Every makefile in sub directories has common lines
at the top and the bottom.
This commit pushes the common parts into script/Makefile.build.
Going forward sub-makefiles only need to describe this part:
COBJS := ...
COBJS += ...
SOBJS := ...
But using obj-y is preferable to prepare for switching to Kbuild.
The conventional (non-Kbuild) Makefile style is still supported.
This is achieved by greping the Makefile before entering into it.
U-Boot conventional sub makefiles always include some other makefiles.
So the build system searches a line beginning with "include" keyword
in the makefile in order to distinguish which style it is.
If the Makefile include a "include" line, we assume it is a conventional
U-Boot style. Otherwise, it is treated as a Kbuild-style makefile.
With this tweak, we can switch sub-makefiles
from U-Boot style to Kbuild style little by little.
obj-y := foo/
syntax (descending into the sub directory) is not supportd yet.
It will be implemented in the upcomming commit.
Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
Cc: Simon Glass <sjg@chromium.org>
Cc: Tom Rini <trini@ti.com>
Due to the nand SPL on some board(e.g. P1022DS)has a size limit, it can
not be more than 4K. So, the SPL cannot initialize the DDR with the SPD
code. This patch introduces TPL to enable a loader stub that is loaded
by the code from the SPL. It initializes the DDR with the SPD or other
operations.
The TPL's size is sizeable, the maximum size is decided by the memory's
size that TPL runs. It initializes the DDR through SPD code, and copys
final uboot image to DDR. So there are three stage uboot images:
* spl_boot, * tpl_boot, * final uboot image
Signed-off-by: Ying Zhang <b40530@freescale.com>
Acked-by: York Sun <yorksun@freescale.com>
The code from the internal on-chip ROM. It loads the final uboot image
into DDR, then jump to it to begin execution.
The SPL's size is sizeable, the maximum size must not exceed the size of L2
SRAM. It initializes the DDR through SPD code, and copys final uboot image
to DDR. So there are two stage uboot images:
* spl_boot, 96KB size. The env variables are copied to L2 SRAM, so that
ddr spd code can get the interleaving mode setting in env. It loads
final uboot image from offset 96KB.
* final uboot image, size is variable depends on the functions enabled.
Signed-off-by: Ying Zhang <b40530@freescale.com>
Acked-by: York Sun <yorksun@freescale.com>
SPL defines CONFIG_SPL_BUILD but this does not percolate to the
autoconf.mk Makefile. As a result the build breaks when
CONFIG_SPL_BUILD is used in the board-specific include header file. With
this, there is a possibility of having a CONFIG option defined in the
header file but not defined in the Makefile causing all kinds of build
failure and problems.
It also messes things for up, for example, when one might want to
undefine options to keep the SPL small and doesn't want to be stuck with
the CONFIG options used for U-boot. Lastly, this also avoids defining
special CONFIG_SPL_ variables for cases where some options are required
in U-boot but not in SPL.
We add a spl-autoconf.mk rule that is generated for SPL with the
CONFIG_SPL_BUILD flag and conditionally include it for SPL builds.
Signed-off-by: Joel Fernandes <joelf@ti.com>
Signed-off-by: Ying Zhang <b40530@freescale.com>
Adding a new CONFIG_OMAP_COMMON which is included by all boards
that needs to build cpu/armv7/omap-common folder.
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
This requires that cpu_is_exynos4/5 should be made available before tzpc_init.
Hence this patch also makes necessary changes to have cpu_info in spl and
invokes arch_cpu_init before tzpc_init in low_level_init.S for smdk5250.
Signed-off-by: Inderpal Singh <inderpal.singh@linaro.org>
Acked-by: Chander Kashyap <chander.kashyap@linaro.org>
Signed-off-by: Minkyu Kang <mk7.kang@samsung.com>
Allow usage of the imx-common/iomux-v3.h framework by including pad settings for
the i.MX35. The content of the file is taken from Linux kernel at commit
267dd34, plus the required changes to make it work in U-Boot.
Signed-off-by: Benoît Thébaudeau <benoit.thebaudeau@advansee.com>
Fix minor adjustments needed to get SPL framework building on MX5.
Signed-off-by: Marek Vasut <marex@denx.de>
Cc: Albert ARIBAUD <albert.u.boot@aribaud.net>
Cc: Benoît Thébaudeau <benoit.thebaudeau@advansee.com>
Cc: Fabio Estevam <fabio.estevam@freescale.com>
Cc: Scott Wood <scottwood@freescale.com>
Cc: Stefano Babic <sbabic@denx.de>
Cc: Tom Rini <trini@ti.com>
This patch moves the following functions into the imx-common
directory:
- mxs_wait_mask_set()
- mxs_wait_mask_clr()
- mxs_reset_block()
These are currently used by i.MX28. But the upcoming GPMI NAND port
for i.MX6 will also use these functions. So lets move them to a
common location to re-use them.
Signed-off-by: Stefan Roese <sr@denx.de>
Cc: Stefano Babic <sbabic@denx.de>
Cc: Marek Vasut <marex@denx.de>
Cc: Fabio Estevam <fabio.estevam@freescale.com>
Refactor linker-generated array code so that symbols
which were previously linker-generated are now compiler-
generated. This causes relocation records of type
R_ARM_ABS32 to become R_ARM_RELATIVE, which makes
code which uses LGA able to run before relocation as
well as after.
Note: this affects more than ARM targets, as linker-
lists span possibly all target architectures, notably
PowerPC.
Conflicts:
arch/arm/cpu/arm926ejs/mxs/u-boot-spl.lds
arch/arm/cpu/arm926ejs/spear/u-boot-spl.lds
arch/arm/cpu/armv7/omap-common/u-boot-spl.lds
board/ait/cam_enc_4xx/u-boot-spl.lds
board/davinci/da8xxevm/u-boot-spl-da850evm.lds
board/davinci/da8xxevm/u-boot-spl-hawk.lds
board/vpac270/u-boot-spl.lds
Signed-off-by: Albert ARIBAUD <albert.u.boot@aribaud.net>
Many SPL linker scripts needlessly include linker lists (aka LGAs).
Remove them whenever possible; keep it only in the seven am335x_evm
variants (am335x_evm, am335x_evm_uart[1-5], am335x_evm_spiboot),
where there is actual content in output section .u_boot_list.
This commit keeps all u-boot.bin and u-boot-spl.bin in ARM targets
byte-identical.
Signed-off-by: Albert ARIBAUD <albert.u.boot@aribaud.net>
In case of usbeth booting just call net_load_image("usb_ether").
This patch also adds CONFIG_SPL_USBETH_SUPPORT and
CONFIG_SPL_MUSB_NEW_SUPPORT config options to enable linking of SPL
against USB gagdet support and new MUSB driver resp.
Signed-off-by: Ilya Yanok <ilya.yanok@cogentembedded.com>
The '#' used as comments in the files cause the preprocessor
trouble, so change to /* */.
The mkimage command which uses this preprocessor output
was moved to arch/arm/imx-common/Makefile
.gitignore was updated to ignore .cfgtmp files.
Signed-off-by: Troy Kisky <troy.kisky@boundarydevices.com>
This patch adds basic Tegra30 (T30) build support - no specific
board is targeted.
Signed-off-by: Tom Warren <twarren@nvidia.com>
Reviewed-by: Stephen Warren <swarren@nvidia.com>
This patch adds essential components for generation of the contents of
the linker section that is used by the linker-generated array. All of
the contents is held in a separate file, u-boot.lst, which is generated
at runtime just before U-Boot is linked.
The purpose of this code is to especially generate the appropriate
boundary symbols around each subsection in the section carrying the
linker-generated arrays. Obviously, the interim linker code for actual
placement of the variables into the section is generated too. The
generated file, u-boot.lst, is included into u-boot.lds via the linker
INCLUDE directive in u-boot.lds .
Adjustments are made in the Makefile and spl/Makefile so that the
u-boot.lds and u-boot-spl.lds depend on their respective .lst files.
Signed-off-by: Marek Vasut <marex@denx.de>
Cc: Joe Hershberger <joe.hershberger@gmail.com>
Cc: Mike Frysinger <vapier@gentoo.org>
Acked-by: Joe Hershberger <joe.hershberger@ni.com>
Tested-by: Joe Hershberger <joe.hershberger@ni.com>
Move files that are going to be common between T20 and T30 into 'tegra-common'
subdirs in AVP (arm720t), CPU (armv7), and shared (arch/arm/cpu/.) areas. Any
files that are left behind in '/tegra20' will be copied to '/tegra30' subdirs
and modified for that SoC. The 'common' files should need only minor changes.
Include files (arch/arm/include/asm/arch-tegra/tegra20) will be done in a
follow-on patch.
Builds fine w/MAKEALL -s tegra20. Checkpatch.pl is clean.
Signed-off-by: Tom Warren <twarren@nvidia.com>
This patch adds support for networking in SPL. Some devices are
capable of loading SPL via network so it makes sense to load the
main U-Boot binary via network too. This patch tries to use
existing network code as much as possible. Unfortunately, it depends
on environment which in turn depends on other code so SPL size
is increased significantly. No effort was done to decouple network
code and environment so far.
Signed-off-by: Ilya Yanok <ilya.yanok@cogentembedded.com>
Acked-by: Joe Hershberger <joe.hershberger@ni.com>
Signed-off-by: Tom Rini <trini@ti.com>
Add a new flag, CONFIG_SPL_FRAMEWORK to opt into the common/spl SPL
framework, enable on all of the previously using boards. We move the
spl_ymodem.c portion to common/ and spl_mmc.c to drivers/mmc/. We leave
the NAND one in-place as we plan to replace it later in this series.
We use common/spl to avoid linker problems with respect to merging
constant strings in objects. Otherwise all strings in common/ will be
linked in and kept which grows SPL in size too much.
Signed-off-by: Tom Rini <trini@ti.com>
Remove linker command line options from the SPL makefile
that force the inclusion of unreferenced command code from
linked object files. As commands are not used in the SPL,
these options resulted in an unnecessary increase in the
image size, in addition to introducing the possibility of
tricky link errors in the case where the command code
contained symbols that were not resolved by linking in the
limited objects compiled in the SPL build.
Signed-off-by: Tyler Olmstead <tyler.j.olmstead@gmail.com>
Acked-by: Tom Rini <trini@ti.com>
This fixes the SPL build to link with the SPL version of libgcc if
USE_PRIVATE_LIBGCC is set to "yes". Previously it was linking with
the libgcc from the normal u-boot build because it gets set in
PLATFORM_LIBS and passed down the to the SPL build.
Signed-off-by: Allen Martin <amartin@nvidia.com>
Acked-by: Stephen Warren <swarren@wwwdotorg.org>
Tested-by: Thierry Reding <thierry.reding@avionic-design.de>
Signed-off-by: Tom Warren <twarren@nvidia.com>
In preparation for splitting out the armv4t code from tegra20, move
the tegra20 SoC code to arch/arm/cpu/tegra20-common. This code will
be compiled armv4t for the arm7tdmi and armv7 for the cortex A9.
Signed-off-by: Allen Martin <amartin@nvidia.com>
Acked-by: Stephen Warren <swarren@wwwdotorg.org>
Tested-by: Thierry Reding <thierry.reding@avionic-design.de>
Signed-off-by: Tom Warren <twarren@nvidia.com>
Commit 8b5a02640a ("Makefile: cosmetic:
optimize usage of LIBS-y") broke the build of boards that have a board
vendor "common" directory, by introducing a space between "LIBS-" and
"y".
Signed-off-by: Scott Wood <scottwood@freescale.com>
Signed-off-by: Daniel Schwierzeck <daniel.schwierzeck@gmail.com>
Acked-by: Kim Phillips <kim.phillips@freescale.com>
Most link scripts differ only in the directory containing the start.o
file. Make this a #define to remove this last difference.
(Note that if start.o were disallowed outside the CPU start directory then
we wouldn't even need this. But that is a separate discussion.)
Signed-off-by: Simon Glass <sjg@chromium.org>
The Makefile for a CPU is in arch/($ARCH)/cpu/$(CPU). We want to support
having an .lds file in arch/$(ARCH)/cpu without requiring an additional
Makefile there. This change makes it clear that we expect a Makefile in
the same directory as the link script except in this case.
Signed-off-by: Simon Glass <sjg@chromium.org>
This patch is added to support SPL feature on AM335X
platform. In this patch, MMC1 is configured as boot
device for SPL and support for other devices will be
added in the next patch series.
Signed-off-by: Chandan Nath <chandan.nath@ti.com>
Signed-off-by: Tom Rini <trini@ti.com>
Acked-by: Igor Grinberg <grinberg@compulab.co.il>
This patch adds the minimal support for OMAP5. The platform and machine
specific headers and sources updated for OMAP5430.
OMAP5430 is Texas Instrument's SOC based on ARM Cortex-A15 SMP architecture.
It's a dual core SOC with GIC used for interrupt handling and SCU for cache
coherency.
Also moved some part of code from the basic platform support that can be made
common for OMAP4/5. Rest is kept out seperately. The same approach is followed
for clocks and emif support in the subsequent patches.
Signed-off-by: sricharan <r.sricharan@ti.com>
Signed-off-by: Sandeep Paulraj <s-paulraj@ti.com>
This introduces small OneNAND loader, fitting into 1kB of space (smallest
possible OneNAND RAM size). Some devices equipped with such crappy chips will
use this.
Signed-off-by: Marek Vasut <marek.vasut@gmail.com>
Cc: Albert ARIBAUD <albert.u.boot@aribaud.net>
Cc: Kyungmin Park <kyungmin.park@samsung.com>
Cc: Scott Wood <scottwood@freescale.com>
V2: Introduce spl_onenand_load_image() to load data from OneNAND in SPL
V3: Cleanup, align with nand_spl. Skip whole blocks.
On some hosts using relative paths will cause the build to fail. This
patch sets absolute paths for the tools directory
Get rid of MSDOS style excecutable extension
Signed-off-by: Angus Ainslie <angus.ainslie@linaro.org>
Signed-off-by: Minkyu Kang <mk7.kang@samsung.com>
Adding a DMA library to the SPL. It is used if CONFIG_SPL_DMA_SUPPORT is
defined.
Signed-off-by: Simon Schwarz <simonschwarzcor@gmail.com>
Signed-off-by: Sandeep Paulraj <s-paulraj@ti.com>
Introduce CONFIG_SPL_START_S_PATH to configure path to start.S file. It's not
always fitting to use CPU's start.S .
Signed-off-by: Marek Vasut <marek.vasut@gmail.com>
- Add mkimage support for OMAP boot image
- Add support for OMAP boot image(MLO) generation in the new
SPL framework
Signed-off-by: John Rigby <john.rigby@linaro.org>
Signed-off-by: Aneesh V <aneesh@ti.com>
Signed-off-by: Sandeep Paulraj <s-paulraj@ti.com>
