---------------------------------
CI: https://source.denx.de/u-boot/custodians/u-boot-imx/-/pipelines/15819
i.MX patches queued for next:
- Conversions to DM_SERIAL
- Fixes for Toradex boards
- Gateworks Boards
- i.MX8ULP
- EQoS support / fixes, changes in boards
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Merge tag 'u-boot-imx-next-20230331' of https://gitlab.denx.de/u-boot/custodians/u-boot-imx into next
u-boot-imx-next-20230331 for next
---------------------------------
CI: https://source.denx.de/u-boot/custodians/u-boot-imx/-/pipelines/15819
i.MX patches queued for next:
- Conversions to DM_SERIAL
- Fixes for Toradex boards
- Gateworks Boards
- i.MX8ULP
- EQoS support / fixes, changes in boards
There was a conflict between the following two commits, that wasn't
resolved correctly. Fix this.
a93985ddfc ("doc: sl-mx8mm: Update the NXP TF-A source reference")
f0f461287e ("imx: Suggest the NXP ATF github repo")
Signed-off-by: Frieder Schrempf <frieder.schrempf@kontron.de>
Cc: Heinrich Schuchardt <heinrich.schuchardt@canonical.com>
Cc: Fabio Estevam <festevam@denx.de>
Cc: Stefano Babic <sbabic@denx.de>
Reviewed-by: Fabio Estevam <festevam@denx.de>
The M.2 slots of the related IOT2050 variant need to be configured
according to the plugged cards. This tries to detect the card using the
M.2 configuration pins of the B-key slot. If that fails, a U-Boot
environment variable can be set to configure manually. This variable is
write-permitted also in secure boot mode as it is not able to undermine
the integrity of the booted system.
The configuration is then applied to mux the serdes and to fix up the
device tree passed to or loaded by the bootloader. The fix-ups are
coming from device tree overlays that are embedded into the firmware
image and there also integrity protected. The OS remains free to load
a device tree to which they do not apply: U-Boot will not fail to boot
in that case.
Based on original patch by Chao Zeng.
Signed-off-by: Jan Kiszka <jan.kiszka@siemens.com>
Add support for the M.2 board based on the iot2050 advanced board.
The board has two m.2 connectors, one is B-keyed, the other E-keyed.
The B-key slot can connect 5G/SSD devices, and E-key can be used for
WIFI/BT devices.
This variant is covered by PG2 firmware image.
Signed-off-by: chao zeng <chao.zeng@siemens.com>
[Jan: align DT to kernel, polish wording]
Signed-off-by: Jan Kiszka <jan.kiszka@siemens.com>
Use external blob otpcmd.bin to replace the 0xff filled OTP programming
command block to create a firmware image that provisions the OTP on
first boot. This otpcmd.bin is generated from the customer keys using
steps described in the meta-iot2050 integration layer for the device.
Based on original patch by Baocheng Su.
Signed-off-by: Jan Kiszka <jan.kiszka@siemens.com>
There are many ways to get a signed firmware for the IOT2050 devices,
namely for the parts under user-control. This script documents one way
of doing it, given a signing key. Augment the board documentation with
the required procedure around it.
Signed-off-by: Jan Kiszka <jan.kiszka@siemens.com>
The latest version of the binary-only firmware parts come in a combined
form of FSBL and sysfw containers. This implies some layout changes to
the generated firmware image but also makes handling of artifacts much
simpler (4 files less). The env locations will not change, just the
space reserved for U-Boot will shrink from 4 to 3 MB - still plenty of
space left in practice.
Adjust configuration and documentation accordingly.
Along this change, add a new reservation for update commands of the
user-controlled OTP part. A specific userspace tool will fill it, and
the FSBL will evaluate it during boot. This reservation will use 64K of
the former sysfw section.
Signed-off-by: Jan Kiszka <jan.kiszka@siemens.com>
Due to different signature keys, the PG1 and the PG2 boards can no
longer use the same FSBL (tiboot3). This makes it impossible anyway to
maintaine a single flash.bin for both variants, so we can also split the
build.
A new target is added to indicates the build is for PG1 vs. PG2 boards.
Hence now the variants have separated defconfig files.
The runtime board_is_sr1() check does make no sense anymore, so remove
it and replace with build time check.
Documentation is updated accordingly. New binary artifacts are already
available via meta-iot2050.
Signed-off-by: Su Baocheng <baocheng.su@siemens.com>
[Jan: refactor config option into targets, tweak some wordings]
Signed-off-by: Jan Kiszka <jan.kiszka@siemens.com>
With recent CONFIG_TEXT_BASE changes, there are inconsistencies between
several settings.
Adjust CONFIG_SYS_MONITOR_LEN to allow more code space. Move the MRC
cache out of the way too.
Add documentation on how to make this change safely.
Fixes: 66e2c665f3 ("x86: minnowmax: Adjust CONFIG_TEXT_BASE")
Signed-off-by: Simon Glass <sjg@chromium.org>
Reviewed-by: Bin Meng <bmeng.cn@gmail.com>
ROCK 5B is a Rockchip RK3588 based SBC (Single Board Computer) by Radxa.
There are tree variants depending on the DRAM size : 4G, 8G and 16G.
Specification:
Rockchip Rk3588 SoC
4x ARM Cortex-A76, 4x ARM Cortex-A55
4/8/16GB memory LPDDR4x
Mali G610MC4 GPU
MIPI CSI 2 multiple lanes connector
eMMC module connector
uSD slot (up to 128GB)
2x USB 2.0, 2x USB 3.0
2x HDMI output, 1x HDMI input
Ethernet port
40-pin IO header including UART, SPI, I2C and 5V DC power in
USB PD over USB Type-C
Size: 85mm x 54mm
Kernel commits:
a1d3281450ab ("arm64: dts: rockchip: Add rock-5b board")
6fb13f888f2a ("arm64: dts: rockchip: Update sdhci alias for rock-5b")
Signed-off-by: Eugen Hristev <eugen.hristev@collabora.com>
Reviewed-by: Kever Yang <kever.yang@rock-chips.com>
Neural Compute Module 6(Neu2) is a 96boards SoM-CB compute module
based on Rockchip RK3588 from Edgeble AI.
General features:
- Rockchip RK3588
- up to 32GB LPDDR4x
- up to 128GB eMMC
- 2x MIPI CSI2 FPC
On module WiFi6/BT5 is available in the following Neu6 variants.
Neural Compute Module 6(Neu6) IO board is an industrial form factor
ready-to-use IO board from Edgeble AI.
IO board offers plenty of peripherals and connectivity options and
this patch enables basic eMMC and UART which is enough to successfully
boot Linux.
Neu6 needs to mount on top of this IO board in order to create a
complete Edgeble Neural Compute Module 6(Neu6) IO platform.
Boot log for the record,
DDR Version V1.08 20220617
LPDDR4X, 2112MHz
channel[0] BW=16 Col=10 Bk=8 CS0 Row=16 CS1 Row=16 CS=2 Die BW=16 Size=2048MB
channel[1] BW=16 Col=10 Bk=8 CS0 Row=16 CS1 Row=16 CS=2 Die BW=16 Size=2048MB
channel[2] BW=16 Col=10 Bk=8 CS0 Row=16 CS1 Row=16 CS=2 Die BW=16 Size=2048MB
channel[3] BW=16 Col=10 Bk=8 CS0 Row=16 CS1 Row=16 CS=2 Die BW=16 Size=2048MB
Manufacturer ID:0x6
CH0 RX Vref:31.7%, TX Vref:21.8%,21.8%
CH1 RX Vref:30.7%, TX Vref:22.8%,23.8%
CH2 RX Vref:30.7%, TX Vref:22.8%,22.8%
CH3 RX Vref:30.7%, TX Vref:21.8%,21.8%
change to F1: 528MHz
change to F2: 1068MHz
change to F3: 1560MHz
change to F0: 2112MHz
out
U-Boot SPL 2023.01-00952-g1d1785a516-dirty (Jan 30 2023 - 19:53:55 +0530)
Trying to boot from MMC1
INFO: Preloader serial: 2
NOTICE: BL31: v2.3():v2.3-391-g856309329:derrick.huang
NOTICE: BL31: Built : 14:15:50, Jul 18 2022
INFO: ext 32k is not valid
INFO: GICv3 without legacy support detected.
INFO: ARM GICv3 driver initialized in EL3
INFO: system boots from cpu-hwid-0
INFO: idle_st=0x21fff, pd_st=0x11fff9, repair_st=0xfff70001
INFO: dfs DDR fsp_params[0].freq_mhz= 2112MHz
INFO: dfs DDR fsp_params[1].freq_mhz= 528MHz
INFO: dfs DDR fsp_params[2].freq_mhz= 1068MHz
INFO: dfs DDR fsp_params[3].freq_mhz= 1560MHz
INFO: BL31: Initialising Exception Handling Framework
INFO: BL31: Initializing runtime services
WARNING: No OPTEE provided by BL2 boot loader, Booting device without OPTEE initialization. SMC`s destined for OPTEE will return SMC_UNK
ERROR: Error initializing runtime service opteed_fast
INFO: BL31: Preparing for EL3 exit to normal world
INFO: Entry point address = 0xa00000
INFO: SPSR = 0x3c9
U-Boot 2023.01-00952-g1d1785a516-dirty (Jan 30 2023 - 19:53:55 +0530)
Model: Edgeble Neu6A IO Board
DRAM: 7.5 GiB (effective 3.7 GiB)
Core: 71 devices, 15 uclasses, devicetree: separate
MMC: mmc@fe2c0000: 0
Loading Environment from nowhere... OK
In: serial@feb50000
Out: serial@feb50000
Err: serial@feb50000
Model: Edgeble Neu6A IO Board
Net: No ethernet found.
Hit any key to stop autoboot: 0
=>
Add support for Edgeble Neu6 Model A IO Board.
Signed-off-by: Jagan Teki <jagan@edgeble.ai>
Reviewed-by: Kever Yang <kever.yang@rock-chips.com>
Update the MAINTAINERS file to include the devicetree for the
rk3568-evb1-v10 board.
Also update Rockchip board docs to include information on building
RK3568 based devices.
Signed-off-by: Chris Morgan <macromorgan@hotmail.com>
Signed-off-by: Kever Yang <kever.yang@rock-chips.com>
Rockchip SoCs typically use U-Boot TPL to initialize DRAM, then jumps
back to BootRom to load next stage, U-Boot SPL, into DRAM. BootRom then
jumps to U-Boot SPL to continue the normal boot flow.
However, there is no support to initialize DRAM on RK35xx SoCs using
U-Boot TPL and instead an external TPL binary must be used to generate a
bootable u-boot-rockchip.bin image.
Add CONFIG_ROCKCHIP_EXTERNAL_TPL to indicate that an external TPL should
be used. Build U-Boot with ROCKCHIP_TPL=/path/to/ddr.bin to generate a
bootable u-boot-rockchip.bin image for RK3568.
Signed-off-by: Jonas Karlman <jonas@kwiboo.se>
Reviewed-by: Simon Glass <sjg@chromium.org>
Reviewed-by: Kever Yang <kever.yang@rock-chips.com>
Tested-by: Eugen Hristev <eugen.hristev@collabora.com>
Convert the documentation for the Broadcom BCM7445 and BCM7260 boards
to reStructuredText format and add the new filename to
doc/board/broadcom/index.rst.
Signed-off-by: Heinrich Schuchardt <heinrich.schuchardt@canonical.com>
The current ae350-related defconfigs could also
support newer Andes CPU IP, so modify the names of CPU
from ax25 to andesv5, and board name from ax25-ae350 to ae350.
Signed-off-by: Leo Yu-Chi Liang <ycliang@andestech.com>
Reviewed-by: Yu Chien Peter Lin <peterlin@andestech.com>
Reviewed-by: Rick Chen <rick@andestech.com>
As explained in the text at the bottom of the page
https://source.codeaurora.org/external/imx/imx-atf:
"QUIC repositories on this site will not receive any updates after
March 31, 2022, and will be deleted on March 31, 2023."
Point to the NXP ATF github repo instead.
Signed-off-by: Fabio Estevam <festevam@denx.de>
Reviewed-by: Oliver Graute <oliver.graute@kococonnector.com>
Reviewed-by: Marcel Ziswiler <marcel.ziswiler@toradex.com>
Reviewed-by: Frieder Schrempf <frieder.schrempf@kontron.de>
Add the board support for the i.MX8MM Cloos PHG board.
This board uses a imx8mm-tqma8mqml SoM from TQ-Group.
imx8mm-phg.dts and imx8mm-tqma8mqml.dtsi are taken
directly from Linux 6.2-rc3.
Signed-off-by: Fabio Estevam <festevam@denx.de>
Reviewed-by: Tom Rini <trini@konsulko.com>
ODROID-N2L is a variant SBC in small form factor and some peripherals
are removed from ODROID-N2PLUS based on S922X SoC.
- On-board ethernet is removed
- On-board RTC is removed
- USB 3.0 hub is removed, so one USB 2.0 and one USB 3.0 host ports
are available
- Huge heatsink is replaced with 40x40mm heatsink, 5V active heatsink
is recommended or a tall passive sink is optional
- 3.5mm earjack is removed
- IR remote receiver is removed
- MIPI DSI port is added
It doesn't use the odroid-n2 board support since ADC revision
collides with Odroid-N2+ and since it doesn't have on-board ethernet
no need to load the MAC address from eFuses.
Link: https://lore.kernel.org/r/20230126-u-boot-odroid-n2l-v1-2-c60f695e0f6c@linaro.org
Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
Use internal rst reference with :doc: to have a link to distro.rst page
in the generated U-Boot documentation.
Signed-off-by: Patrick Delaunay <patrick.delaunay@foss.st.com>
Reviewed-by: Patrice Chotard <patrice.chotard@foss.st.com>
Add the CROSS_COMPILE flag as we assume we build in a cross environment.
Also improve the comment about copying the binary to SD card.
Signed-off-by: Frieder Schrempf <frieder.schrempf@kontron.de>
This adds a guide for copying the raw bootloader image on the SD card
to the SPI NOR using U-Boot itself.
Signed-off-by: Frieder Schrempf <frieder.schrempf@kontron.de>
Use the latest version of the NXP TF-A code and add a note about
quirks with GCC 12.
Signed-off-by: Frieder Schrempf <frieder.schrempf@kontron.de>
Convert Note: to ..note::
Signed-off-by: Heinrich Schuchardt <heinrich.schuchardt@canonical.com>
This adds initial support for the Hardkernel Odroid Go Ultra.
The Odroid Go Ultra is a portable gaming device with the following
characteristics:
- Amlogic S922X SoC
- RK817 & RK818 PMICs
- 2GiB LPDDR4
- On board 16GiB eMMC
- Micro SD Card slot
- 5inch 854×480 MIPI-DSI TFT LCD
- Earphone stereo jack, 0.5Watt 8Ω Mono speaker
- Li-Polymer 3.7V/4000mAh Battery
- USB-A 2.0 Host Connector
- x16 GPIO Input Buttons
- 2x ADC Analog Joysticks
- USB-C Port for USB2 Device and Charging
The following are not yet handled:
- Battery RK818 Gauge and Charging
- 5inch 854×480 MIPI-DSI TFT LCD
Link: https://lore.kernel.org/r/20230119-u-boot-odroid-go-ultra-v1-2-f96bab9db396@linaro.org
Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
The function arch_cpu_init_dm was renamed to fsp_setup_pinctrl in these
cases, so rename debug / docs to match.
Cc: Simon Glass <sjg@chromium.org>
Fixes: 7fe32b3442 ("event: Convert arch_cpu_init_dm() to use events")
Signed-off-by: Tom Rini <trini@konsulko.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
Neural Compute Module 2(Neu2) IO board is an industrial form factor
IO board from Edgeble AI.
General features:
- microSD slot
- MIPI DSI connector
- 2x USB Host
- 1x USB OTG
- Ethernet
- mini PCIe
- Onboard PoE
- RS485, RS232, CAN
- Micro Phone array
- Speaker
- RTC battery slot
- 40-pin expansion
Neu2 needs to mount on top of this IO board in order to create complete
Edgeble Neural Compute Module 2(Neu2) IO platform.
Add support for it.
Signed-off-by: Jagan Teki <jagan@edgeble.ai>
Add calibration support for stm32-adc
Linux kernel v6.1 DT synchronization for stm32mp151.dtsi
stm32mp157a-dk1-scmi-u-boot.dtsi update
Add support of OP-TEE and STM32MP13x in bsec driver
ECDSA various fixes for stm32mp
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Merge tag 'u-boot-stm32-20230113' of https://source.denx.de/u-boot/custodians/u-boot-stm
Add driver to manage onboard hub supplies
Add calibration support for stm32-adc
Linux kernel v6.1 DT synchronization for stm32mp151.dtsi
stm32mp157a-dk1-scmi-u-boot.dtsi update
Add support of OP-TEE and STM32MP13x in bsec driver
ECDSA various fixes for stm32mp
When OP-TEE is used, the SMC for BSEC management are not available and
the STM32MP BSEC pseudo TA must be used (it is mandatory for STM32MP13
and it is a new feature for STM32MP15x).
The BSEC driver try to open a session to this PTA BSEC at probe
and use it for OTP read or write access to fuse or to shadow.
This patch also adapts the commands stm32key and stboard to handle
the BSEC_LOCK_PERM lock value instead of 1.
Signed-off-by: Patrick Delaunay <patrick.delaunay@foss.st.com>
Reviewed-by: Patrice Chotard <patrice.chotard@foss.st.com>
qemu can emulate also e500v1 core but cannot emulate CPUs from Freescale
PowerPC QorIQ T and P series.
Signed-off-by: Pali Rohár <pali@kernel.org>
Signed-off-by: Heinrich Schuchardt <heinrich.schuchardt@canonical.com>
Texas Instrument's entire K3 generation of SoCs use much of the same
frameworks and boot flow, especially at the uboot level. Though there
are small differences introduced as each new K3 based SoC is developed
and as the K3 generation matures that will also need to be documented.
Rather than copying the same documentation, with the small differences
applicable to that specific SoC to a new page, introduce a new K3
page that can describe the general boot flow and design decisions for
the entire K3 generation of chips, leaving the specifics for that
particular SoC to a unique sub-page below this one.
Signed-off-by: Bryan Brattlof <bb@ti.com>
Signed-off-by: Heinrich Schuchardt <heinrich.schuchardt@canonical.com>
Texas Instruments produces quite a lot of SoCs based upon a common
architecture 'generation'. (eg: OMAP, K3) TI's existing documentation
layout makes noticing this generation jump rather difficult.
To make navigation easier, split the existing documentation into
individual SoC families so we may begin grouping them according to their
generational (eg: OMAP, K3) families.
Signed-off-by: Bryan Brattlof <bb@ti.com>
Reviewed-by: Heinrich Schuchardt <heinrich.schuchardt@canonical.com>
The rest of the unmigrated CONFIG symbols in the CONFIG_SYS_NAND
namespace do not easily transition to Kconfig. In many cases they likely
should come from the device tree instead. Move these out of CONFIG
namespace and in to CFG namespace.
Signed-off-by: Tom Rini <trini@konsulko.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
* BASH code should be labeled as such.
* Code blocks should be indented by 4 spaces.
Fix these here.
Suggested-by: Heinrich Schuchardt <xypron.glpk@gmx.de>
Signed-off-by: Andrew Davis <afd@ti.com>
Reviewed-by: Heinrich Schuchardt <xypron.glpk@gmx.de>
Add example command how to compile U-Boot and add new documentation section
describing how to enable early debug UART and verbose log output for N900.
Signed-off-by: Pali Rohár <pali@kernel.org>
Switch to use binman to pack images
Signed-off-by: Oliver Graute <oliver.graute@kococonnector.com>
Reviewed-by: Fabio Estevam <festevam@denx.de>
Reviewed-by: Simon Glass <sjg@chromium.org>
Reviewed-by: Peng Fan <peng.fan@nxp.com>
The current name is inconsistent with SPL which uses CONFIG_SPL_TEXT_BASE
and this makes it imposible to use CONFIG_VAL().
Rename it to resolve this problem.
Signed-off-by: Simon Glass <sjg@chromium.org>
