Current codes assume the OPTEE address is at the end of first DRAM bank.
Adjust the process to allow OPTEE in the middle of first bank.
When OPTEE memory is removed from first bank, it may split the first bank
to two banks, adjust the MMU table for the split case,
Since the default CONFIG_NR_DRAM_BANKS is 4, it is enough, just enlarge
i.MX8MP evk to default to avoid issue.
Signed-off-by: Ye Li <ye.li@nxp.com>
Signed-off-by: Silvano di Ninno <silvano.dininno@nxp.com>
Tested-by: Silvano di Ninno <silvano.dininno@nxp.com>
Signed-off-by: Peng Fan <peng.fan@nxp.com>
We use non-dm code to configure the clk settings in order to simplify
dm clk driver in future, so remove the duplicated code from clk driver
Signed-off-by: Peng Fan <peng.fan@nxp.com>
To fused part, we need to disable nodes of dtb to let kernel boot.
To mfgtool, USB issue when using super-speed for mfgtool, temporally
work around the problem to use high-speed only.
Signed-off-by: Peng Fan <peng.fan@nxp.com>
To use one defconfig for all boot device, we have to runtime set
env offset and return env medium according to the boot device.
This patch overrides the env_get_offset and env_get_location to
implement the feature.
Signed-off-by: Ye Li <ye.li@nxp.com>
Signed-off-by: Peng Fan <peng.fan@nxp.com>
iMX8MP has 6 fused parts in each qualification tier, with core, VPU,
ISP, NPU or DSP fused respectively.
The configuration tables for enabled modules:
MIMX8ML8DVNLZAA Quad Core, VPU, NPU, ISP, DSP
MIMX8ML7DVNLZAA Quad Core, NPU, ISP
MIMX8ML6DVNLZAA Quad Core, VPU, ISP
MIMX8ML5DVNLZAA Quad Core, VPU
MIMX8ML4DVNLZAA Quad Lite
MIMX8ML3DVNLZAA Dual Core, VPU, NPU, ISP, DSP
Add the support in U-Boot
Reviewed-by: Peng Fan <peng.fan@nxp.com>
Signed-off-by: Ye Li <ye.li@nxp.com>
Signed-off-by: Peng Fan <peng.fan@nxp.com>
ROM SError happens on two cases:
1. ERR050342, on iMX8MQ HDCP enabled parts ROM writes to GPV1 register, but
when ROM patch lock is fused, this write will cause SError.
2. ERR050350, on iMX8MQ/MM/MN, when the field return fuse is burned, HAB
is field return mode, but the last 4K of ROM is still protected and cause
SError.
Since ROM mask SError until ATF unmask it, so then ATF always meets the
exception. This patch works around the issue in SPL by enabling SPL
Exception vectors table and the SError exception, take the exception
to eret immediately to clear the SError.
Signed-off-by: Ye Li <ye.li@nxp.com>
Signed-off-by: Peng Fan <peng.fan@nxp.com>
Add imx_eqos_txclk_set_rate/imx_get_eqos_csr_clk to override the
weak function in driver
Add set_clk_eqos to configure eQoS clk
Signed-off-by: Peng Fan <peng.fan@nxp.com>
Current DM CLK is a bit complicated, for simplity, let DM clk only
support enable/disable/get_rate. For the expected rate settings,
we use non-DM clk to do that. Then we could have simple DM clk for
i.MX and could also share between SPL/U-Boot proper.
Signed-off-by: Peng Fan <peng.fan@nxp.com>
A53 CCM root max support 1GHz, to support high freq, we need
to switch ARM clk sources from ARM PLL directly.
Signed-off-by: Peng Fan <peng.fan@nxp.com>
Add clocks for FEC and flexspi, and add set parent clock callback,
so DTS can assign clocks
Signed-off-by: Ye Li <ye.li@nxp.com>
Signed-off-by: Peng Fan <peng.fan@nxp.com>
Add USB relevant clocks to support usb clock settings for both
DM USB host and gadget drivers
Signed-off-by: Ye Li <ye.li@nxp.com>
Signed-off-by: Peng Fan <peng.fan@nxp.com>
Add set clock parent support.
Add ENET and flexspi related clocks to support assigned clocks
Signed-off-by: Ye Li <ye.li@nxp.com>
Signed-off-by: Peng Fan <peng.fan@nxp.com>
The soc info without initialization value should be put into
data section. The driver could be used before relocation,
with it in BSS section could cause issue, since BSS section
is not initializated and it might overwrite other areas that
used by others, such as dtb.
Signed-off-by: Peng Fan <peng.fan@nxp.com>
The soc info without initialization value should be put into
data section. The driver could be used before relocation,
with it in BSS section could cause issue, since BSS section
is not initializated and it might overwrite other areas that
used by others, such as dtb.
Signed-off-by: Peng Fan <peng.fan@nxp.com>
The soc info without initialization value should be put into
data section. The driver could be used before relocation,
with it in BSS section could cause issue, since BSS section
is not initializated and it might overwrite other areas that
used by others, such as dtb.
Signed-off-by: Peng Fan <peng.fan@nxp.com>
Add logic to automatically update umctl2's setting based
on phy training CDD value for rank to rank space issue
Acked-by: Ye Li <ye.li@nxp.com>
Signed-off-by: Oliver Chen <Oliver.Chen@nxp.com>
Signed-off-by: Jacky Bai <ping.bai@nxp.com>
Signed-off-by: Peng Fan <peng.fan@nxp.com>
In uMCTL2 Databook, for LPDDR4, it is recommended to set
this register to 1. This can avoid ddr bandwidth is lower
after booting with running for a while.
Reviewed-by: Ye Li <ye.li@nxp.com>
Signed-off-by: Jian Li <jian.li@nxp.com>
Signed-off-by: Peng Fan <peng.fan@nxp.com>
1. set SCHED.rdwr_idle_gap=0
2. set SCHED.pageclose=1
Reviewed-by: Jacky Bai <ping.bai@nxp.com>
Signed-off-by: Jian Li <jian.li@nxp.com>
Signed-off-by: Peng Fan <peng.fan@nxp.com>
the DRAM Controller in i.MX8MP will support a feature called "Inline ECC".
This is supported for all 3 supported DRAM technologies (LPDDR4, DDR4 and
DDR3L). When this feature is enabled by software, the DRAM Controller
reserves 12.5% of DRAM capacity for ECC information, and presents only
the non-ECC portion (lower 87.5% of the installed capacity of DRAM) to
the rest of the SoC.
The DRAM memory can be divided into 8 regions so that if a use case only
requires ECC protection on a subset of memory, then only that subset of
memory need support inline ECC. If this occurs, then there is no
performance penalty accessing the non-ECC-protected memory (no need to
access ECC for this portion of the memory map). This is all configured
with the DRAM Controller.
Signed-off-by: Sherry Sun <sherry.sun@nxp.com>
Signed-off-by: Peng Fan <peng.fan@nxp.com>
The 'selfref_en' should be bit'0', so correct the setting to
enable the auto self-refresh.
Reviewed-by: Jian Li <jian.li@nxp.com>
Reviewed-by: Ye Li <ye.li@nxp.com>
Signed-off-by: Jacky Bai <ping.bai@nxp.com>
Signed-off-by: Peng Fan <peng.fan@nxp.com>
There is no DDR_SS_GPR0 exits on i.MX8MN, so skip setting
this register on i.MX8MN.
Signed-off-by: Jacky Bai <ping.bai@nxp.com>
Signed-off-by: Peng Fan <peng.fan@nxp.com>
Up to now UEFI variables where stored in U-Boot environment variables.
Saving UEFI variables was not possible without saving the U-Boot
environment variables. With this patch series file ubootefi.var in the
EFI system partition is used for saving UEFI variables. Furthermore the
UEFI variables are exposed for reading at runtime.
Code corrections for UEFI secure boot are provided.
A buffer overrun in the RSA library is fixed.
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Merge tag 'efi-2020-10-rc1-3' of https://gitlab.denx.de/u-boot/custodians/u-boot-efi
Pull request for UEFI sub-system for efi-2020-10-rc1 (3)
Up to now UEFI variables where stored in U-Boot environment variables.
Saving UEFI variables was not possible without saving the U-Boot
environment variables. With this patch series file ubootefi.var in the
EFI system partition is used for saving UEFI variables. Furthermore the
UEFI variables are exposed for reading at runtime.
Code corrections for UEFI secure boot are provided.
A buffer overrun in the RSA library is fixed.
Replace the function spl_board_prepare_for_boot_linux by the correct
name of the weak function spl_board_prepare_for_linux defined in spl.h.
Signed-off-by: Patrick Delaunay <patrick.delaunay@st.com>
In commit commit d2c05f50e1 ("mmc: omap_hsmmc: Set 3.3V for IO voltage")
was changed 3.0V IO voltage to 3.3V but it was not done on all places in
omap_hsmmc driver. That commit broke eMMC support on Nokia N900.
This patch fixes that problematic commit and changes 3.0V to 3.3V on all
remaining places in omap_hsmmc driver.
Fixes: d2c05f50e1 ("mmc: omap_hsmmc: Set 3.3V for IO voltage")
Signed-off-by: Pali Rohár <pali@kernel.org>
Acked-by: Pavel Machek <pavel@ucw.cz>
Reviewed-by: Faiz Abbas <faiz_abbas@ti.com>
Buiding u-boot-spl-k3[_HS].its is currently unconditionally verbose
about what it does. Change that by wrapping the call to k3_fit_atf.sh
into a cmd, also using that chance to reduce duplicate lines of makefile
code - only IS_HS=1 is different when CONFIG_TI_SECURE_DEVICE is on.
Signed-off-by: Jan Kiszka <jan.kiszka@siemens.com>
Acked-by: Lokesh Vutla <lokeshvutla@ti.com>
At this point in time we can now remove our legacy code and switch to
enabling DM for USB and Ethernet.
Cc: Derald D. Woods <woods.technical@gmail.com>
Cc: Adam Ford <aford173@gmail.com>
Signed-off-by: Tom Rini <trini@konsulko.com>
Tested-by: Derald D. Woods <woods.technical@gmail.com>
There are two options that are currently whitelisted, but they
are redundant, because there are not necessary since Kconfig options
exist to basically state the same thing.
CONFIG_DIRECT_NOR_BOOT and CONFIG_USE_NOR are both set together and
only used by the da850 when booting from NOR, however the only time
CONFIG_MTD_NOR_FLASH is configured is when booting from NOR. Since
NOR doesn't need SPL, the options for SPL can be moved to a check for
building SPL instead of checking for NOR.
This patch removes the checks for these two config options and unifies
the checks around the Kconfig option of CONFIG_MTD_NOR_FLASH.
Since this board is the only board that uses these two config options,
they can be removed from the whitelist table.
Signed-off-by: Adam Ford <aford173@gmail.com>
The documentation states that SPL is enabled in all config options
for the da850. This incorrect, because devices booting from NOR
do not need the SPL to do the low level initializion because when
booting from NOR, the board is able to execute in place (XIP)
This also clarifies that SPL isn't only used for booting from SPI,
because it is also used for booting from MMC and NAND for those
devices supporting those boot options.
Signed-off-by: Adam Ford <aford173@gmail.com>
We only request ring pairs via K3 DMA driver, switch to use the new
k3_ringacc_request_rings_pair() to simplify the code.
As a good side effect, all boot stages now use exposed RING mode which
avoid maintaining proxy mode for 32 bit R5 core.
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
In K3 UDMA architecture, RX rings are associated with RX flows rather
than RX channels, therefore move the ring pointers to udma_rflow struct
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
Encapsulate channel configuration in a separate struct so as to ease
resetting of these fields with memset() and also to increase readability
of the code.
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
In preparation of adding more K3 SoCs, separate soc specific
initialization add a SoC specific initialization hook.
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
Add new API k3_ringacc_request_rings_pair() to request pair of rings at
once, as in the most case Rings are used with DMA channels which required
to request pair of rings - one to feed DMA with descriptors (TX/RX FDQ) and
one to receive completions (RX/TX CQ). This will allow to simplify Ringacc
API users.
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
