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The generic NAND DT bindings allows one to tweak the ECC strength and step size to their need. It can be used to lower the ECC strength to match a bootloader/firmware config, but might also be used to get a better reliability. In the latter case, the user might want to use the maximum ECC strength without having to explicitly calculate the exact value (this value not only depends on the OOB size, but also on the NAND controller, and can be tricky to extract). Add a generic 'nand-ecc-maximize' DT property and the associated NAND_ECC_MAXIMIZE flag, to let ECC controller drivers select the best ECC strength and step-size on their own. Signed-off-by: Boris Brezillon <boris.brezillon@free-electrons.com> Acked-by: Rob Herring <robh@kernel.org> [Linux commit: ba78ee00e1ff84de9b3ad33edbd3ec599099ee82] [masahiro: of_property_read_bool -> fdt_getprop for U-Boot] Signed-off-by: Masahiro Yamada <yamada.masahiro@socionext.com> |
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| .. | ||
| bbm.h | ||
| concat.h | ||
| doc2000.h | ||
| flashchip.h | ||
| fsl_upm.h | ||
| fsmc_nand.h | ||
| mtd.h | ||
| nand.h | ||
| nand_bch.h | ||
| nand_ecc.h | ||
| ndfc.h | ||
| omap_elm.h | ||
| omap_gpmc.h | ||
| onenand.h | ||
| onenand_regs.h | ||
| partitions.h | ||
| samsung_onenand.h | ||
| st_smi.h | ||
| ubi.h | ||