We can skip the image authentication check at runtime if the device is GP.
This reduces the delta between GP and HS U-Boot builds. End goal is
to re-unify the two build types into one build that can run on all
device types.
Signed-off-by: Andrew Davis <afd@ti.com>
The first AM6x device was the AM654x, but being the first we named it
just AM6, since more devices have come out with this same prefix we
should switch it to the normal convention of using the full name of the
first compatibility device the series. This makes what device we are
talking about more clear and matches all the K3 devices added since.
Signed-off-by: Andrew Davis <afd@ti.com>
Reviewed-by: Tom Rini <trini@konsulko.com>
The content of these files are only used in SPL builds. The contents are
already ifdef for the same, remove that and only include the whole file
in the build when building for SPL.
Signed-off-by: Andrew Davis <afd@ti.com>
Reviewed-by: Tom Rini <trini@konsulko.com>
The AM62 SoC family is the follow on AM335x built on K3 Multicore SoC
architecture platform, providing ultra-low-power modes, dual display,
multi-sensor edge compute, security and other BOM-saving integration.
The AM62 SoC targets broad market to enable applications such as
Industrial HMI, PLC/CNC/Robot control, Medical Equipment, Building
Automation, Appliances and more.
Some highlights of this SoC are:
* Quad-Cortex-A53s (running up to 1.4GHz) in a single cluster.
Pin-to-pin compatible options for single and quad core are available.
* Cortex-M4F for general-purpose or safety usage.
* Dual display support, providing 24-bit RBG parallel interface and
OLDI/LVDS-4 Lane x2, up to 200MHz pixel clock support for 2K display
resolution.
* Selectable GPUsupport, up to 8GFLOPS, providing better user experience
in 3D graphic display case and Android.
* PRU(Programmable Realtime Unit) support for customized programmable
interfaces/IOs.
* Integrated Giga-bit Ethernet switch supporting up to a total of two
external ports (TSN capable).
* 9xUARTs, 5xSPI, 6xI2C, 2xUSB2, 3xCAN-FD, 3x eMMC and SD, GPMC for
NAND/FPGA connection, OSPI memory controller, 3xMcASP for audio,
1x CSI-RX-4L for Camera, eCAP/eQEP, ePWM, among other peripherals.
* Dedicated Centralized System Controller for Security, Power, and
Resource Management.
* Multiple low power modes support, ex: Deep sleep,Standby, MCU-only,
enabling battery powered system design.
AM625 is the first device of the family. Add DT bindings for the same.
More details can be found in the Technical Reference Manual:
https://www.ti.com/lit/pdf/spruiv7
Signed-off-by: Suman Anna <s-anna@ti.com>
Signed-off-by: Gowtham Tammana <g-tammana@ti.com>
Signed-off-by: Aswath Govindraju <a-govindraju@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
Reviewed-by: Tom Rini <trini@konsulko.com>
Add platform clock and powerdomain data for J721e and J7200. This data
is used by the corresponding drivers to register all the required device
clocks and powerdomains.
Signed-off-by: Dave Gerlach <d-gerlach@ti.com>
Signed-off-by: Tero Kristo <kristo@kernel.org>
The AM642 SoC belongs to the K3 Multicore SoC architecture platform,
providing advanced system integration to enable applications such as
Motor Drives, PLC, Remote IO and IoT Gateways.
Some highlights of this SoC are:
* Dual Cortex-A53s in a single cluster, two clusters of dual Cortex-R5F
MCUs, and a single Cortex-M4F.
* Two Gigabit Industrial Communication Subsystems (ICSSG).
* Integrated Ethernet switch supporting up to a total of two external
ports.
* PCIe-GEN2x1L, USB3/USB2, 2xCAN-FD, eMMC and SD, UFS, OSPI memory
controller, QSPI, I2C, eCAP/eQEP, ePWM, ADC, among other
peripherals.
* Centralized System Controller for Security, Power, and Resource
Management (DMSC).
See AM64X Technical Reference Manual (SPRUIM2, Nov 2020)
for further details: https://www.ti.com/lit/pdf/spruim2
Signed-off-by: Dave Gerlach <d-gerlach@ti.com>
When switching on or off the ARM caches some care must be taken to ensure
existing cache line allocations are not left in an inconsistent state.
An example of this is when cache lines are considered non-shared by
and L3 controller even though the lines are shared. To prevent these
and other issues all cache lines should be cleared before enabling
or disabling a coherent master's cache. ARM cores and many L3 controllers
provide a way to efficiently clean out all cache lines to allow for
this, unfortunately there is no such easy way to do this on current K3
MSMC based systems.
We could explicitly clean out every valid external address tracked by
MSMC (all of DRAM), or we could attempt to identify only the set of
addresses accessed by a given boot stage and flush only those
specifically. This patch attempts the latter. We start with cleaning the
SPL load address. More addresses can be added here later as they are
identified.
Note that we perform a flush operation for both the flush and invalidate
operations, this is not a typo. We do this to avoid the situation that
some ARM cores will promote an invalidate to a clean+invalidate, but only
emit the invalidation operation externally, leading to a loss of data.
Signed-off-by: Andrew F. Davis <afd@ti.com>
Tested-by: Faiz Abbas <faiz_abbas@ti.com>
The J721E SoC belongs to the K3 Multicore SoC architecture platform,
providing advanced system integration to enable lower system costs
of automotive applications such as infotainment, cluster, premium
Audio, Gateway, industrial and a range of broad market applications.
This SoC is designed around reducing the system cost by eliminating
the need of an external system MCU and is targeted towards ASIL-B/C
certification/requirements in addition to allowing complex software
and system use-cases.
Some highlights of this SoC are:
* Dual Cortex-A72s in a single cluster, three clusters of lockstep
capable dual Cortex-R5F MCUs, Deep-learning Matrix Multiply Accelerator(MMA),
C7x floating point Vector DSP, Two C66x floating point DSPs.
* 3D GPU PowerVR Rogue 8XE GE8430
* Vision Processing Accelerator (VPAC) with image signal processor and Depth
and Motion Processing Accelerator (DMPAC)
* Two Gigabit Industrial Communication Subsystems (ICSSG), each with dual
PRUs and dual RTUs
* Two CSI2.0 4L RX plus one CSI2.0 4L TX, one eDP/DP, One DSI Tx, and
up to two DPI interfaces.
* Integrated Ethernet switch supporting up to a total of 8 external ports in
addition to legacy Ethernet switch of up to 2 ports.
* System MMU (SMMU) Version 3.0 and advanced virtualisation
capabilities.
* Upto 4 PCIe-GEN3 controllers, 2 USB3.0 Dual-role device subsystems,
16 MCANs, 12 McASP, eMMC and SD, UFS, OSPI/HyperBus memory controller, QSPI,
I3C and I2C, eCAP/eQEP, eHRPWM, MLB among other peripherals.
* Two hardware accelerator block containing AES/DES/SHA/MD5 called SA2UL
management.
* Configurable L3 Cache and IO-coherent architecture with high data throughput
capable distributed DMA architecture under NAVSS
* Centralized System Controller for Security, Power, and Resource
Management (DMSC)
See J721E Technical Reference Manual (SPRUIL1, May 2019)
for further details: http://www.ti.com/lit/pdf/spruil1
Add base support for J721E SoC
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
Signed-off-by: Andreas Dannenberg <dannenberg@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Introduce a framework that allows loading the System Firmware (SYSFW)
binary as well as the associated configuration data from an image tree
blob named "sysfw.itb" from an FS-based MMC boot media or from an MMC
RAW mode partition or sector.
To simplify the handling of and loading from the different boot media
we tap into the existing U-Boot SPL framework usually used for loading
U-Boot by building on an earlier commit that exposes some of that
functionality.
Note that this initial implementation only supports FS and RAW-based
eMMC/SD card boot.
Signed-off-by: Andreas Dannenberg <dannenberg@ti.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
K3 devices have High Security (HS) variants along with the non-HS already
supported. Like the previous generation devices (OMAP/Keystone2) K3
supports boot chain-of-trust by authenticating and optionally decrypting
images as they are unpacked from FIT images. Add support for this here.
Signed-off-by: Andrew F. Davis <afd@ti.com>
Reviewed-by: Tom Rini <trini@konsulko.com>
Reviewed-by: Andreas Dannenberg <dannenberg@ti.com>
Based on the MCU R5 efuse settings, R5F cores in MCU domain
either work in split mode or in lock step mode.
If efuse settings are in lockstep mode: ROM release R5 cores
and SPL continues to run on the R5 core is lockstep mode.
If efuse settings are in split mode: ROM releases both the R5
cores simultaneously and allow SPL to run on both the cores.
In this case it is bootloader's responsibility to detect core
1 and park it. Else both the core will be running bootloader
independently which might result in an unexpected behaviour.
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
Reviewed-by: Tom Rini <trini@konsulko.com>
Considering the boot time requirements, Cortex-A core
should be able to start immediately after SPL on R5.
Add support for the same.
Reviewed-by: Tom Rini <trini@konsulko.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
The AM654 device is designed for industrial automation and PLC
controller class platforms among other applications. Introduce
base support for AM654 SoC.
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
Reviewed-by: Tom Rini <trini@konsulko.com>
