these DSP processor sub-systems in the common
k3-j721e-main.dtsi file.
Signed-off-by: Suman Anna <s-anna@ti.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
The J721E SoCs have 3 dual-core Arm Cortex-R5F processor (R5FSS)
subsystems/clusters. One R5F cluster (MCU_R5FSS0) is present within
the MCU domain, and the remaining two clusters are present in the
MAIN domain (MAIN_R5FSS0 & MAIN_R5FSS1). Each of these can be
configured at boot time to be either run in a LockStep mode or in
an Asymmetric Multi Processing (AMP) fashion in Split-mode. These
subsystems have 64 KB each Tightly-Coupled Memory (TCM) internal
memories for each core split between two banks - ATCM and BTCM
(further interleaved into two banks). There are some IP integration
differences from standard Arm R5 clusters such as the absence of
an ACP port, presence of an additional TI-specific Region Address
Translater (RAT) module for translating 32-bit CPU addresses into
larger system bus addresses etc.
Add the DT nodes for these two MAIN domain R5F cluster/subsystems,
the two R5 cores are each added as child nodes to the corresponding
main cluster node. Configure SS0 in split mode an SS1 in lockstep mode,
with the ATCMs enabled to allow the R5 cores to execute code from DDR
with boot-strapping code from ATCM.
Signed-off-by: Suman Anna <s-anna@ti.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
The J721E SoCs have 3 dual-core Arm Cortex-R5F processor (R5FSS)
subsystems/clusters. One R5F cluster (MCU_R5FSS0) is present within
the MCU domain, and the remaining two clusters are present in the
MAIN domain (MAIN_R5FSS0 & MAIN_R5FSS1). Each of these can be
configured at boot time to be either run in a LockStep mode or in
an Asymmetric Multi Processing (AMP) fashion in Split-mode. These
subsystems have 64 KB each Tightly-Coupled Memory (TCM) internal
memories for each core split between two banks - ATCM and BTCM
(further interleaved into two banks). There are some IP integration
differences from standard Arm R5 clusters such as the absence of
an ACP port, presence of an additional TI-specific Region Address
Translater (RAT) module for translating 32-bit CPU addresses into
larger system bus addresses etc.
Add the DT node for the MCU domain R5F cluster/subsystem, the two
R5 cores are added as child nodes to the main cluster/subsystem node.
The cluster is configured to run in LockStep mode by default, with the
ATCMs enabled to allow the R5 cores to execute code from DDR with
boot-strapping code from ATCM. The inter-processor communication
between the main A72 cores and these processors is achieved through
shared memory and Mailboxes.
Signed-off-by: Suman Anna <s-anna@ti.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
Although we currently use the MAIN_UART0 for R5 SPL console output there
are cases where we require access to the MCU_UART0 as well for example in
case of UART-based Y-Modem boot. To support these scenarios add related
DTS definitions to be able to use that UART early on.
Signed-off-by: Andreas Dannenberg <dannenberg@ti.com>
Pick minor changes from the downstream DT, disable MMC, add GMAC0 node
and adjust PHY skew settings for GMAC1.
Signed-off-by: Marek Vasut <marex@denx.de>
Cc: Silvio Fricke <silvio.fricke@softing.com>
Cc: Simon Goldschmidt <simon.k.r.goldschmidt@gmail.com>
The company Samtec was merged into Softing, migrate the board over to
the new name and update copyright headers.
Signed-off-by: Marek Vasut <marex@denx.de>
Cc: Silvio Fricke <silvio.fricke@softing.com>
Cc: Simon Goldschmidt <simon.k.r.goldschmidt@gmail.com>
Since convert dm_video, unused code introduced, so remove this
Signed-off-by: Joris Offouga <offougajoris@gmail.com>
Reviewed-by: Otavio Salvador <otavio@ossystems.com.br>
Import i.MX8MM pin func from Linux Kernel,
commit <0a8ad0ffa4d8> ("Merge tag 'for-linus-5.3-ofs1' of git://git.kernel.org/pub/scm/linux/kernel/git/hubcap/linux")
Signed-off-by: Peng Fan <peng.fan@nxp.com>
Import i.MX8MM dtsi from Linux Kernel,
commit <0a8ad0ffa4d8> ("Merge tag 'for-linus-5.3-ofs1' of git://git.kernel.org/pub/scm/linux/kernel/git/hubcap/linux")
Signed-off-by: Peng Fan <peng.fan@nxp.com>
Add support for the power domain controller that's used on the
i.MX8MQ. This will be needed to be able to power on the PCIe
controller. Bindings taken from Linux, driver implementation
taken from the i.MX8 power domain controller and adjusted for
the i.MX8M SoC.
Signed-off-by: Patrick Wildt <patrick@blueri.se>
After this change it is possible to use imx28-<board>-u-boot.dtsi with
the imx28-u-boot.dtsi explicitly included without breaking setup from
imx28-<board>.dts file.
The problem is that the imx28.dtsi included in a wrong place overrides the
changes made in imx28-<board>.dts. As a result some devices are "disabled"
in the final DTB.
Signed-off-by: Lukasz Majewski <lukma@denx.de>
This commit enables support for CONFIG_WDT in the U-Boot proper. Moreover,
the SYSRESET_WATCHDOG driver is used to support 'reset' command.
As SPL is not yet ready for DM conversion, the CONFIG_HW_WATCHDOG is
enabled for it. This allows the legacy SPL code to work properly.
Signed-off-by: Lukasz Majewski <lukma@denx.de>
Add the initial support for the pico-imx6 variants.
DDR initialization is based on the TechNexion's U-Boot code.
Signed-off-by: Fabio Estevam <festevam@gmail.com>
Signed-off-by: Fabio Berton <fabio.berton@ossystems.com.br>
Signed-off-by: Otavio Salvador <otavio@ossystems.com.br>