Commit graph

16 commits

Author SHA1 Message Date
Aswath Govindraju
a94d70ad37 arm: dts: k3-j721e: Add support for multilink PCIe + QSGMII
Add support for QSGMII multilink configuration.

Signed-off-by: Aswath Govindraju <a-govindraju@ti.com>
2022-02-08 11:00:04 -05:00
Tom Rini
fa09b12dc5 arm: ti: k3: Resync dts files and bindings with Linux Kernel v5.14
This resyncs the dts files for all of the currently in-tree K3
platforms, along with relevant bindings, with the v5.14 Linux Kernel
release.  Of note are that the main-navss/mcu-navss nodes were renamed
to main_navss / mcu_navss and so the u-boot.dtsi files needed to be
updated to match.

Tested on j721e_evm and am65x_evm.

Signed-off-by: Tom Rini <trini@konsulko.com>
2021-10-03 11:59:22 -04:00
Lokesh Vutla
70e167495a arm: dts: k3-j721e: Sync Linux v5.11-rc6 dts into U-Boot
Sync all J721e related v5.11-rc6 Linux kernel dts into U-Boot.
HBMC nodes are not yet added in Linux kernel yet but were added
in U-Boot. In order to avoid any regressions, hbmc nodes are kept
intact. These will be added in kernel in future.

Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
2021-02-04 20:37:57 +05:30
Faiz Abbas
f0a496a3d2 arm: dts: k3-j721e-common-proc-board: Add support for UHS modes for SD card
Add support for regulators to power cycle and switch IO voltage to the
SD card. This enables support for UHS modes.

Signed-off-by: Faiz Abbas <faiz_abbas@ti.com>
Signed-off-by: Aswath Govindraju <a-govindraju@ti.com>
2021-02-04 20:37:57 +05:30
Vignesh Raghavendra
224d7fe263 ARM: dts: k3-j721e: Add OSPI DT nodes
Add OSPI DT nodes to enable OSPI at U-Boot prompt and also to support
OSPI boot.

Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
2020-03-03 13:08:13 +05:30
Vignesh Raghavendra
18402a104e arm: dts: k3-j721e-common-proc-board: Add I2C GPIO expander
Add I2C GPIO expander required to power cycle MMC/SD

Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
2020-02-04 09:07:24 +05:30
Andreas Dannenberg
c44fb27af8 arm64: dts: k3-j721e-common-proc-board: Fully enable wkup_i2c0 use
Make the wkup_i2c0 module usable across all stages of U-Boot by adding
the needed definitions including the associated pinmux definitions.

Signed-off-by: Andreas Dannenberg <dannenberg@ti.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
2020-01-20 10:10:28 +05:30
Faiz Abbas
ccc855e9d9 arm: dts: k3-j721e-common-proc-board: Add pinmux for SD card
Add pinmux for sdhci1 node connected to the SD card.

Signed-off-by: Faiz Abbas <faiz_abbas@ti.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
2020-01-20 10:10:28 +05:30
Faiz Abbas
2e6e3a4e8c arm: dts: k3-j721e-common-proc-board: Remove voltage-ranges from sdhci nodes
voltage-ranges properties are NOP. Remove them.

Signed-off-by: Faiz Abbas <faiz_abbas@ti.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
2020-01-20 10:10:28 +05:30
Vignesh Raghavendra
5aeab3bf5e arm: dts: k3-j721e: Add DT nodes for USB
J721e has two instances of Cadence USB3 controller. Add DT nodes for the
same. USB0 is configured to device mode and USB1 is configured to host
mode. For now only high speed mode is supported.

Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
2020-01-20 10:10:28 +05:30
Lokesh Vutla
fbbcb1e020 arm: dts: k3-j721e-common-proc-board: Mark main_uart0 as shared device
Main uart0 is used as debug console by both R5SPL and A72 bootloader and
Linux. So mark it as shared device so that power-domain request is
successful by both cores.

Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
2019-10-11 13:32:39 -04:00
Lokesh Vutla
1b846fc24d arm: dts: k3-j721e-main: Add C71x DSP node
The J721E SoCs have a single TMS320C71x DSP Subsystem in the MAIN
voltage domain containing the next-generation C711 CPU core. The
subsystem has 32 KB of L1D configurable SRAM/Cache and 512 KB of
L2 configurable SRAM/Cache. This subsystem has a CMMU but is not
used currently. The inter-processor communication between the main
A72 cores and the C711 processor is achieved through shared memory
and a Mailbox. Add the DT node for this DSP processor sub-system
in the common k3-j721e-main.dtsi file.

Signed-off-by: Suman Anna <s-anna@ti.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
2019-10-11 10:07:35 -04:00
Lokesh Vutla
293e39780d arm: dts: k3-j721e-main: Add C66x DSP nodes
The J721E SoCs have two TMS320C66x DSP Core Subsystems (C66x CorePacs)
in the MAIN voltage domain, each with a C66x Fixed/Floating-Point DSP
Core, and 32 KB of L1P & L1D configurable SRAMs/Cache and an additional
288 KB of L2 configurable SRAM/Cache. These subsystems do not have
an MMU but contain a Region Address Translator (RAT) sub-module for
translating 32-bit processor addresses into larger bus addresses.
The inter-processor communication between the main A72 cores and
these processors is achieved through shared memory and Mailboxes.
Add the DT nodes for these DSP processor sub-systems in the common
k3-j721e-main.dtsi file.

Signed-off-by: Suman Anna <s-anna@ti.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
2019-10-11 10:07:35 -04:00
Lokesh Vutla
55f8eb3169 arm: dts: k3-j721e-main: Add MAIN domain R5F cluster nodes
The J721E SoCs have 3 dual-core Arm Cortex-R5F processor (R5FSS)
subsystems/clusters. One R5F cluster (MCU_R5FSS0) is present within
the MCU domain, and the remaining two clusters are present in the
MAIN domain (MAIN_R5FSS0 & MAIN_R5FSS1). Each of these can be
configured at boot time to be either run in a LockStep mode or in
an Asymmetric Multi Processing (AMP) fashion in Split-mode. These
subsystems have 64 KB each Tightly-Coupled Memory (TCM) internal
memories for each core split between two banks - ATCM and BTCM
(further interleaved into two banks). There are some IP integration
differences from standard Arm R5 clusters such as the absence of
an ACP port, presence of an additional TI-specific Region Address
Translater (RAT) module for translating 32-bit CPU addresses into
larger system bus addresses etc.

Add the DT nodes for these two MAIN domain R5F cluster/subsystems,
the two R5 cores are each added as child nodes to the corresponding
main cluster node. Configure SS0 in split mode an SS1 in lockstep mode,
with the ATCMs enabled to allow the R5 cores to execute code from DDR
with boot-strapping code from ATCM.

Signed-off-by: Suman Anna <s-anna@ti.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
2019-10-11 10:07:35 -04:00
Lokesh Vutla
b9f035e9c8 arm: dts: k3-j721e-mcu: Add MCU domain R5F cluster node
The J721E SoCs have 3 dual-core Arm Cortex-R5F processor (R5FSS)
subsystems/clusters. One R5F cluster (MCU_R5FSS0) is present within
the MCU domain, and the remaining two clusters are present in the
MAIN domain (MAIN_R5FSS0 & MAIN_R5FSS1). Each of these can be
configured at boot time to be either run in a LockStep mode or in
an Asymmetric Multi Processing (AMP) fashion in Split-mode. These
subsystems have 64 KB each Tightly-Coupled Memory (TCM) internal
memories for each core split between two banks - ATCM and BTCM
(further interleaved into two banks). There are some IP integration
differences from standard Arm R5 clusters such as the absence of
an ACP port, presence of an additional TI-specific Region Address
Translater (RAT) module for translating 32-bit CPU addresses into
larger system bus addresses etc.

Add the DT node for the MCU domain R5F cluster/subsystem, the two
R5 cores are added as child nodes to the main cluster/subsystem node.
The cluster is configured to run in LockStep mode by default, with the
ATCMs enabled to allow the R5 cores to execute code from DDR with
boot-strapping code from ATCM. The inter-processor communication
between the main A72 cores and these processors is achieved through
shared memory and Mailboxes.

Signed-off-by: Suman Anna <s-anna@ti.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
2019-10-11 10:07:34 -04:00
Lokesh Vutla
9a5e553cb4 arm: dts: k3-j721e: Add initial support for common processor board
Common Processor board is the baseboard that has most of the actual connectors,
power supply etc. A SOM (System on Module) is plugged on to the common
processor board and this contains the SoC, PMIC, DDR and basic highspeed
components necessary for functionality. Add initial dt support for this
common processor board.

Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
2019-07-26 21:49:29 -04:00