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Bin Meng a187559e3d Use correct spelling of "U-Boot" 
Correct spelling of "U-Boot" shall be used in all written text
(documentation, comments in source files etc.).

Signed-off-by: Bin Meng <bmeng.cn@gmail.com>
Reviewed-by: Heiko Schocher <hs@denx.de>
Reviewed-by: Simon Glass <sjg@chromium.org>
Reviewed-by: Minkyu Kang <mk7.kang@samsung.com>
2016-02-06 12:00:59 +01:00

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Overview
--------
The T4240QDS is a high-performance computing evaluation, development and test
platform supporting the T4240 QorIQ™ Power Architecture™ processor. T4240QDS is
optimized to support the high-bandwidth DDR3 memory ports, as well as the
highly-configurable SerDes ports. The system is lead-free and RoHS-compliant.
Board Features
SERDES Connections
32 lanes grouped into four 8-lane banks
Two “front side” banks dedicated to Ethernet
- High-speed crosspoint switch fabric on selected lanes
- Two PCI Express slots with side-band connector supporting
- SGMII
- XAUI
- HiGig
- I-pass connectors allow board-to-board and loopback support
Two “back side” banks dedicated to other protocols
- High-speed crosspoint switch fabric on all lanes
- Four PCI Express slots with side-band connector supporting
- PCI Express 3.0
- SATA 2.0
- SRIO 2.0
- Supports 4X Aurora debug with two connectors
DDR Controllers
Three independant 64-bit DDR3 controllers
Supports rates of 1866 up to 2133 MHz data-rate
Supports two DDR3/DDR3LP UDIMM/RDIMMs per controller
DDR power supplies 1.5V to all devices with automatic tracking of VTT.
Power software-switchable to 1.35V if software detects all DDR3LP devices.
MT9JSF25672AZ-2G1KZESZF has been tested at 1333, 1600, 1867, 2000 and
2133MT/s speeds. For 1867MT/s and above, read-to-write turnaround time
increases by 1 clock.
IFC/Local Bus
NAND flash: 8-bit, async or sync, up to 2GB.
NOR: 16-bit, Address/Data Multiplexed (ADM), up to 128 MB
NOR: 8-bit or 16-bit, non-multiplexed, up to 512MB
- NOR devices support 16 virtual banks
GASIC: Minimal target within Qixis FPGA
PromJET rapid memory download support
Address demultiplexing handled within FPGA.
- Flexible demux allows 8 or 16 bit evaluation.
IFC Debug/Development card
- Support for 32-bit devices
Ethernet
Support two on-board RGMII 10/100/1G ethernet ports.
SGMII and XAUI support via SERDES block (see above).
1588 support via Symmetricom board.
QIXIS System Logic FPGA
Manages system power and reset sequencing
Manages DUT, board, clock, etc. configuration for dynamic shmoo
Collects V-I-T data in background for code/power profiling.
Supports legacy TMT test features (POSt, IRS, SYSCLK-synchronous assertion)
General fault monitoring and logging
Runs from ATX “hot” power rails allowing operation while system is off.
Clocks
System and DDR clock (SYSCLK, “DDRCLK”)
- Switch selectable to one of 16 common settings in the interval 33MHz-166MHz.
- Software selectable in 1MHz increments from 1-200MHz.
SERDES clocks
- Provides clocks to all SerDes blocks and slots
- 100, 125 and 156.25 MHz
Power Supplies
Dedicated regulators for VDD
- Adjustable from (0.7V to 1.3V at 80A
- Regulators can be controlled by VID and/or software
Dedicated regulator for GVDD_PL: 1.35/1.5V at 22A
- VTT/MVREF automatically track operating voltage
Dedicated regulators/filters for AVDD supplies
Dedicated regulators for other supplies: OVDD, BVDD, DVDD, LVDD, POVDD, etc.
USB
Supports two USB 2.0 ports with integrated PHYs
- One type A, one type micro-AB with 1.0A power per port.
Other IO
eSDHC/MMC
- SDHC card slot
eSPI port
- High-speed serial flash
Two Serial port
Four I2C ports
XFI
XFI is supported on T4QDS-XFI board which removed slot3 and routed
four Lanes A/B/C/D to a SFP+ cages, which to house fiber cable or
direct attach cable(copper), the copper cable is used to emulate
10GBASE-KR scenario.
So, for XFI usage, there are two scenarios, one will use fiber cable,
another will use copper cable. An hwconfig env "fsl_10gkr_copper" is
introduced to indicate a XFI port will use copper cable, and U-Boot
will fixup the dtb accordingly.
It's used as: fsl_10gkr_copper:<10g_mac_name>
The <10g_mac_name> can be fm1_10g1, fm1_10g2, fm2_10g1, fm2_10g2, they
do not have to be coexist in hwconfig. If a MAC is listed in the env
"fsl_10gkr_copper", it will use copper cable, otherwise, fiber cable
will be used by default.
for ex. set "fsl_10gkr_copper:fm1_10g1,fm1_10g2,fm2_10g1,fm2_10g2" in
hwconfig, then both four XFI ports will use copper cable.
set "fsl_10gkr_copper:fm1_10g1,fm1_10g2" in hwconfig, then first two
XFI ports will use copper cable, the other two XFI ports will use fiber
cable.
Memory map
----------
The addresses in brackets are physical addresses.
0x0_0000_0000 (0x0_0000_0000) - 0x0_7fff_ffff 2GB DDR (more than 2GB is initialized but not mapped under with TLB)
0x0_8000_0000 (0xc_0000_0000) - 0x0_dfff_ffff 1.5GB PCIE memory
0x0_f000_0000 (0xf_0000_0000) - 0x0_f1ff_ffff 32MB DCSR (includes trace buffers)
0x0_f400_0000 (0xf_f400_0000) - 0x0_f5ff_ffff 32MB BMan
0x0_f600_0000 (0xf_f600_0000) - 0x0_f7ff_ffff 32MB QMan
0x0_f800_0000 (0xf_f800_0000) - 0x0_f803_ffff 256KB PCIE IO
0x0_e000_0000 (0xf_e000_0000) - 0x0_efff_ffff 256MB NOR flash
0x0_fe00_0000 (0xf_fe00_0000) - 0x0_feff_ffff 16MB CCSR
0x0_ffdf_0000 (0xf_ffdf_0000) - 0x0_ffdf_03ff 4KB QIXIS
0x0_ffff_f000 (0x0_7fff_fff0) - 0x0_ffff_ffff 4KB Boot page translation for secondary cores
The physical address of the last (boot page translation) varies with the actual DDR size.
Voltage ID and VDD override
--------------------
T4240 has a VID feature. U-Boot reads the VID efuses and adjust the voltage
accordingly. The voltage can also be override by command vdd_override. The
syntax is
vdd_override <voltage in mV>, eg. 1050 is for 1.050v.
Upon success, the actual voltage will be read back. The value is checked
for safety and any invalid value will not adjust the voltage.
Another way to override VDD is to use environmental variable, in case of using
command is too late for some debugging. The syntax is
setenv t4240qds_vdd_mv <voltage in mV>
saveenv
reset
The override voltage takes effect when booting.
Note: voltage adjustment needs to be done step by step. Changing voltage too
rapidly may cause current surge. The voltage stepping is done by software.
Users can set the final voltage directly.
2-stage NAND/SD boot loader
-------------------------------
PBL initializes the internal SRAM and copy SPL(160K) in SRAM.
SPL further initialise DDR using SPD and environment variables
and copy U-Boot(768 KB) from NAND/SD device to DDR.
Finally SPL transers control to U-Boot for futher booting.
SPL has following features:
- Executes within 256K
- No relocation required
Run time view of SPL framework
-------------------------------------------------
|Area | Address |
-------------------------------------------------
|SecureBoot header | 0xFFFC0000 (32KB) |
-------------------------------------------------
|GD, BD | 0xFFFC8000 (4KB) |
-------------------------------------------------
|ENV | 0xFFFC9000 (8KB) |
-------------------------------------------------
|HEAP | 0xFFFCB000 (50KB) |
-------------------------------------------------
|STACK | 0xFFFD8000 (22KB) |
-------------------------------------------------
|U-Boot SPL | 0xFFFD8000 (160KB) |
-------------------------------------------------
NAND Flash memory Map on T4QDS
--------------------------------------------------------------
Start End Definition Size
0x000000 0x0FFFFF U-Boot img 1MB
0x140000 0x15FFFF U-Boot env 128KB
0x160000 0x17FFFF FMAN Ucode 128KB
Micro SD Card memory Map on T4QDS
----------------------------------------------------
Block #blocks Definition Size
0x008 2048 U-Boot img 1MB
0x800 0016 U-Boot env 8KB
0x820 0128 FMAN ucode 64KB
Switch Settings: (ON is 1, OFF is 0)
===============
NAND boot SW setting:
SW1[1:8] = 10000010
SW2[1.1] = 0
SW6[1:4] = 1001
SD boot SW setting:
SW1[1:8] = 00100000
SW2[1.1] = 0
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