Even when the IGEPv2 board and the IGEP Computer-on-Module
are different from a form factor point of view, they are
very similar in the fact that share many components and how
they are wired.
So, it is possible (and better) to have a single board file
for both devices and just use the CONFIG_MACH_TYPE to make
a differentiation between each board when needed.
This change avoids code duplication by removing 298 lines of
code and makes future maintenance easier.
Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk>
Acked-by: Igor Grinberg <grinberg@compulab.co.il>
IGEP-based boards can have two different flash memories, a OneNAND or a
NAND device. Add a configuration option for to choose which memory to use.
Signed-off-by: Javier Martinez Canillas <javier@dowhile0.org>
Acked-by: Enric Balletbo i Serra <eballetbo@gmail.com>
The IGEP module is a low-power, high performance production-ready
system-on-module (SOM) based on TI's OMAP3 family.The IGEP module
solution based upon TI OMAP3 provides a low-power/low-cost platform
for a variety of consumer/industrial/medical devices.
Signed-off-by: Enric Balletbo i Serra <eballetbo@gmail.com>
Signed-off-by: Sandeep Paulraj <s-paulraj@ti.com>
