This converts the following to Kconfig:
CONFIG_ENV_OVERWRITE
Signed-off-by: Adam Ford <aford173@gmail.com>
[trini: Rerun migration, remove some comments]
Signed-off-by: Tom Rini <trini@konsulko.com>
There are two remaining users of the CONFIG_SECURE_BOOT symbol that have
not been migrated to another symbol. In this case, they should be using
CONFIG_NXP_ESBC as their guard.
Cc: Vladimir Oltean <olteanv@gmail.com>
Fixes: 5536c3c9d0 ("freescale/layerscape: Rename the config CONFIG_SECURE_BOOT name")
Signed-off-by: Tom Rini <trini@konsulko.com>
This patch sets CONFIG_SYS_BOOTMAPSZ to the amount of memory available
to safely contain a kernel, device tree and initrd for relocation. The
way to set fdt_high as 0xffffffff to disable device tree relocation is
removed.
Signed-off-by: Alison Wang <alison.wang@nxp.com>
Reviewed-by: Tom Rini <trini@konsulko.com>
Reviewed-by: Priyanka Jain <priyanka.jain@nxp.com>
This supports i2c DM and enables CONFIG_DM_I2C
for SoC LS1021A
Signed-off-by: Biwen Li <biwen.li@nxp.com>
Signed-off-by: Priyanka Jain <priyanka.jain@nxp.com>
- In ARMv8 NXP Layerscape platforms we also need to make use of
CONFIG_SYS_RELOC_GD_ENV_ADDR now, do so.
- On ENV_IS_IN_REMOTE, CONFIG_ENV_OFFSET is never used, drop the define
to 0.
- Add Kconfig entry for ENV_ADDR.
- Make ENV_ADDR / ENV_OFFSET depend on the env locations that use it.
- Add ENV_xxx_REDUND options that depend on their primary option and
SYS_REDUNDAND_ENVIRONMENT
- On a number of PowerPC platforms, use SPL_ENV_ADDR not CONFIG_ENV_ADDR
for the pre-main-U-Boot environment location.
- On ENV_IS_IN_SPI_FLASH, check not for CONFIG_ENV_ADDR being set but
rather it being non-zero, as it will now be zero by default.
- Rework the env_offset absolute in env/embedded.o to not use
CONFIG_ENV_OFFSET as it was the only use of ENV_OFFSET within
ENV_IS_IN_FLASH.
- Migrate all platforms.
Cc: Wolfgang Denk <wd@denx.de>
Cc: Joe Hershberger <joe.hershberger@ni.com>
Cc: Patrick Delaunay <patrick.delaunay@st.com>
Cc: uboot-stm32@st-md-mailman.stormreply.com
Signed-off-by: Tom Rini <trini@konsulko.com>
Acked-by: Joe Hershberger <joe.hershberger@ni.com>
Reviewed-by: Simon Goldschmidt <simon.k.r.goldschmidt@gmail.com>
The LS1021A-TSN is a development board built by VVDN/Argonboards in
partnership with NXP.
It features the LS1021A SoC and the first-generation SJA1105T Ethernet
switch for prototyping implementations of a subset of IEEE 802.1 TSN
standards.
Supported boot media: microSD card (via SPL), QSPI flash.
Rev. A of the board uses a Spansion S25FL512S_256K serial flash, which
is 64 MB in size and has an erase sector size of 256KB (therefore,
flashing the RCW would erase part of U-Boot).
Rev. B and C of the board use a Spansion S25FL256S1 serial flash, which
is only 32 MB in size but has an erase sector size of 64KB (therefore
the RCW image can be flashed without erasing U-Boot).
To avoid the problems above, the U-Boot base address has been selected
at 0x100000 (the start of the 5th 256KB erase sector), which works for
all board revisions. Actually 0x40000 would have been enough, but
0x100000 is common for all Layerscape devices.
eTSEC3 is connecting directly to SJA1105 via an RGMII fixed-link, but
SJA1105 is currently not supported by uboot. Therefore, eTSEC3 is
disabled.
Signed-off-by: Xiaoliang Yang <xiaoliang.yang_1@nxp.com>
Signed-off-by: Mingkai Hu <mingkai.hu@nxp.com>
Signed-off-by: Jianchao Wang <jianchao.wang@nxp.com>
Signed-off-by: Changming Huang <jerry.huang@nxp.com>
Signed-off-by: Vladimir Oltean <olteanv@gmail.com>
[Vladimir] Code taken from https://github.com/openil/u-boot (which
itself is mostly copied from ls1021a-iot) and adapted with the following
changes:
- Add a008850 errata workaround
- Converted eTSEC, MMC to DM to avoid all build warnings
- Plugged in distro boot feature, including support for extlinux.conf
- Added defconfig for QSPI boot
- Added the board/freescale/ls1021atsn/README.rst for initial setup
- Increased CONFIG_SYS_MONITOR_LEN so that the SPL malloc pool does not
get overwritten during copying of the u-boot.bin payload from MMC to
DDR.
Acked-by: Joe Hershberger <joe.hershberger@ni.com>
Reviewed-by: Bin Meng <bmeng.cn@gmail.com>
