mirror of
https://github.com/AsahiLinux/u-boot
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a187559e3d
Correct spelling of "U-Boot" shall be used in all written text (documentation, comments in source files etc.). Signed-off-by: Bin Meng <bmeng.cn@gmail.com> Reviewed-by: Heiko Schocher <hs@denx.de> Reviewed-by: Simon Glass <sjg@chromium.org> Reviewed-by: Minkyu Kang <mk7.kang@samsung.com>
194 lines
7.5 KiB
Text
194 lines
7.5 KiB
Text
Overview
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--------
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The T4240QDS is a high-performance computing evaluation, development and test
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platform supporting the T4240 QorIQ™ Power Architecture™ processor. T4240QDS is
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optimized to support the high-bandwidth DDR3 memory ports, as well as the
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highly-configurable SerDes ports. The system is lead-free and RoHS-compliant.
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Board Features
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SERDES Connections
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32 lanes grouped into four 8-lane banks
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Two “front side” banks dedicated to Ethernet
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- High-speed crosspoint switch fabric on selected lanes
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- Two PCI Express slots with side-band connector supporting
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- SGMII
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- XAUI
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- HiGig
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- I-pass connectors allow board-to-board and loopback support
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Two “back side” banks dedicated to other protocols
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- High-speed crosspoint switch fabric on all lanes
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- Four PCI Express slots with side-band connector supporting
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- PCI Express 3.0
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- SATA 2.0
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- SRIO 2.0
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- Supports 4X Aurora debug with two connectors
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DDR Controllers
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Three independant 64-bit DDR3 controllers
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Supports rates of 1866 up to 2133 MHz data-rate
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Supports two DDR3/DDR3LP UDIMM/RDIMMs per controller
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DDR power supplies 1.5V to all devices with automatic tracking of VTT.
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Power software-switchable to 1.35V if software detects all DDR3LP devices.
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MT9JSF25672AZ-2G1KZESZF has been tested at 1333, 1600, 1867, 2000 and
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2133MT/s speeds. For 1867MT/s and above, read-to-write turnaround time
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increases by 1 clock.
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IFC/Local Bus
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NAND flash: 8-bit, async or sync, up to 2GB.
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NOR: 16-bit, Address/Data Multiplexed (ADM), up to 128 MB
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NOR: 8-bit or 16-bit, non-multiplexed, up to 512MB
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- NOR devices support 16 virtual banks
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GASIC: Minimal target within Qixis FPGA
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PromJET rapid memory download support
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Address demultiplexing handled within FPGA.
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- Flexible demux allows 8 or 16 bit evaluation.
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IFC Debug/Development card
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- Support for 32-bit devices
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Ethernet
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Support two on-board RGMII 10/100/1G ethernet ports.
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SGMII and XAUI support via SERDES block (see above).
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1588 support via Symmetricom board.
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QIXIS System Logic FPGA
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Manages system power and reset sequencing
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Manages DUT, board, clock, etc. configuration for dynamic shmoo
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Collects V-I-T data in background for code/power profiling.
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Supports legacy TMT test features (POSt, IRS, SYSCLK-synchronous assertion)
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General fault monitoring and logging
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Runs from ATX “hot” power rails allowing operation while system is off.
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Clocks
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System and DDR clock (SYSCLK, “DDRCLK”)
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- Switch selectable to one of 16 common settings in the interval 33MHz-166MHz.
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- Software selectable in 1MHz increments from 1-200MHz.
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SERDES clocks
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- Provides clocks to all SerDes blocks and slots
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- 100, 125 and 156.25 MHz
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Power Supplies
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Dedicated regulators for VDD
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- Adjustable from (0.7V to 1.3V at 80A
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- Regulators can be controlled by VID and/or software
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Dedicated regulator for GVDD_PL: 1.35/1.5V at 22A
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- VTT/MVREF automatically track operating voltage
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Dedicated regulators/filters for AVDD supplies
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Dedicated regulators for other supplies: OVDD, BVDD, DVDD, LVDD, POVDD, etc.
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USB
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Supports two USB 2.0 ports with integrated PHYs
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- One type A, one type micro-AB with 1.0A power per port.
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Other IO
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eSDHC/MMC
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- SDHC card slot
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eSPI port
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- High-speed serial flash
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Two Serial port
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Four I2C ports
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XFI
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XFI is supported on T4QDS-XFI board which removed slot3 and routed
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four Lanes A/B/C/D to a SFP+ cages, which to house fiber cable or
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direct attach cable(copper), the copper cable is used to emulate
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10GBASE-KR scenario.
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So, for XFI usage, there are two scenarios, one will use fiber cable,
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another will use copper cable. An hwconfig env "fsl_10gkr_copper" is
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introduced to indicate a XFI port will use copper cable, and U-Boot
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will fixup the dtb accordingly.
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It's used as: fsl_10gkr_copper:<10g_mac_name>
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The <10g_mac_name> can be fm1_10g1, fm1_10g2, fm2_10g1, fm2_10g2, they
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do not have to be coexist in hwconfig. If a MAC is listed in the env
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"fsl_10gkr_copper", it will use copper cable, otherwise, fiber cable
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will be used by default.
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for ex. set "fsl_10gkr_copper:fm1_10g1,fm1_10g2,fm2_10g1,fm2_10g2" in
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hwconfig, then both four XFI ports will use copper cable.
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set "fsl_10gkr_copper:fm1_10g1,fm1_10g2" in hwconfig, then first two
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XFI ports will use copper cable, the other two XFI ports will use fiber
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cable.
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Memory map
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----------
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The addresses in brackets are physical addresses.
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0x0_0000_0000 (0x0_0000_0000) - 0x0_7fff_ffff 2GB DDR (more than 2GB is initialized but not mapped under with TLB)
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0x0_8000_0000 (0xc_0000_0000) - 0x0_dfff_ffff 1.5GB PCIE memory
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0x0_f000_0000 (0xf_0000_0000) - 0x0_f1ff_ffff 32MB DCSR (includes trace buffers)
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0x0_f400_0000 (0xf_f400_0000) - 0x0_f5ff_ffff 32MB BMan
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0x0_f600_0000 (0xf_f600_0000) - 0x0_f7ff_ffff 32MB QMan
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0x0_f800_0000 (0xf_f800_0000) - 0x0_f803_ffff 256KB PCIE IO
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0x0_e000_0000 (0xf_e000_0000) - 0x0_efff_ffff 256MB NOR flash
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0x0_fe00_0000 (0xf_fe00_0000) - 0x0_feff_ffff 16MB CCSR
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0x0_ffdf_0000 (0xf_ffdf_0000) - 0x0_ffdf_03ff 4KB QIXIS
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0x0_ffff_f000 (0x0_7fff_fff0) - 0x0_ffff_ffff 4KB Boot page translation for secondary cores
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The physical address of the last (boot page translation) varies with the actual DDR size.
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Voltage ID and VDD override
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--------------------
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T4240 has a VID feature. U-Boot reads the VID efuses and adjust the voltage
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accordingly. The voltage can also be override by command vdd_override. The
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syntax is
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vdd_override <voltage in mV>, eg. 1050 is for 1.050v.
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Upon success, the actual voltage will be read back. The value is checked
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for safety and any invalid value will not adjust the voltage.
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Another way to override VDD is to use environmental variable, in case of using
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command is too late for some debugging. The syntax is
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setenv t4240qds_vdd_mv <voltage in mV>
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saveenv
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reset
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The override voltage takes effect when booting.
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Note: voltage adjustment needs to be done step by step. Changing voltage too
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rapidly may cause current surge. The voltage stepping is done by software.
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Users can set the final voltage directly.
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2-stage NAND/SD boot loader
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-------------------------------
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PBL initializes the internal SRAM and copy SPL(160K) in SRAM.
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SPL further initialise DDR using SPD and environment variables
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and copy U-Boot(768 KB) from NAND/SD device to DDR.
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Finally SPL transers control to U-Boot for futher booting.
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SPL has following features:
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- Executes within 256K
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- No relocation required
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Run time view of SPL framework
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-------------------------------------------------
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|Area | Address |
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-------------------------------------------------
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|SecureBoot header | 0xFFFC0000 (32KB) |
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-------------------------------------------------
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|GD, BD | 0xFFFC8000 (4KB) |
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-------------------------------------------------
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|ENV | 0xFFFC9000 (8KB) |
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-------------------------------------------------
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|HEAP | 0xFFFCB000 (50KB) |
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-------------------------------------------------
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|STACK | 0xFFFD8000 (22KB) |
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-------------------------------------------------
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|U-Boot SPL | 0xFFFD8000 (160KB) |
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-------------------------------------------------
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NAND Flash memory Map on T4QDS
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--------------------------------------------------------------
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Start End Definition Size
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0x000000 0x0FFFFF U-Boot img 1MB
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0x140000 0x15FFFF U-Boot env 128KB
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0x160000 0x17FFFF FMAN Ucode 128KB
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Micro SD Card memory Map on T4QDS
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----------------------------------------------------
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Block #blocks Definition Size
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0x008 2048 U-Boot img 1MB
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0x800 0016 U-Boot env 8KB
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0x820 0128 FMAN ucode 64KB
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Switch Settings: (ON is 1, OFF is 0)
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===============
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NAND boot SW setting:
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SW1[1:8] = 10000010
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SW2[1.1] = 0
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SW6[1:4] = 1001
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SD boot SW setting:
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SW1[1:8] = 00100000
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SW2[1.1] = 0
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