J721e has two instances of Cadence USB3 controller. Add DT nodes for the
same. USB0 is configured to device mode and USB1 is configured to host
mode. For now only high speed mode is supported.
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
Main uart0 is used as debug console by both R5SPL and A72 bootloader and
Linux. So mark it as shared device so that power-domain request is
successful by both cores.
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
The J721E SoCs have a single TMS320C71x DSP Subsystem in the MAIN
voltage domain containing the next-generation C711 CPU core. The
subsystem has 32 KB of L1D configurable SRAM/Cache and 512 KB of
L2 configurable SRAM/Cache. This subsystem has a CMMU but is not
used currently. The inter-processor communication between the main
A72 cores and the C711 processor is achieved through shared memory
and a Mailbox. Add the DT node for this DSP processor sub-system
in the common k3-j721e-main.dtsi file.
Signed-off-by: Suman Anna <s-anna@ti.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
The J721E SoCs have two TMS320C66x DSP Core Subsystems (C66x CorePacs)
in the MAIN voltage domain, each with a C66x Fixed/Floating-Point DSP
Core, and 32 KB of L1P & L1D configurable SRAMs/Cache and an additional
288 KB of L2 configurable SRAM/Cache. These subsystems do not have
an MMU but contain a Region Address Translator (RAT) sub-module for
translating 32-bit processor addresses into larger bus addresses.
The inter-processor communication between the main A72 cores and
these processors is achieved through shared memory and Mailboxes.
Add the DT nodes for these DSP processor sub-systems in the common
k3-j721e-main.dtsi file.
Signed-off-by: Suman Anna <s-anna@ti.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
The J721E SoCs have 3 dual-core Arm Cortex-R5F processor (R5FSS)
subsystems/clusters. One R5F cluster (MCU_R5FSS0) is present within
the MCU domain, and the remaining two clusters are present in the
MAIN domain (MAIN_R5FSS0 & MAIN_R5FSS1). Each of these can be
configured at boot time to be either run in a LockStep mode or in
an Asymmetric Multi Processing (AMP) fashion in Split-mode. These
subsystems have 64 KB each Tightly-Coupled Memory (TCM) internal
memories for each core split between two banks - ATCM and BTCM
(further interleaved into two banks). There are some IP integration
differences from standard Arm R5 clusters such as the absence of
an ACP port, presence of an additional TI-specific Region Address
Translater (RAT) module for translating 32-bit CPU addresses into
larger system bus addresses etc.
Add the DT nodes for these two MAIN domain R5F cluster/subsystems,
the two R5 cores are each added as child nodes to the corresponding
main cluster node. Configure SS0 in split mode an SS1 in lockstep mode,
with the ATCMs enabled to allow the R5 cores to execute code from DDR
with boot-strapping code from ATCM.
Signed-off-by: Suman Anna <s-anna@ti.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
The J721E SoCs have 3 dual-core Arm Cortex-R5F processor (R5FSS)
subsystems/clusters. One R5F cluster (MCU_R5FSS0) is present within
the MCU domain, and the remaining two clusters are present in the
MAIN domain (MAIN_R5FSS0 & MAIN_R5FSS1). Each of these can be
configured at boot time to be either run in a LockStep mode or in
an Asymmetric Multi Processing (AMP) fashion in Split-mode. These
subsystems have 64 KB each Tightly-Coupled Memory (TCM) internal
memories for each core split between two banks - ATCM and BTCM
(further interleaved into two banks). There are some IP integration
differences from standard Arm R5 clusters such as the absence of
an ACP port, presence of an additional TI-specific Region Address
Translater (RAT) module for translating 32-bit CPU addresses into
larger system bus addresses etc.
Add the DT node for the MCU domain R5F cluster/subsystem, the two
R5 cores are added as child nodes to the main cluster/subsystem node.
The cluster is configured to run in LockStep mode by default, with the
ATCMs enabled to allow the R5 cores to execute code from DDR with
boot-strapping code from ATCM. The inter-processor communication
between the main A72 cores and these processors is achieved through
shared memory and Mailboxes.
Signed-off-by: Suman Anna <s-anna@ti.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
Common Processor board is the baseboard that has most of the actual connectors,
power supply etc. A SOM (System on Module) is plugged on to the common
processor board and this contains the SoC, PMIC, DDR and basic highspeed
components necessary for functionality. Add initial dt support for this
common processor board.
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
