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Merge tag 'u-boot-at91-fixes-2023.10-a' of https://source.denx.de/u-boot/custodians/u-boot-at91
First set of u-boot-atmel fixes for the 2023.07 cycle:
This small fixes set includes the LTO configs for the boards that had
the SPL size up to the limit (sama5d2-based), such that more code can be
added. It also includes a fix for mmc non-removable.
If the device attached to the MMC bus is not removable, set force card-detect
bit to bypass card detection procedure, so card detection pin can be used for
other purposes.
It's also a workaround for SAMA5D2 who doesn't drive CMD if using GPIO for card
detection.
Signed-off-by: Zixun LI <zli@ogga.fr>
Reviewed-by: Eugen Hristev <eugen.hristev@collabora.com>
arm-none-linux-gnueabihf-ld.bfd: u-boot-spl section `__u_boot_list' will not fit in region `.sram'
arm-none-linux-gnueabihf-ld.bfd: region `.sram' overflowed by 100 bytes
SPL is at limit so to stop seeing above error in built, enable
link time optimizations CONFIG_LTO.
Signed-off-by: Eugen Hristev <eugen.hristev@collabora.com>
Tested-by: Mihai Sain <mihai.sain@microchip.com>
Adding just a tiny bit more code for sama5d2_icp_mmc leads to a SRAM
image overflow. Fix this by enabling LTO for this board, so that such
changes still can be made to the common U-Boot code.
Signed-off-by: Stefan Roese <sr@denx.de>
Cc: Pali Rohár <pali@kernel.org>
Tested-by: Mihai Sain <mihai.sain@microchip.com>
[eugen.hristev@microchip.com: restrict patch just to CONFIG_LTO]
Signed-off-by: Eugen Hristev <eugen.hristev@collabora.com>
The USB 3.0 driver xhci-mem.c requires CONFIG_SYS_CACHELINE_SIZE to be set.
Define the cache line size for QEMU on RISC-V to be 64 bytes.
Signed-off-by: Heinrich Schuchardt <heinrich.schuchardt@canonical.com>
Reviewed-by: Bin Meng <bmeng@tinylab.org>
Apply the trailing space changes in the guide document.
Signed-off-by: Chanho Park <chanho61.park@samsung.com>
Reviewed-by: Leo Yu-Chi Liang <ycliang@andestech.com>
Adds a trailing space to SYS_PROMPT to make it easier to distinguish
between commands and the prompt.
Signed-off-by: Chanho Park <chanho61.park@samsung.com>
Reviewed-by: Leo Yu-Chi Liang <ycliang@andestech.com>
The clock id needs to be changed to be consistent with Linux.
Signed-off-by: Xingyu Wu <xingyu.wu@starfivetech.com>
Signed-off-by: Hal Feng <hal.feng@starfivetech.com>
Reviewed-by: Torsten Duwe <duwe@suse.de>
Reviewed-by: Leo Yu-Chi Liang <ycliang@andestech.com>
Drop the PLL part in SYSCRG driver and separate to be a single
PLL driver of which the compatible is "starfive,jh7110-pll".
Signed-off-by: Xingyu Wu <xingyu.wu@starfivetech.com>
Signed-off-by: Hal Feng <hal.feng@starfivetech.com>
Reviewed-by: Torsten Duwe <duwe@suse.de>
Reviewed-by: Leo Yu-Chi Liang <ycliang@andestech.com>
Harts need to use per-hart stack before any function call, even if that
function is a simple one. When the callee uses stack for register save/
restore, especially RA, if nested call, concurrent access by multiple
harts on the same stack will cause data-race.
This patch sets up SP before `board_init_f_alloc_reserve`. A side effect
of this is that the memory layout has changed as the following:
+----------------+ +----------------+ <----- SPL_STACK/
| ...... | | hart 0 stack | SYS_INIT_SP_ADDR
| malloc_base | +----------------+
+----------------+ | hart 1 stack |
| GD | +----------------+ If not SMP, N=1
+----------------+ | ...... |
| hart 0 stack | +----------------+
+----------------+ ==> | hart N-1 stack|
| hart 1 stack | +----------------+
+----------------+ | ...... |
| ...... | | malloc_base |
+----------------+ +----------------+
| hart N-1 stack| | GD |
+----------------+ +----------------+
| | | |
Signed-off-by: Bo Gan <ganboing@gmail.com>
Cc: Rick Chen <rick@andestech.com>
Cc: Leo <ycliang@andestech.com>
Cc: Sean Anderson <seanga2@gmail.com>
Cc: Bin Meng <bmeng.cn@gmail.com>
Cc: Lukas Auer <lukas.auer@aisec.fraunhofer.de>
Reviewed-by: Rick Chen <rick@andestech.com>
Reviewed-by: Leo Yu-Chi Liang <ycliang@andestech.com>
Now that buildman has a requirements.txt file we need to make use of it.
Reviewed-by: Simon Glass <sjg@chromium.org>
[n-francis@ti.com: Adding missing command from .azure-pipelines.yml]
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
Signed-off-by: Tom Rini <trini@konsulko.com>
At this point, buildman requires a few different modules and so we need
a requirements.txt to track what modules are needed.
Cc: Simon Glass <sjg@chromium.org>
Cc: Neha Malcom Francis <n-francis@ti.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
Signed-off-by: Tom Rini <trini@konsulko.com>
Without this re-building will fail with an error when trying to create
the symlink for the second time with an already exists error.
Signed-off-by: Andrew Davis <afd@ti.com>
[n-francis@ti.com: Added support for test output dir and testcase]
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
Earlier documentation specified builds for generating bootloader images
using an external TI repository k3-image-gen and core-secdev-k3. Modify
this to using the binman flow so that user understands how to build the
final boot images.
Reviewed-by: Simon Glass <sjg@chromium.org>
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
Since binman is used to package bootloader images for all K3 devices, we
do not have to rely on the earlier methods to package them.
Scripts that were used to generate x509 certificate for tiboot3.bin and
generate tispl.bin, u-boot.img have been removed.
Reviewed-by: Simon Glass <sjg@chromium.org>
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
Move to using binman to generate tispl.bin which is used to generate the
final flash.bin bootloader for iot2050 boards.
Cc: Jan Kiszka <jan.kiszka@siemens.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
By providing entries in the binman node of the device tree, binman will
be able to find and package board config artifacts generated by
TIBoardConfig with sysfw.bin and generate the final image sysfw.itb.
It will also pick out the R5 SPL and sign it with the help of TI signing
entry and generate the final tiboot3.bin.
Entries for A72 build have been added to k3-j721e-binman.dtsi to
generate tispl.bin and u-boot.img.
Support has been added for both HS-SE(SR 1.1), HS-FS(SR 2.0) and GP images
In HS-SE, the encrypted system firmware binary must be signed along with
the signed certificate binary.
HS-SE:
* tiboot3-j721e_sr1_1-hs-evm.bin
* sysfw-j721e_sr1_1-hs-evm.itb
* tispl.bin
* u-boot.img
HS-FS:
* tiboot3-j721e_sr2-hs-fs-evm.bin
* sysfw-j721e_sr2-hs-fs-evm.itb
* tispl.bin
* u-boot.img
GP:
* tiboot3.bin -->tiboot3-j721e-gp-evm.bin
* sysfw.itb --> sysfw-j721e-gp-evm.itb
* tispl.bin_unsigned
* u-boot.img_unsigned
It is to be noted that the bootflow followed by J721E requires:
tiboot3.bin:
* R5 SPL
* R5 SPL dtbs
sysfw.itb:
* TIFS
* board-cfg
* pm-cfg
* sec-cfg
* rm-cfg
tispl.bin:
* DM
* ATF
* OP-TEE
* A72 SPL
* A72 SPL dtbs
u-boot.img:
* A72 U-Boot
* A72 U-Boot dtbs
Reviewed-by: Simon Glass <sjg@chromium.org>
[afd@ti.com: changed output binary names appropriately]
Signed-off-by: Andrew Davis <afd@ti.com>
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
Schema file in YAML must be provided in board/ti/common for validating
input config files and packaging system firmware. The schema includes
entries for rm-cfg, board-cfg, pm-cfg and sec-cfg.
Board config files must be provided in board/ti/<devicename> in YAML.
These can then be consumed for generation of binaries to package system
firmware. Added YAML configs for J721E in particular.
Signed-off-by: Tarun Sahu <t-sahu@ti.com>
[n-francis@ti.com: prepared patch for upstreaming]
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
Board config binary artifacts must be generated to be used by binman to
package sysfw.itb and tiboot3.bin for all K3 devices.
For devices that follow combined flow, these board configuration
binaries must again be packaged into a combined board configuration
blobs to be used by binman to package tiboot3.bin.
Add common k3-binman.dtsi to generate all the board configuration
binaries needed.
Also add custMpk.pem and ti-degenerate-key.pem needed for signing GP and
HS bootloader images common to all K3 devices.
Reviewed-by: Simon Glass <sjg@chromium.org>
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
The ti-secure entry contains certificate for binaries that will be
loaded or booted by system firmware whereas the ti-secure-rom entry
contains certificate for binaries that will be booted by ROM. Support
for both these types of certificates is necessary for booting of K3
devices.
Reviewed-by: Simon Glass <sjg@chromium.org>
[vigneshr@ti.com: fixed inconsist cert generation by multiple packing]
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
The ti-board-config entry loads and validates a given YAML config file
against a given schema, and generates the board config binary. K3
devices require these binaries to be packed into the final system
firmware images.
Reviewed-by: Simon Glass <sjg@chromium.org>
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
Using `default y` will not select BMP when CMD_BMP has been enabled, if
it was already configured.
By using `select`, if `CMD_BMP` is turned on, it will force the presence
of `BMP`.
Fixes: 072b0e16c4 ("common: Kconfig: Add BMP configs")
Signed-off-by: Samuel Dionne-Riel <samuel@dionne-riel.com>
Signed-off-by: Nikhil M Jain <n-jain1@ti.com>
To understand usage of DDR in A53 SPL stage, add a table showing region
and space used by major components of SPL.
Signed-off-by: Nikhil M Jain <n-jain1@ti.com>
Reviewed-by: Tom Rini <trini@konsulko.com>
Use config SPL_VIDEO_REMOVE to remove video driver at SPL stage before
jumping to next stage, in place of CONFIG_SPL_VIDEO, to allow user to
remove video if required.
Signed-off-by: Nikhil M Jain <n-jain1@ti.com>
Reviewed-by: Devarsh Thakkar <devarsht@ti.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
This is required since user may want to either call the remove method
of video driver and reset the display or not call the remove method
to continue displaying until next stage.
Signed-off-by: Nikhil M Jain <n-jain1@ti.com>
Reviewed-by: Devarsh Thakkar <devarsht@ti.com>
Reviewed-by: Tom Rini <trini@konsulko.com>
U-boot proper can use frame buffer address passed from SPL to reserve
the memory area used by framebuffer set in SPL so that splash image
set in SPL continues to get displayed while u-boot proper is running.
Put the framebuffer address and size in a bloblist to make them
available at u-boot proper, if in u-boot proper CONFIG_VIDEO is defined.
Signed-off-by: Nikhil M Jain <n-jain1@ti.com>
Reviewed-by: Devarsh Thakkar <devarsht@ti.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
Add method to reserve video framebuffer information using blob,
received from previous stage.
Signed-off-by: Nikhil M Jain <n-jain1@ti.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
Use spl_dcache_enable, in place of setup_dram, arch_reserve_mmu to set
up pagetable, initialise DRAM and enable Dcache to avoid multiple
function calls.
Check for CONFIG_SPL_VIDEO in place of CONFIG_SPL_VIDEO_TIDSS to prevent
any build failure in case video config is not defined and video related
functions are called.
Check for CONFIG_SPL_SPLASH_SCREEN and CONFIG_SPL_BMP before calling
splash_display to avoid compilation failure.
Signed-off-by: Nikhil M Jain <n-jain1@ti.com>
In spl_dcache_enable after setting up page table, set gd->relocaddr
pointer to tlb_addr, to get next location to reserve memory. Align
tlb_addr with 64KB address.
Signed-off-by: Nikhil M Jain <n-jain1@ti.com>
Reviewed-by: Devarsh Thakkar <devarsht@ti.com>
At SPL stage when stack is relocated, the stack pointer needs to be
updated, the stack pointer may point to stack in on chip memory even
though stack is relocated.
Signed-off-by: Nikhil M Jain <n-jain1@ti.com>
Reviewed-by: Tom Rini <trini@konsulko.com>
There is little need to print the devstat information or when we exit a
function during a typical boot. Remove them to reduce the noise during
typical operation
Signed-off-by: Bryan Brattlof <bb@ti.com>
