Commit graph

87573 commits

Author SHA1 Message Date
Christian Taedcke
289e6007cf binman: Add tests for etype encrypted
Add tests to reach 100% code coverage for the added etype encrypted.

Signed-off-by: Christian Taedcke <christian.taedcke@weidmueller.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
2023-07-24 09:34:10 -06:00
Christian Taedcke
dcd3d76b7b binman: Allow cipher node as special section
The new encrypted etype generates a cipher node in the device tree
that should not be evaluated by binman, but still be kept in the
output device tree.

Signed-off-by: Christian Taedcke <christian.taedcke@weidmueller.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
2023-07-24 09:34:10 -06:00
Christian Taedcke
473e5206f0 binman: Add support for externally encrypted blobs
This adds a new etype encrypted.

It creates a new cipher node in the related image similar to the
cipher node used by u-boot, see boot/image-cipher.c.

Signed-off-by: Christian Taedcke <christian.taedcke@weidmueller.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
2023-07-24 09:34:10 -06:00
Simon Glass
df11aa7d74 binman: Add missing ssl documentation
Rerun 'binman bintool-docs' to regenerate bintools.rst

Signed-off-by: Simon Glass <sjg@chromium.org>
2023-07-24 09:33:55 -06:00
Simon Glass
a6b44acaf5 binman: Renumber 277...289 TI test files
These have ended up with the same numbers as earlier files. Fix them.

Signed-off-by: Simon Glass <sjg@chromium.org>
2023-07-24 09:33:55 -06:00
Simon Glass
176f1f68fa binman: Renumber 277_rockchip and 278_mkimage test files
These have ended up with the same numbers as earlier files. Fix them.

Signed-off-by: Simon Glass <sjg@chromium.org>
2023-07-24 09:33:55 -06:00
Simon Glass
efda8ab201 binman: Tidy up tests for pre-load entry type
Drop the use of a numbered key file since numbering is just for the test
devicetree files. Also adjust the tests to avoid putting a hard-coded
path to binman in the file, using the entry arg instead.

Signed-off-by: Simon Glass <sjg@chromium.org>
2023-07-24 09:33:55 -06:00
Tom Rini
be71a05a41 Merge branch '2023-07-22-TI-binman-and-K3-improvements'
- Migrate TI K3 platforms to using binman to generate all images, and
  then improve the platform slightly.
2023-07-23 21:46:05 -04:00
Tom Rini
f586cdaef9 CI: Make use of buildman requirements.txt
Now that buildman has a requirements.txt file we need to make use of it.

Reviewed-by: Simon Glass <sjg@chromium.org>
[n-francis@ti.com: Adding missing command from .azure-pipelines.yml]
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
Signed-off-by: Tom Rini <trini@konsulko.com>
2023-07-21 19:36:59 -04:00
Tom Rini
e381b12210 buildman: Create a requirements.txt file
At this point, buildman requires a few different modules and so we need
a requirements.txt to track what modules are needed.

Cc: Simon Glass <sjg@chromium.org>
Cc: Neha Malcom Francis <n-francis@ti.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
Signed-off-by: Tom Rini <trini@konsulko.com>
2023-07-21 19:36:59 -04:00
Andrew Davis
15432ea611 binman: Overwrite symlink if it already exists
Without this re-building will fail with an error when trying to create
the symlink for the second time with an already exists error.

Signed-off-by: Andrew Davis <afd@ti.com>
[n-francis@ti.com: Added support for test output dir and testcase]
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:59 -04:00
Neha Malcom Francis
1ee652ab2f doc: board: ti: Update documentation for binman flow
Earlier documentation specified builds for generating bootloader images
using an external TI repository k3-image-gen and core-secdev-k3. Modify
this to using the binman flow so that user understands how to build the
final boot images.

Reviewed-by: Simon Glass <sjg@chromium.org>
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:59 -04:00
Neha Malcom Francis
8db194d046 k3: tools: config.mk: Update makefile and remove scripts
Since binman is used to package bootloader images for all K3 devices, we
do not have to rely on the earlier methods to package them.

Scripts that were used to generate x509 certificate for tiboot3.bin and
generate tispl.bin, u-boot.img have been removed.

Reviewed-by: Simon Glass <sjg@chromium.org>
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:59 -04:00
Neha Malcom Francis
9da80e7917 arm: k3-am65x-iot2050: Use binman for tispl.bin for iot2050
Move to using binman to generate tispl.bin which is used to generate the
final flash.bin bootloader for iot2050 boards.

Cc: Jan Kiszka <jan.kiszka@siemens.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:59 -04:00
Neha Malcom Francis
6d6228ab8f am62a: dts: binman: Package tiboot3.bin, tispl.bin, u-boot.img
Support added for HS-SE, HS-FS and GP boot binaries for AM62ax.

HS-SE:
    * tiboot3-am62ax-hs-evm.bin
    * tispl.bin
    * u-boot.img

HS-FS:
    * tiboot3-am62ax-hs-fs-evm.bin
    * tispl.bin
    * u-boot.img

GP:
    * tiboot3.bin --> tiboot3-am62ax-gp-evm.bin
    * tispl.bin_unsigned
    * u-boot.img_unsigned

It is to be noted that the bootflow followed by AM62ax requires:

tiboot3.bin:
	* R5 SPL
	* R5 SPL dtbs
	* TIFS
	* board-cfg
	* pm-cfg
	* sec-cfg
	* rm-cfg

tispl.bin:
	* DM
	* ATF
	* OP-TEE
	* A72 SPL
	* A72 SPL dtbs

u-boot.img:
	* A72 U-Boot
	* A72 U-Boot dtbs

Reviewed-by: Simon Glass <sjg@chromium.org>
[afd@ti.com: changed output binary names appropriately]
Signed-off-by: Andrew Davis <afd@ti.com>
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:59 -04:00
Neha Malcom Francis
01e0127753 am62a: yaml: Add board configs for AM62ax
Added YAML configs for AM62ax

Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:59 -04:00
Neha Malcom Francis
ce46f51990 am625: dts: binman: Package tiboot3.bin, tispl.bin and u-boot.img
Support added for HS-SE, HS-FS and GP boot binaries for AM62.

HS-SE:
    * tiboot3-am62x-hs-evm.bin
    * tispl.bin
    * u-boot.img

HS-FS:
    * tiboot3-am62x-hs-fs-evm.bin
    * tispl.bin
    * u-boot.img

GP:
    * tiboot3.bin --> tiboot3-am62x-gp-evm.bin
    * tispl.bin_unsigned
    * u-boot.img_unsigned

It is to be noted that the bootflow followed by AM62 requires:

tiboot3.bin:
	* R5 SPL
	* R5 SPL dtbs
	* TIFS
	* board-cfg
	* pm-cfg
	* sec-cfg
	* rm-cfg

tispl.bin:
	* DM
	* ATF
	* OP-TEE
	* A72 SPL
	* A72 SPL dtbs

u-boot.img:
	* A72 U-Boot
	* A72 U-Boot dtbs

Reviewed-by: Simon Glass <sjg@chromium.org>
[afd@ti.com: changed output binary names appropriately]
Signed-off-by: Andrew Davis <afd@ti.com>
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:59 -04:00
Neha Malcom Francis
0eba798b41 am62: yaml: Add board configs for AM62
Added YAML configs for AM62

Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:58 -04:00
Neha Malcom Francis
106589aae7 j721s2: dts: binman: Package tiboot3.bin, tispl.bin and u-boot.img
Support has been added for both HS-SE, HS-FS  and GP images.

HS-SE:
    * tiboot3-j721s2-hs-evm.bin
    * tispl.bin
    * u-boot.img

HS-FS:
    * tiboot3-j721s2-hs-fs-evm.bin
    * tispl.bin
    * u-boot.img

GP:
    * tiboot3.bin --> tiboot3-j721s2-gp-evm.bin
    * tispl.bin_unsigned
    * u-boot.img_unsigned

It is to be noted that the bootflow followed by J721S2 requires:

tiboot3.bin:
	* R5 SPL
	* R5 SPL dtbs
	* TIFS
	* board-cfg
	* pm-cfg
	* sec-cfg
	* rm-cfg

tispl.bin:
	* DM
	* ATF
	* OP-TEE
	* A72 SPL
	* A72 SPL dtbs

u-boot.img:
	* A72 U-Boot
	* A72 U-Boot dtbs

Reviewed-by: Simon Glass <sjg@chromium.org>
[afd@ti.com: changed output binary names appropriately]
Signed-off-by: Andrew Davis <afd@ti.com>
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:58 -04:00
Neha Malcom Francis
267a4845c9 j721s2: yaml: Add board configs for J721S2
Added YAML configs for J721S2

Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:58 -04:00
Neha Malcom Francis
1bc527e8f4 am64x: dts: binman: Package tiboot3.bin, tispl.bin u-boot.img
Support added for HS and GP boot binaries for AM64x.

HS-SE:
    * tiboot3-am64x_sr2-hs-evm.bin
    * tispl.bin
    * u-boot.img

HS-FS:
    * tiboot3-am64x_sr2-hs-fs-evm.bin
    * tispl.bin
    * u-boot.img

GP:
    * tiboot3.bin --> tiboot3-am64x-gp-evm.bin
    * tispl.bin_unsigned
    * u-boot.img_unsigned

Note that the bootflow followed by AM64x requires:

tiboot3.bin:
	* R5 SPL
	* R5 SPL dtbs
	* sysfw
	* board-cfg
	* pm-cfg
	* sec-cfg
	* rm-cfg

tispl.bin:
	* ATF
	* OP-TEE
	* A53 SPL
	* A53 SPL dtbs

u-boot.img:
	* A53 U-Boot
	* A53 U-Boot dtbs

Reviewed-by: Simon Glass <sjg@chromium.org>
[afd@ti.com: changed output binary names appropriately]
Signed-off-by: Andrew Davis <afd@ti.com>
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:58 -04:00
Neha Malcom Francis
640bf9dd8e am64x: yaml: Add board configs for AM64x
Added YAML configs for AM64xx

Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:58 -04:00
Neha Malcom Francis
77c29cb1b6 am65: dts: binman: Package tiboot3.bin, sysfw.itb, tispl.bin, u-boot.img
Support has been added for both HS-SE(SR 2.0) and GP(SR 2.0) images.

HS-SE:
	* tiboot3-am65x_sr2-hs-evm.bin
	* sysfw-am65x_sr2-hs-evm.itb
	* tispl.bin
	* u-boot.img

GP:
	* tiboot3.bin --> tiboot3-am65x_sr2-gp-evm.bin
	* sysfw.itb --> sysfw-am65x_sr2-gp-evm.itb
	* tispl.bin_unsigned
	* u-boot.img_unsigned

Note that the bootflow followed by AM65x requires:

tiboot3.bin:
	* R5 SPL
	* R5 SPL dtbs
sysfw.itb:
	* sysfw
	* board-cfg
	* pm-cfg
	* sec-cfg
	* rm-cfg

tispl.bin:
	* ATF
	* OP-TEE
	* A53 SPL
	* A53 SPL dtbs

u-boot.img:
	* A53 U-Boot
	* A53 U-Boot dtbs

Reviewed-by: Simon Glass <sjg@chromium.org>
[afd@ti.com: changed output binary names appropriately]
Signed-off-by: Andrew Davis <afd@ti.com>
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:58 -04:00
Neha Malcom Francis
27ebb1517f am65x: yaml: Add AM65x board config files
Added YAML configs for AM65x

Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:58 -04:00
Neha Malcom Francis
ca5f1e25e5 j7200: dts: binman: Package tiboot3.bin, tispl.bin, u-boot.img
Support has been added for both HS-SE(SR 2.0), HS-FS(SR 2.0) and GP
images.

HS-SE:
	* tiboot3-j7200_sr2-hs-evm.bin
	* tispl.bin
	* u-boot.img

HS-FS:
	* tiboot3-j7200_sr2-hs-fs-evm.bin
	* tispl.bin
	* u-boot.img

GP:
	* tiboot3.bin --> tiboot3-j7200-gp-evm.bin
	* tispl.bin_unsigned
	* u-boot.img_unsigned

It is to be noted that the bootflow followed by J7200 requires:

tiboot3.bin:
	* R5 SPL
	* R5 SPL dtbs
	* TIFS
	* board-cfg
	* pm-cfg
	* sec-cfg
	* rm-cfg

tispl.bin:
	* DM
	* ATF
	* OP-TEE
	* A72 SPL
	* A72 SPL dtbs

u-boot.img:
	* A72 U-Boot
	* A72 U-Boot dtbs

Reviewed-by: Simon Glass <sjg@chromium.org>
[afd@ti.com: changed output binary names appropriately]
Signed-off-by: Andrew Davis <afd@ti.com>
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:58 -04:00
Neha Malcom Francis
e6135b0614 j7200: yaml: Add J7200 board config files
Added YAML configs for J7200

Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:58 -04:00
Neha Malcom Francis
177178685a j721e: dts: binman: Package tiboot3.bin, sysfw.itb, tispl.bin, u-boot.img
By providing entries in the binman node of the device tree, binman will
be able to find and package board config artifacts generated by
TIBoardConfig with sysfw.bin and generate the final image sysfw.itb.
It will also pick out the R5 SPL and sign it with the help of TI signing
entry and generate the final tiboot3.bin.

Entries for A72 build have been added to k3-j721e-binman.dtsi to
generate tispl.bin and u-boot.img.

Support has been added for both HS-SE(SR 1.1), HS-FS(SR 2.0) and GP images
In HS-SE, the encrypted system firmware binary must be signed along with
the signed certificate binary.

HS-SE:
	* tiboot3-j721e_sr1_1-hs-evm.bin
	* sysfw-j721e_sr1_1-hs-evm.itb
	* tispl.bin
	* u-boot.img

HS-FS:
	* tiboot3-j721e_sr2-hs-fs-evm.bin
	* sysfw-j721e_sr2-hs-fs-evm.itb
	* tispl.bin
	* u-boot.img

GP:
	* tiboot3.bin -->tiboot3-j721e-gp-evm.bin
	* sysfw.itb --> sysfw-j721e-gp-evm.itb
	* tispl.bin_unsigned
	* u-boot.img_unsigned

It is to be noted that the bootflow followed by J721E requires:

tiboot3.bin:
	* R5 SPL
	* R5 SPL dtbs

sysfw.itb:
	* TIFS
	* board-cfg
	* pm-cfg
	* sec-cfg
	* rm-cfg

tispl.bin:
	* DM
	* ATF
	* OP-TEE
	* A72 SPL
	* A72 SPL dtbs

u-boot.img:
	* A72 U-Boot
	* A72 U-Boot dtbs

Reviewed-by: Simon Glass <sjg@chromium.org>
[afd@ti.com: changed output binary names appropriately]
Signed-off-by: Andrew Davis <afd@ti.com>
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:58 -04:00
Neha Malcom Francis
11ee37962e j721e: schema: yaml: Add general schema and J721E board config files
Schema file in YAML must be provided in board/ti/common for validating
input config files and packaging system firmware. The schema includes
entries for rm-cfg, board-cfg, pm-cfg and sec-cfg.

Board config files must be provided in board/ti/<devicename> in YAML.
These can then be consumed for generation of binaries to package system
firmware. Added YAML configs for J721E in particular.

Signed-off-by: Tarun Sahu <t-sahu@ti.com>
[n-francis@ti.com: prepared patch for upstreaming]
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:58 -04:00
Neha Malcom Francis
9b03bfe105 arm: dts: k3: Add support for packaging sysfw.itb and tiboot3.bin
Board config binary artifacts must be generated to be used by binman to
package sysfw.itb and tiboot3.bin for all K3 devices.

For devices that follow combined flow, these board configuration
binaries must again be packaged into a combined board configuration
blobs to be used by binman to package tiboot3.bin.

Add common k3-binman.dtsi to generate all the board configuration
binaries needed.

Also add custMpk.pem and ti-degenerate-key.pem needed for signing GP and
HS bootloader images common to all K3 devices.

Reviewed-by: Simon Glass <sjg@chromium.org>
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:58 -04:00
Neha Malcom Francis
78144826bb binman: ti-secure: Add support for TI signing
The ti-secure entry contains certificate for binaries that will be
loaded or booted by system firmware whereas the ti-secure-rom entry
contains certificate for binaries that will be booted by ROM. Support
for both these types of certificates is necessary for booting of K3
devices.

Reviewed-by: Simon Glass <sjg@chromium.org>
[vigneshr@ti.com: fixed inconsist cert generation by multiple packing]
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:58 -04:00
Neha Malcom Francis
6c66ccf26c binman: ti-board-config: Add support for TI board config binaries
The ti-board-config entry loads and validates a given YAML config file
against a given schema, and generates the board config binary. K3
devices require these binaries to be packed into the final system
firmware images.

Reviewed-by: Simon Glass <sjg@chromium.org>
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:58 -04:00
Tom Rini
247aa5a191 Merge branch '2023-07-21-assorted-TI-platform-updates'
- The first half of a number of TI platform bugfixes and improvements,
  primarily around K3 platforms and splash screen support.
2023-07-21 19:33:05 -04:00
Samuel Dionne-Riel
373991d693 common: Kconfig: Fix CMD_BMP/BMP dependency
Using `default y` will not select BMP when CMD_BMP has been enabled, if
it was already configured.

By using `select`, if `CMD_BMP` is turned on, it will force the presence
of `BMP`.

Fixes: 072b0e16c4 ("common: Kconfig: Add BMP configs")
Signed-off-by: Samuel Dionne-Riel <samuel@dionne-riel.com>
Signed-off-by: Nikhil M Jain <n-jain1@ti.com>
2023-07-21 15:32:12 -04:00
Nikhil M Jain
a72532fa19 doc: board: ti: am62x_sk: Add A53 SPL DDR layout
To understand usage of DDR in A53 SPL stage, add a table showing region
and space used by major components of SPL.

Signed-off-by: Nikhil M Jain <n-jain1@ti.com>
Reviewed-by: Tom Rini <trini@konsulko.com>
2023-07-21 15:32:12 -04:00
Nikhil M Jain
1f7682383f configs: am62x_evm_a53: Add bloblist address
Set bloblist address to 0x80D00000.

Signed-off-by: Nikhil M Jain <n-jain1@ti.com>
Reviewed-by: Devarsh Thakkar <devarsht@ti.com>
2023-07-21 15:32:12 -04:00
Nikhil M Jain
954b0ad4a2 common: spl: spl: Remove video driver
Use config SPL_VIDEO_REMOVE to remove video driver at SPL stage before
jumping to next stage, in place of CONFIG_SPL_VIDEO, to allow user to
remove video if required.

Signed-off-by: Nikhil M Jain <n-jain1@ti.com>
Reviewed-by: Devarsh Thakkar <devarsht@ti.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
2023-07-21 15:32:12 -04:00
Nikhil M Jain
63e73a13e9 drivers: video: Kconfig: Add config remove video
This is required since user may want to either call the remove method
of video driver and reset the display or not call the remove method
to continue displaying until next stage.

Signed-off-by: Nikhil M Jain <n-jain1@ti.com>
Reviewed-by: Devarsh Thakkar <devarsht@ti.com>
Reviewed-by: Tom Rini <trini@konsulko.com>
2023-07-21 15:32:12 -04:00
Nikhil M Jain
5bc610a7d9 common: board_f: Pass frame buffer info from SPL to u-boot
U-boot proper can use frame buffer address passed from SPL to reserve
the memory area used by framebuffer set in SPL so that splash image
set in SPL continues to get displayed while u-boot proper is running.

Put the framebuffer address and size in a bloblist to make them
available at u-boot proper, if in u-boot proper CONFIG_VIDEO is defined.

Signed-off-by: Nikhil M Jain <n-jain1@ti.com>
Reviewed-by: Devarsh Thakkar <devarsht@ti.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
2023-07-21 15:32:12 -04:00
Nikhil M Jain
ccd21ee50e include: video: Reserve video using blob
Add method to reserve video framebuffer information using blob,
received from previous stage.

Signed-off-by: Nikhil M Jain <n-jain1@ti.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
2023-07-21 15:32:12 -04:00
Nikhil M Jain
12fdacea5a board: ti: am62x: evm: Update function calls for splash screen
Use spl_dcache_enable, in place of setup_dram, arch_reserve_mmu to set
up pagetable, initialise DRAM and enable Dcache to avoid multiple
function calls.

Check for CONFIG_SPL_VIDEO in place of CONFIG_SPL_VIDEO_TIDSS to prevent
any build failure in case video config is not defined and video related
functions are called.

Check for CONFIG_SPL_SPLASH_SCREEN and CONFIG_SPL_BMP before calling
splash_display to avoid compilation failure.

Signed-off-by: Nikhil M Jain <n-jain1@ti.com>
2023-07-21 15:32:12 -04:00
Nikhil M Jain
dd5d1c5dcc arch: arm: mach-k3: common: Return a pointer after setting page table
In spl_dcache_enable after setting up page table, set gd->relocaddr
pointer to tlb_addr, to get next location to reserve memory. Align
tlb_addr with 64KB address.

Signed-off-by: Nikhil M Jain <n-jain1@ti.com>
Reviewed-by: Devarsh Thakkar <devarsht@ti.com>
2023-07-21 15:32:12 -04:00
Nikhil M Jain
149fb05b83 common: spl: spl: Update stack pointer address
At SPL stage when stack is relocated, the stack pointer needs to be
updated, the stack pointer may point to stack in on chip memory even
though stack is relocated.

Signed-off-by: Nikhil M Jain <n-jain1@ti.com>
Reviewed-by: Tom Rini <trini@konsulko.com>
2023-07-21 15:32:12 -04:00
Bryan Brattlof
efda93c6b5 arm: mach-k3: am62a7: change some prints to debug prints
There is little need to print the devstat information or when we exit a
function during a typical boot. Remove them to reduce the noise during
typical operation

Signed-off-by: Bryan Brattlof <bb@ti.com>
2023-07-21 15:32:12 -04:00
Bryan Brattlof
af7c33c103 ram: k3-ddrss: do not touch ctrl regs during training
During LPDDR initialization we will loop through a series of frequency
changes in order to train at the various operating frequencies. During
this training, accessing the DRAM_CLASS bitfield could happen during a
frequency change and cause the read to hang.

Store the DRAM type into the main structure to avoid multiple readings
while the independent phy is training.

Signed-off-by: Bryan Brattlof <bb@ti.com>
2023-07-21 15:32:12 -04:00
Tom Rini
7c97b715e9 arm: omap2: Fix warning in force_emif_self_refresh
The function declaration for force_emif_self_refresh takes no parameters
but does not specify this, only the prototype in the headers do.  As
clang will warn about this, correct it.

Signed-off-by: Tom Rini <trini@konsulko.com>
2023-07-21 15:32:12 -04:00
Andrew Davis
300e475967 configs: k2x_evm: Always include FIT loading support
Non-HS boards can use FIT images so include the env var commands
for these unconditionally.

Signed-off-by: Andrew Davis <afd@ti.com>
Reviewed-by: Nishanth Menon <nm@ti.com>
2023-07-21 15:32:12 -04:00
Emanuele Ghidoli
70aa5a94d4 arm: mach-k3: am62: Fixup CPU core, gpu and pru nodes in fdt
AM62x SoC is available in multiple variant:
- CPU cores (Cortex-A) AM62x1 (1 core), AM62x2 (2 cores), AM62x4 (4 cores)
- GPU AM625x with GPU, AM623x without GPU
- PRU (Programmable RT unit) can be present or not on AM62x2/AM62x4

Remove the relevant FDT nodes by reading the actual configuration
from the SoC registers, with that change is possible to have a single
dts/dtb file handling the different variant at runtime.
While removing GPU node and CPU nodes also the watchdog node
in the same Module Domain is removed.

A similar approach is implemented for example on i.MX8 and STM32MP1 SoC.

Signed-off-by: Emanuele Ghidoli <emanuele.ghidoli@toradex.com>
Signed-off-by: Francesco Dolcini <francesco.dolcini@toradex.com>
2023-07-21 15:32:12 -04:00
Emanuele Ghidoli
de3db25231 arm: mach-k3: am62: Add CTRLMMR_WKUP_JTAG_DEVICE_ID register definition
Add register address and relevant bitmasks and shifts.
Allow reading these information:
- device identification
- number of cores (part of device identification)
- features (currently: PRU / no PRU)
- security
- functional safety
- speed grade
- temperature grade
- package

Signed-off-by: Emanuele Ghidoli <emanuele.ghidoli@toradex.com>
Signed-off-by: Francesco Dolcini <francesco.dolcini@toradex.com>
Reviewed-by: Andrew Davis <afd@ti.com>
2023-07-21 15:32:12 -04:00
Emanuele Ghidoli
7b7288df34 arm: k3: Fix ft_system_setup so it can be enabled on any SoC
ft_system_setup cannot be enabled on SoC without msmc sram otherwise
fdt_fixup_msmc_ram function fails causing system reset.

Fix by moving fdt_fixup_msmc_ram to common_fdt.c file and creating
SoC (AM654, J721E and J721S2) specific files for fdt fixups.

This change was verified to not change anything on any existing board
(all the J721S2, AM654 and J721E boards requires it,
none of the remaining k3 boards require it).

Fixes: 30e96a2401 ("arm: mach-k3: Move MSMC fixup to SoC level")
Signed-off-by: Emanuele Ghidoli <emanuele.ghidoli@toradex.com>
Signed-off-by: Francesco Dolcini <francesco.dolcini@toradex.com>
2023-07-21 15:32:12 -04:00
Nishanth Menon
f40f54bfed arm: dts: Fix build of am62a7 dtbs
am62a7 should be built with CONFIG_SOC_K3_AM62A7 not CONFIG_SOC_K3_AM625

Fixes: 6bdfa69155 ("arm: dts: introduce am62a7 u-boot dtbs")
Cc: Bryan Brattlof <bb@ti.com>
Cc: Vignesh Raghavendra <vigneshr@ti.com>
Cc: Francesco Dolcini <francesco@dolcini.it>
Cc: Sjoerd Simons <sjoerd@collabora.com>
Cc: Wadim Egorov <w.egorov@phytec.de>
Reviewed-by: Bryan Brattlof <bb@ti.com>
Reviewed-by: Mattijs Korpershoek <mkorpershoek@baylibre.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
2023-07-21 15:32:12 -04:00