Explain block maps by going through two common use-cases.
Signed-off-by: Tobias Waldekranz <tobias@waldekranz.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
Verify that:
- Block maps can be created and destroyed
- Mappings aren't allowed to overlap
- Multiple mappings can be attached and be read/written from/to
Signed-off-by: Tobias Waldekranz <tobias@waldekranz.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
Add a frontend for the blkmap subsystem. In addition to the common
block device operations, this allows users to create and destroy
devices, and map in memory and slices of other block devices.
With that we support two primary use-cases:
- Being able to "distro boot" from a RAM disk. I.e., from an image
where the kernel is stored in /boot of some filesystem supported
by U-Boot.
- Accessing filesystems not located on exact partition boundaries,
e.g. when a filesystem image is wrapped in an FIT image and stored
in a disk partition.
Signed-off-by: Tobias Waldekranz <tobias@waldekranz.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
Allow a slice of an existing block device to be mapped to a
blkmap. This means that filesystems that are not stored at exact
partition boundaries can be accessed by remapping a slice of the
existing device to a blkmap device.
Signed-off-by: Tobias Waldekranz <tobias@waldekranz.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
Allow a slice of RAM to be mapped to a blkmap. This means that RAM can
now be accessed as if it was a block device, meaning that existing
filesystem drivers can now be used to access ramdisks.
Signed-off-by: Tobias Waldekranz <tobias@waldekranz.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
blkmaps are loosely modeled on Linux's device mapper subsystem. The
basic idea is that you can create virtual block devices whose blocks
can be backed by a plethora of sources that are user configurable.
This change just adds the basic infrastructure for creating and
removing blkmap devices. Subsequent changes will extend this to add
support for actual mappings.
Signed-off-by: Tobias Waldekranz <tobias@waldekranz.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
Ensure that the memory destination/source addresses of block
read/write operations are mapped in before access. Currently, this is
only needed on sandbox builds.
Signed-off-by: Tobias Waldekranz <tobias@waldekranz.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
Update the script loading code to recognize when script data is stored
externally from the FIT metadata (i.e., built with `mkimage -E`).
Signed-off-by: Tobias Waldekranz <tobias@waldekranz.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
mkbootimg tool is part of the Android project and it is
used to pack Android boot images such as boot image
and vendor_boot image.
Use the following command to run mkbootimg:
$ python3 -m mkbootimg
Add mkbootimg to the docker file
Signed-off-by: Safae Ouajih <souajih@baylibre.com>
Tested-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
test_abootimg is extended to include the testing of boot images
version 4. For this, boot.img and vendor_boot.img have been
generated using mkbootimg tool with setting the header
version to 4.
This tests:
- Getting the header version using abootimg
- Extracting the load address of the dtb
- Extracting the dtb start address in RAM
Running test:
$ ./test/py/test.py --bd sandbox --build -k test_abootimg
Signed-off-by: Safae Ouajih <souajih@baylibre.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
Tested-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
Update the Android documentation to describe version 3 and 4 of boot
image header.
Signed-off-by: Safae Ouajih <souajih@baylibre.com>
Reviewed-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
Tested-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
Enable the support for boot image header version 3 and 4
using abootimg command.
In order to use version 3 or 4:
1- Vendor boot image address should be given to abootimg cmd.
abootimg addr $1 $vendor_boot_load_addr
2- "ramdisk_addr_r" env variable (ramdisk address) should be set to host
the ramdisk : generic ramdisk + vendor ramdisk
Replace "struct andr_boot_img_hdr_v0*" by "void *" in
some functions since v3 and v4 are now supported as well.
Signed-off-by: Safae Ouajih <souajih@baylibre.com>
Reviewed-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
Tested-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
With vendor boot image introduced in version 3 and 4 of boot
image header, boot information is located in both boot image
and vendor boot image.
Flashing zImage is not supported for version 3 and 4 since this
requires updating vendor boot image and/or generating a new image.
Print an error message when the boot image header version is
greater than 2.
Signed-off-by: Safae Ouajih <souajih@baylibre.com>
Reviewed-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
Tested-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
Add support for boot image version 3 and 4 in
android_image_get_dtb_img_addr().
Since the dtb is now included in vendor_boot image
instead of boot image, extract the dtb address from
vendor_boot image when a v3 or v4 is used.
Signed-off-by: Safae Ouajih <souajih@baylibre.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
Reviewed-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
Tested-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
In version 3 and 4 of boot image header, the vendor specific
command line are located in vendor boot image. Thus, use
extra command line to add those cmd to bootargs.
Signed-off-by: Safae Ouajih <souajih@baylibre.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
Reviewed-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
Tested-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
Version 3 and 4 of boot image header introduced
vendor boot ramdisk: Please check include/android_image.h
for details.
The ramdisk is now split into a generic ramdisk in boot image
and a vendor ramdisk in vendor boot image.
Support the new vendor ramdisk.
Signed-off-by: Safae Ouajih <souajih@baylibre.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
Reviewed-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
Tested-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
Since boot image header version 3 and 4 introduced vendor boot image,
use the following functions to fill the generic android
structure : andr_image_data:
- android_boot_image_v3_v4_parse_hdr()
- android_vendor_boot_image_v3_v4_parse_hdr()
Update android_image_get_data() to support v3 and v4
Signed-off-by: Safae Ouajih <souajih@baylibre.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
Reviewed-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
Tested-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
Introduce vendor boot image for version 3 and 4 of boot image header.
The vendor boot image will hold extra information about kernel, dtb
and ramdisk.
This is done to prepare for boot image version 3 and 4 support.
Signed-off-by: Safae Ouajih <souajih@baylibre.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
Reviewed-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
Tested-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
android_image_get_dtbo() is used to get recovery DTBO via abootimg cmd.
This is not supported in boot image header v3 and v4. Thus, print an
error message when v1,v2 header version are not used.
Signed-off-by: Safae Ouajih <souajih@baylibre.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
Reviewed-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
Tested-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
Content print is not supported for version 3 and 4 of boot image header.
Thus, only print that content when v2 is used.
Update android_print_contents() to print an error message
when trying to print boot image header version 3 or 4 content.
Signed-off-by: Safae Ouajih <souajih@baylibre.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
Reviewed-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
Tested-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
Move from andr_boot_img_hdr_v0 to andr_image_data
structure to prepare for boot image header
version 3 and 4.
Signed-off-by: Safae Ouajih <souajih@baylibre.com>
Tested-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
andr_image_data structure is used as a global representation of
boot image header structure. Introduce this new structure to
support all boot header versions : v0,v1.v2.v3.v4 and to support
v3 and v4 while maitaining support for v0,v1,v2.
The need of using andr_image_data comes from the change of header
structure in both version 3 and 4.
Rework android_image_get_kcomp() to support this new struct.
Signed-off-by: Safae Ouajih <souajih@baylibre.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
Reviewed-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
Tested-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
With the new vendor boot image introduced in versions 3 and 4
of boot image header, the header check must be done for both boot
image and vendor boot image. Thus, replace android_image_check_header()
by is_android_boot_image_header() to only refer to boot image header check.
Signed-off-by: Safae Ouajih <souajih@baylibre.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
Reviewed-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
Tested-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
Vendor boot image is introduced in boot image header
version 3 and 4. Please check [1] for more details.
To prepare for boot image v3/v4 support, allow the abootimg command
to store the vendor_boot image address.
Full support for this new format will be done in a future patch.
Link:[1] https://source.android.com/docs/core/architecture/bootloader/partitions/vendor-boot-partitions
Signed-off-by: Safae Ouajih <souajih@baylibre.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
Reviewed-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
Tested-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
Android introduced boot header version 3 or 4.
The header structure change with version 3 and 4 to support
the new updates such as:
- Introducing Vendor boot image: with a vendor ramdisk
- Bootconfig feature (v4)
Change andr_img_hdr struct name to maintain support for version v0,
v1 and v2 while introducing version 3 and 4.
Signed-off-by: Safae Ouajih <souajih@baylibre.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
Reviewed-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
Tested-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
- Update our CI to use clang-16 for tests. This also changes slightly
how we do linker lists so that we don't rely on undefined behavior
that lead to clang-15 and later failing to work (and in some cases
seemingly, earlier versions of clang would sometimes fail).
As this is now the stable release, move to using that now for our tests.
Signed-off-by: Tom Rini <trini@konsulko.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
Per the GCC bug listed below, the way we do linker lists is relying on
undefined behavior that seems to work in gcc, but doesn't always work in
clang. Andrew suggests rewriting our start/end macros in a different way
(as implemented here, from what he said in comment 1) to avoid these
problems.
Reported-by: AdityaK <appujee@google.com>
Suggested-by: Andrew Pinski <apinski@marvell.com>
Link: https://gcc.gnu.org/bugzilla/show_bug.cgi?id=108915
Signed-off-by: Tom Rini <trini@konsulko.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
Reviewed-by: Andrew Pinski <apinski@marvell.com>
In order to prepare for slight size growth due to reworking linker list
support, enable LTO here to save more space again.
Signed-off-by: Tom Rini <trini@konsulko.com>
Reviewed-by: Heiko Schocher <hs@denx.de>
Given the number of jobs in CI we have which use python and pip install
packages, we should do this once in the Dockerfile, in order to populate
the cache. We let each job continue to create and use the virtual
environments they need to facilitate making updates to these
environments easier.
Signed-off-by: Tom Rini <trini@konsulko.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
In order to better make use of pip caches, and also for better overall
consistency, we should use the same versions of packages in each of our
python requirements files. Update pytest to use the newer versions of
packages we use in sphinx builds.
Signed-off-by: Tom Rini <trini@konsulko.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
Beacon Embedded has an i.MX8M Plus development kit which consists
of a SOM + baseboard. The SOM includes Bluetooth, WiFi, QSPI, eMMC,
and one Ethernet PHY. The baseboard includes audio, HDMI, USB-C Dual
Role port, USB Hub with five ports, a PCIe slot, and a second Ethernet
PHY. The device trees are already queued for inclusion in Linux 6.3.
Signed-off-by: Adam Ford <aford173@gmail.com>
Reviewed-by: Tom Rini <trini@konsulko.com>
Add support for Data Modul i.MX8M Plus eDM SBC board. This is an
evaluation board for various custom display units. Currently
supported are serial console, ethernet, eMMC, SD, SPI NOR, USB.
Signed-off-by: Marek Vasut <marex@denx.de>
Add WDT reboot bindings on DH i.MX6 DHSOM to permit the platform
to reboot via WDT in U-Boot. These are custom U-Boot bindings,
hence they are placed in -u-boot.dtsi .
Reviewed-by: Fabio Estevam <festevam@denx.de>
Signed-off-by: Marek Vasut <marex@denx.de>
change prints to show which DDR configuration (single/dual rank) is used
Signed-off-by: Emanuele Ghidoli <emanuele.ghidoli@toradex.com>
Signed-off-by: Marcel Ziswiler <marcel.ziswiler@toradex.com>
Deduplicate similar DDRC configurations and LPDDR4 training patterns
by patching a single configuration.
The aim is to reduce the SPL memory footprint and simplify maintenance
of lpddr4_timing.c
Signed-off-by: Emanuele Ghidoli <emanuele.ghidoli@toradex.com>
Signed-off-by: Marcel Ziswiler <marcel.ziswiler@toradex.com>
Update LPDDR4 configuration and training using updated spreadsheet and
tools from NXP using data from previous spreadsheet and verified
toward datasheet:
- MX8M_Plus_LPDDR4_RPA_v9.xlsx
- mscale_ddr_tool_v3.30.exe
From:
https://community.nxp.com/t5/i-MX-Processors-Knowledge-Base/i-MX-8M-Family-DDR-Tool-Release/ta-p/1104467
Some register values differ due to these fixes/modifications:
- corrected calculation of T_CKPDX parameter (equal to tCKCKEH for LPDDR4)
- corrected ECC related items, none of which affect normal operation
when ECC is not enabled
- corrected formula for calculation of tRTP in cell D122
Signed-off-by: Emanuele Ghidoli <emanuele.ghidoli@toradex.com>
Signed-off-by: Marcel Ziswiler <marcel.ziswiler@toradex.com>
Change tRFCmin (tRFCab) from 280 ns to 380 ns to be compliant with
current and futures memories.
Fixes: 2bc2f817ce ("board: toradex: add verdin imx8m plus support")
Signed-off-by: Emanuele Ghidoli <emanuele.ghidoli@toradex.com>
Signed-off-by: Marcel Ziswiler <marcel.ziswiler@toradex.com>
Add support to Verdin IMX8MP V1.1B SKU which uses
MT53E1G32D2FW-046 WT:B memory.
Compared to the 8 GB memory (MT53E2G32D4NQ-046 WT:A) used on
Verdin IMX8MP V1.0A it has 16 row addresses instead of 17.
In fact, the new memory, is a 2 GB/rank memory. The 8 GB memory is a
4 GB/rank memory.
Manually tweaking Host Interface addresses vs LPDDR4 signals mapping it
is possible to have a single configuration working with both memories:
- Old configuration: HIF bit 30 -> rank, HIF bit 29 -> Row 16
- New configuration: HIF bit 29 -> rank, HIF bit 30 -> Row 16
With this change the memory space from the host processor is contiguous
for both the configurations and the correct memory size is computed
using get_ram_size() at runtime.
Support for single rank memories still works thanks to the fact
dual ranks training fails (ddr_init->ddr_cfg_phy) toward single rank
memories.
Signed-off-by: Emanuele Ghidoli <emanuele.ghidoli@toradex.com>
Signed-off-by: Marcel Ziswiler <marcel.ziswiler@toradex.com>
U-Boot can be booted from NAND without SPL by prepending the DCD header to
the actual U-Boot binary. However this requires prepending 1024 bytes to
u-boot.imx (DCD + u-boot.bin).
There is already a similar target to build spl/u-boot-nand-spl.imx, add the
same option for no-SPL boot.
Tested on i.MX6ULL.
The resulting layout of u-boot-nand.imx is:
- Offset 0x0000 (0 KiB): padding
- Offset 0x0400 (1 KiB): DCD header
- Offset 0x1000 (4 KiB): u-boot.bin
Signed-off-by: Luca Ceresoli <luca.ceresoli@bootlin.com>
Enable SDP protocol support in SPL for DH i.MX6 DHSOM, now that those
components fit into the SPL due to LTO.
To start U-Boot via SDP upload on i.MX6 DHSOM based board, proceed as follows:
- Compile imx_usb [1] .
- Power off the i.MX6 DHSOM based board.
- Connect both USB-serial console and USB-OTG miniB ports to host PC.
- Switch board to USB boot mode.
- Power on the board.
- Verify using '$ dmesg' that a new device has been detected as follows:
New USB device found, idVendor=15a2, idProduct=0054, bcdDevice= 0.01
New USB device strings: Mfr=1, Product=2, SerialNumber=0
Product: SE Blank ARIK
Manufacturer: Freescale SemiConductor Inc
- Upload U-Boot SPL:
$ imx_usb u-boot-with-spl.imx
- Wait for SPL to come up, the following print ought to be the last on
UART console:
SDP: handle requests...
- Upload U-Boot proper:
$ imx_usb u-boot.img
[1] https://github.com/boundarydevices/imx_usb_loader.git
Signed-off-by: Marek Vasut <marex@denx.de>
