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4cbc16ceb2
Hi-end qualcomm chip, introduced in late 2017. Mostly used in flagship phones and tablets of 2018. Features: - arm64 arch - total of 8 Kryo 385 Gold / Silver cores - Hexagon 685 DSP - Adreno 630 GPU Tested only as second-stage bootloader. Signed-off-by: Dzmitry Sankouski <dsankouski@gmail.com> Cc: Ramon Fried <rfried.dev@gmail.com> Cc: Tom Rini <trini@konsulko.com> Cc: Stephan Gerhold <stephan@gerhold.net>
31 lines
738 B
C
31 lines
738 B
C
// SPDX-License-Identifier: GPL-2.0+
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/*
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* Qualcomm SDM845 memory map
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*
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* (C) Copyright 2021 Dzmitry Sankouski <dsankousk@gmail.com>
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*/
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#include <common.h>
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#include <asm/armv8/mmu.h>
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static struct mm_region sdm845_mem_map[] = {
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{
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.virt = 0x0UL, /* Peripheral block */
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.phys = 0x0UL, /* Peripheral block */
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.size = 0x10000000UL,
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.attrs = PTE_BLOCK_MEMTYPE(MT_DEVICE_NGNRNE) |
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PTE_BLOCK_NON_SHARE |
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PTE_BLOCK_PXN | PTE_BLOCK_UXN
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}, {
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.virt = 0x80000000UL, /* DDR */
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.phys = 0x80000000UL, /* DDR */
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.size = 0x200000000UL, /* 8GiB - maximum allowed memory */
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.attrs = PTE_BLOCK_MEMTYPE(MT_NORMAL) |
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PTE_BLOCK_INNER_SHARE
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}, {
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/* List terminator */
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0,
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}
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};
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struct mm_region *mem_map = sdm845_mem_map;
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