Currently the mtdparts commands are included in the jffs2 command support.
This doesn't make sense anymore since other commands (e.g. UBI) use this
infrastructure as well now. This patch separates the mtdparts commands from
the jffs2 commands making it possible to only select mtdparts when no JFFS2
support is needed.
Signed-off-by: Stefan Roese <sr@denx.de>
Signed-off-by: Kyungmin Park <kyungmin.park@samsung.com>
After switching to using the CFI flash driver, the correct remapping
of the flash banks was forgotten.
Also, some boards were not adapted, and the old legacy flash driver
was not removed yet.
Signed-off-by: Wolfgang Denk <wd@denx.de>
With recent toolchains, the environment sectors were no longer aligned to
sector boundaries. The reason was a combination of two bugs:
1) common/environment.c assumed that CONFIG_TQM8xxL would be defined
for all TQM8xxL and TQM8xxM boards. But "include/common.h", where
this gets defined, is not included here (and cannot be included
without causing lots of problems).
Added a new #define CFG_USE_PPCENV for all boards which really
want to put the environment is a ".ppcenv" section.
2) The linker scripts just include environment.o, silently assuming
that the objects in that file are really in the order in which
they are coded in the C file, i. e. "environment" first, then
"redundand_environment", and "env_size" last. However, current
toolchains (GCC-4.x) reorder the objects, causing the environment
data not to start on a flash sector boundary:
Instead of: we got:
40008000 T environment 40008000 T env_size
4000c000 T redundand_environment 40008004 T redundand_environment
40010000 T env_size 4000c004 T environment
Note: this patch fixes just the first part, and cures the alignment
problem by making sure that "env_size" gets placed correctly. However,
we still have a potential issue because primary and redundant
environment sectors are actually swapped, i. e. we have now:
40008000 T redundand_environment
4000c000 T environment
40010000 T env_size
This shall be fixed in the next version.
Signed-off-by: Wolfgang Denk <wd@denx.de>
* Add support for TQM823M, TQM850M, TQM855M and TQM860M modules
* Add support for Am29LV160ML, Am29LV320ML, and Am29LV640ML
mirror bit flash on TQM8xxM modules
