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Use CONFIG_TARGET_T4240QDS instead. Signed-off-by: York Sun <york.sun@nxp.com> |
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.. | ||
ddr.c | ||
ddr.h | ||
eth.c | ||
Kconfig | ||
law.c | ||
MAINTAINERS | ||
Makefile | ||
pci.c | ||
README | ||
spl.c | ||
t4_nand_rcw.cfg | ||
t4_pbi.cfg | ||
t4_sd_rcw.cfg | ||
t4qds.h | ||
t4240emu.c | ||
t4240qds.c | ||
t4240qds_qixis.h | ||
tlb.c |
Overview -------- The T4240QDS is a high-performance computing evaluation, development and test platform supporting the T4240 QorIQ™ Power Architecture™ processor. T4240QDS is optimized to support the high-bandwidth DDR3 memory ports, as well as the highly-configurable SerDes ports. The system is lead-free and RoHS-compliant. Board Features SERDES Connections 32 lanes grouped into four 8-lane banks Two “front side” banks dedicated to Ethernet - High-speed crosspoint switch fabric on selected lanes - Two PCI Express slots with side-band connector supporting - SGMII - XAUI - HiGig - I-pass connectors allow board-to-board and loopback support Two “back side” banks dedicated to other protocols - High-speed crosspoint switch fabric on all lanes - Four PCI Express slots with side-band connector supporting - PCI Express 3.0 - SATA 2.0 - SRIO 2.0 - Supports 4X Aurora debug with two connectors DDR Controllers Three independant 64-bit DDR3 controllers Supports rates of 1866 up to 2133 MHz data-rate Supports two DDR3/DDR3LP UDIMM/RDIMMs per controller DDR power supplies 1.5V to all devices with automatic tracking of VTT. Power software-switchable to 1.35V if software detects all DDR3LP devices. MT9JSF25672AZ-2G1KZESZF has been tested at 1333, 1600, 1867, 2000 and 2133MT/s speeds. For 1867MT/s and above, read-to-write turnaround time increases by 1 clock. IFC/Local Bus NAND flash: 8-bit, async or sync, up to 2GB. NOR: 16-bit, Address/Data Multiplexed (ADM), up to 128 MB NOR: 8-bit or 16-bit, non-multiplexed, up to 512MB - NOR devices support 16 virtual banks GASIC: Minimal target within Qixis FPGA PromJET rapid memory download support Address demultiplexing handled within FPGA. - Flexible demux allows 8 or 16 bit evaluation. IFC Debug/Development card - Support for 32-bit devices Ethernet Support two on-board RGMII 10/100/1G ethernet ports. SGMII and XAUI support via SERDES block (see above). 1588 support via Symmetricom board. QIXIS System Logic FPGA Manages system power and reset sequencing Manages DUT, board, clock, etc. configuration for dynamic shmoo Collects V-I-T data in background for code/power profiling. Supports legacy TMT test features (POSt, IRS, SYSCLK-synchronous assertion) General fault monitoring and logging Runs from ATX “hot” power rails allowing operation while system is off. Clocks System and DDR clock (SYSCLK, “DDRCLK”) - Switch selectable to one of 16 common settings in the interval 33MHz-166MHz. - Software selectable in 1MHz increments from 1-200MHz. SERDES clocks - Provides clocks to all SerDes blocks and slots - 100, 125 and 156.25 MHz Power Supplies Dedicated regulators for VDD - Adjustable from (0.7V to 1.3V at 80A - Regulators can be controlled by VID and/or software Dedicated regulator for GVDD_PL: 1.35/1.5V at 22A - VTT/MVREF automatically track operating voltage Dedicated regulators/filters for AVDD supplies Dedicated regulators for other supplies: OVDD, BVDD, DVDD, LVDD, POVDD, etc. USB Supports two USB 2.0 ports with integrated PHYs - One type A, one type micro-AB with 1.0A power per port. Other IO eSDHC/MMC - SDHC card slot eSPI port - High-speed serial flash Two Serial port Four I2C ports XFI XFI is supported on T4QDS-XFI board which removed slot3 and routed four Lanes A/B/C/D to a SFP+ cages, which to house fiber cable or direct attach cable(copper), the copper cable is used to emulate 10GBASE-KR scenario. So, for XFI usage, there are two scenarios, one will use fiber cable, another will use copper cable. An hwconfig env "fsl_10gkr_copper" is introduced to indicate a XFI port will use copper cable, and U-Boot will fixup the dtb accordingly. It's used as: fsl_10gkr_copper:<10g_mac_name> The <10g_mac_name> can be fm1_10g1, fm1_10g2, fm2_10g1, fm2_10g2, they do not have to be coexist in hwconfig. If a MAC is listed in the env "fsl_10gkr_copper", it will use copper cable, otherwise, fiber cable will be used by default. for ex. set "fsl_10gkr_copper:fm1_10g1,fm1_10g2,fm2_10g1,fm2_10g2" in hwconfig, then both four XFI ports will use copper cable. set "fsl_10gkr_copper:fm1_10g1,fm1_10g2" in hwconfig, then first two XFI ports will use copper cable, the other two XFI ports will use fiber cable. Memory map ---------- The addresses in brackets are physical addresses. 0x0_0000_0000 (0x0_0000_0000) - 0x0_7fff_ffff 2GB DDR (more than 2GB is initialized but not mapped under with TLB) 0x0_8000_0000 (0xc_0000_0000) - 0x0_dfff_ffff 1.5GB PCIE memory 0x0_f000_0000 (0xf_0000_0000) - 0x0_f1ff_ffff 32MB DCSR (includes trace buffers) 0x0_f400_0000 (0xf_f400_0000) - 0x0_f5ff_ffff 32MB BMan 0x0_f600_0000 (0xf_f600_0000) - 0x0_f7ff_ffff 32MB QMan 0x0_f800_0000 (0xf_f800_0000) - 0x0_f803_ffff 256KB PCIE IO 0x0_e000_0000 (0xf_e000_0000) - 0x0_efff_ffff 256MB NOR flash 0x0_fe00_0000 (0xf_fe00_0000) - 0x0_feff_ffff 16MB CCSR 0x0_ffdf_0000 (0xf_ffdf_0000) - 0x0_ffdf_03ff 4KB QIXIS 0x0_ffff_f000 (0x0_7fff_fff0) - 0x0_ffff_ffff 4KB Boot page translation for secondary cores The physical address of the last (boot page translation) varies with the actual DDR size. Voltage ID and VDD override -------------------- T4240 has a VID feature. U-Boot reads the VID efuses and adjust the voltage accordingly. The voltage can also be override by command vdd_override. The syntax is vdd_override <voltage in mV>, eg. 1050 is for 1.050v. Upon success, the actual voltage will be read back. The value is checked for safety and any invalid value will not adjust the voltage. Another way to override VDD is to use environmental variable, in case of using command is too late for some debugging. The syntax is setenv t4240qds_vdd_mv <voltage in mV> saveenv reset The override voltage takes effect when booting. Note: voltage adjustment needs to be done step by step. Changing voltage too rapidly may cause current surge. The voltage stepping is done by software. Users can set the final voltage directly. 2-stage NAND/SD boot loader ------------------------------- PBL initializes the internal SRAM and copy SPL(160K) in SRAM. SPL further initialise DDR using SPD and environment variables and copy U-Boot(768 KB) from NAND/SD device to DDR. Finally SPL transers control to U-Boot for futher booting. SPL has following features: - Executes within 256K - No relocation required Run time view of SPL framework ------------------------------------------------- |Area | Address | ------------------------------------------------- |SecureBoot header | 0xFFFC0000 (32KB) | ------------------------------------------------- |GD, BD | 0xFFFC8000 (4KB) | ------------------------------------------------- |ENV | 0xFFFC9000 (8KB) | ------------------------------------------------- |HEAP | 0xFFFCB000 (50KB) | ------------------------------------------------- |STACK | 0xFFFD8000 (22KB) | ------------------------------------------------- |U-Boot SPL | 0xFFFD8000 (160KB) | ------------------------------------------------- NAND Flash memory Map on T4QDS -------------------------------------------------------------- Start End Definition Size 0x000000 0x0FFFFF U-Boot img 1MB 0x140000 0x15FFFF U-Boot env 128KB 0x160000 0x17FFFF FMAN Ucode 128KB Micro SD Card memory Map on T4QDS ---------------------------------------------------- Block #blocks Definition Size 0x008 2048 U-Boot img 1MB 0x800 0016 U-Boot env 8KB 0x820 0128 FMAN ucode 64KB Switch Settings: (ON is 1, OFF is 0) =============== NAND boot SW setting: SW1[1:8] = 10000010 SW2[1.1] = 0 SW6[1:4] = 1001 SD boot SW setting: SW1[1:8] = 00100000 SW2[1.1] = 0