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Modify the SPL build procedure for AM57xx and DRA7xx high-security (HS) device variants to create a secure u-boot_HS.img FIT blob that contains U-Boot and DTB artifacts signed with a TI-specific process based on the CONFIG_TI_SECURE_DEVICE config option and the externally-provided image signing tool. Also populate the corresponding FIT image post processing call to be performed during SPL runtime. Signed-off-by: Daniel Allred <d-allred@ti.com> Signed-off-by: Andreas Dannenberg <dannenberg@ti.com> Reviewed-by: Tom Rini <trini@konsulko.com> |
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evm.c | ||
Kconfig | ||
MAINTAINERS | ||
Makefile | ||
mux_data.h | ||
README |
Summary ======= This document covers various features of the 'dra7xx_evm' build and some related uses. eMMC boot partition use ======================= It is possible, depending on SYSBOOT configuration to boot from the eMMC boot partitions using (name depending on documentation referenced) Alternative Boot operation mode or Boot Sequence Option 1/2. In this example we load MLO and u-boot.img from the build into DDR and then use 'mmc bootbus' to set the required rate (see TRM) and 'mmc partconfig' to set boot0 as the boot device. U-Boot # setenv autoload no U-Boot # usb start U-Boot # dhcp U-Boot # mmc dev 1 1 U-Boot # tftp ${loadaddr} dra7xx/MLO U-Boot # mmc write ${loadaddr} 0 100 U-Boot # tftp ${loadaddr} dra7xx/u-boot.img U-Boot # mmc write ${loadaddr} 300 400 U-Boot # mmc bootbus 1 2 0 2 U-Boot # mmc partconf 1 1 1 0 U-Boot # mmc rst-function 1 1