.. SPDX-License-Identifier: GPL-2.0+ OR BSD-3-Clause .. sectionauthor:: Vignesh Raghavendra AM62 Platforms =============== Introduction: ------------- The AM62 SoC family is the follow on AM335x built on the K3 Multicore SoC architecture platform, providing ultra-low-power modes, dual display, multi-sensor edge compute, security and other BOM-saving integrations. The AM62 SoC targets a broad market to enable applications such as Industrial HMI, PLC/CNC/Robot control, Medical Equipment, Building Automation, Appliances and more. Some highlights of this SoC are: * Quad-Cortex-A53s (running up to 1.4GHz) in a single cluster. Pin-to-pin compatible options for single and quad core are available. * Cortex-M4F for general-purpose or safety usage. * Dual display support, providing 24-bit RBG parallel interface and OLDI/LVDS-4 Lane x2, up to 200MHz pixel clock support for 2K display resolution. * Selectable GPU support, up to 8GFLOPS, providing better user experience in 3D graphic display case and Android. * PRU(Programmable Realtime Unit) support for customized programmable interfaces/IOs. * Integrated Giga-bit Ethernet switch supporting up to a total of two external ports (TSN capable). * 9xUARTs, 5xSPI, 6xI2C, 2xUSB2, 3xCAN-FD, 3x eMMC and SD, GPMC for NAND/FPGA connection, OSPI memory controller, 3xMcASP for audio, 1x CSI-RX-4L for Camera, eCAP/eQEP, ePWM, among other peripherals. * Dedicated Centralized System Controller for Security, Power, and Resource Management. * Multiple low power modes support, ex: Deep sleep, Standby, MCU-only, enabling battery powered system design. More details can be found in the Technical Reference Manual: https://www.ti.com/lit/pdf/spruiv7 Boot Flow: ---------- Below is the pictorial representation of boot flow: .. image:: img/boot_diagram_k3_current.svg - Here TIFS acts as master and provides all the critical services. R5/A53 requests TIFS to get these services done as shown in the above diagram. Sources: -------- .. include:: k3.rst :start-after: .. k3_rst_include_start_boot_sources :end-before: .. k3_rst_include_end_boot_sources Build procedure: ---------------- 1. Trusted Firmware-A: .. code-block:: bash $ make CROSS_COMPILE=aarch64-none-linux-gnu- ARCH=aarch64 PLAT=k3 \ TARGET_BOARD=lite SPD=opteed 2. OP-TEE: .. code-block:: bash $ make PLATFORM=k3 CFG_ARM64_core=y CROSS_COMPILE=arm-none-linux-gnueabihf- \ CROSS_COMPILE64=aarch64-none-linux-gnu- 3. U-Boot: * 3.1 R5: .. code-block:: bash $ make ARCH=arm am62x_evm_r5_defconfig $ make ARCH=arm CROSS_COMPILE=arm-none-linux-gnueabihf- \ BINMAN_INDIRS= * 3.2 A53: .. code-block:: bash $ make ARCH=arm am62x_evm_a53_defconfig $ make ARCH=arm CROSS_COMPILE=aarch64-none-linux-gnu- \ BL31=/build/k3/lite/release/bl31.bin \ TEE=/out/arm-plat-k3/core/tee-raw.bin \ BINMAN_INDIRS= Target Images -------------- In order to boot we need tiboot3.bin, tispl.bin and u-boot.img. Each SoC variant (GP, HS-FS, HS-SE) requires a different source for these files. - GP * tiboot3-am62x-gp-evm.bin from step 3.1 * tispl.bin_unsigned, u-boot.img_unsigned from step 3.2 - HS-FS * tiboot3-am62x-hs-fs-evm.bin from step 3.1 * tispl.bin, u-boot.img from step 3.2 - HS-SE * tiboot3-am62x-hs-evm.bin from step 3.1 * tispl.bin, u-boot.img from step 3.2 Image formats: -------------- - tiboot3.bin: .. code-block:: text +-----------------------+ | X.509 | | Certificate | | +-------------------+ | | | | | | | R5 | | | | u-boot-spl.bin | | | | | | | +-------------------+ | | | | | | |TIFS with board cfg| | | | | | | +-------------------+ | | | | | | | | | | | FIT header | | | | +---------------+ | | | | | | | | | | | DTB 1...N | | | | | +---------------+ | | | +-------------------+ | +-----------------------+ - tispl.bin .. code-block:: text +-----------------------+ | | | FIT HEADER | | +-------------------+ | | | | | | | A53 TF-A | | | +-------------------+ | | | | | | | A53 OP-TEE | | | +-------------------+ | | | | | | | R5 DM FW | | | +-------------------+ | | | | | | | A53 SPL | | | +-------------------+ | | | | | | | SPL DTB 1...N | | | +-------------------+ | +-----------------------+ A53 SPL DDR Memory Layout ------------------------- This provides an overview memory usage in A53 SPL stage. .. list-table:: :widths: 16 16 16 :header-rows: 1 * - Region - Start Address - End Address * - EMPTY - 0x80000000 - 0x80080000 * - TEXT BASE - 0x80080000 - 0x800d8000 * - EMPTY - 0x800d8000 - 0x80200000 * - BMP IMAGE - 0x80200000 - 0x80b77660 * - STACK - 0x80b77660 - 0x80b77e60 * - GD - 0x80b77e60 - 0x80b78000 * - MALLOC - 0x80b78000 - 0x80b80000 * - EMPTY - 0x80b80000 - 0x80c80000 * - BSS - 0x80c80000 - 0x80d00000 * - BLOBS - 0x80d00000 - 0x80d00400 * - EMPTY - 0x80d00400 - 0x81000000 Switch Setting for Boot Mode ---------------------------- Boot Mode pins provide means to select the boot mode and options before the device is powered up. After every POR, they are the main source to populate the Boot Parameter Tables. The following table shows some common boot modes used on AM62 platform. More details can be found in the Technical Reference Manual: https://www.ti.com/lit/pdf/spruiv7 under the `Boot Mode Pins` section. *Boot Modes* ============ ============= ============= Switch Label SW2: 12345678 SW3: 12345678 ============ ============= ============= SD 01000000 11000010 OSPI 00000000 11001110 EMMC 00000000 11010010 UART 00000000 11011100 USB DFU 00000000 11001010 ============ ============= ============= For SW2 and SW1, the switch state in the "ON" position = 1.