The option SPL_SPI_SUPPORT is used to enable support in SPL for loading
images from SPI flash, it should not be used to determine the build type
of the SPL image itself. The ability to read images from SPI flash does
not imply the SPL will be booted from SPI flash.
Unconditionally build SPI flash compatible SPL images.
Signed-off-by: Andrew F. Davis <afd@ti.com>
Acked-by: Lokesh Vutla <lokeshvutla@ti.com>
Reviewed-by: Tom Rini <trini@konsulko.com>
Depending on the boot media, different images are needed
for secure devices. The build generates u-boot*_HS_* files
as appropriate for the different boot modes.
For AM33xx devices additional image types are needed for
various SPL boot modes as the ROM checks for the name of
the boot mode in the file it loads.
Signed-off-by: Andrew F. Davis <afd@ti.com>
Reviewed-by: Tom Rini <trini@konsulko.com>
Acked-by: Lokesh Vutla <lokeshvutla@ti.com>
Commit e29878f introduces an undesired dependency on CONFIG_SPL_LOAD_FIT
when building U-Boot for AM43xx high-security (HS) devices that causes the
build to break when that option is not active. Fix this issue by only
building the u-boot_HS.img target when building U-Boot into an actual
FIT image.
Signed-off-by: Andreas Dannenberg <dannenberg@ti.com>
Reviewed-by: Tom Rini <trini@konsulko.com>
Modify the SPL build procedure for AM437x high-security (HS) device
variants to create a secure u-boot_HS.img FIT blob that contains U-Boot
and DTB artifacts signed (and optionally encrypted) with a TI-specific
process based on the CONFIG_TI_SECURE_DEVICE config option and the
externally-provided image signing tool.
Also populate the corresponding FIT image post processing call to be
performed during SPL runtime.
Signed-off-by: Madan Srinivas <madans@ti.com>
Signed-off-by: Andreas Dannenberg <dannenberg@ti.com>
Reviewed-by: Tom Rini <trini@konsulko.com>
Modifies the config.mk to build secure images when building
the SPL for secure devices.
Depending on the boot media, different images are needed
for secure devices. The build generates u-boot*_HS_* files
as appropriate for the different boot modes. The same u-boot
binary file is processed slightly differently to produce a
different boot image, depending on whether the user wants to
boot off SPI, QSPI or other boot media.
Refer to README.ti-secure for more information.
Signed-off-by: Madan Srinivas <madans@ti.com>
Signed-off-by: Daniel Allred <d-allred@ti.com>
Reviewed-by: Lokesh Vutla <lokeshvutla@ti.com>
Tested-by: Andreas Dannenberg <dannenberg@ti.com>
Reviewed-by: Tom Rini <trini@konsulko.com>
This commit changes the working directory
where the build process occurs.
Before this commit, build process occurred under the source
tree for both in-tree and out-of-tree build.
That's why we needed to add $(obj) prefix to all generated
files in makefiles like follows:
$(obj)u-boot.bin: $(obj)u-boot
Here, $(obj) is empty for in-tree build, whereas it points
to the output directory for out-of-tree build.
And our old build system changes the current working directory
with "make -C <sub-dir>" syntax when descending into the
sub-directories.
On the other hand, Kbuild uses a different idea
to handle out-of-tree build and directory descending.
The build process of Kbuild always occurs under the output tree.
When "O=dir/to/store/output/files" is given, the build system
changes the current working directory to that directory and
restarts the make.
Kbuild uses "make -f $(srctree)/scripts/Makefile.build obj=<sub-dir>"
syntax for descending into sub-directories.
(We can write it like "make $(obj)=<sub-dir>" with a shorthand.)
This means the current working directory is always the top
of the output directory.
Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
Tested-by: Gerhard Sittig <gsi@denx.de>
Add the required config.mk logic for this SoC as well as the BOOT_DEVICE
define. Finally, enable the options on the am335x_evm.
Signed-off-by: Tom Rini <trini@ti.com>
This patch is added to support SPL feature on AM335X
platform. In this patch, MMC1 is configured as boot
device for SPL and support for other devices will be
added in the next patch series.
Signed-off-by: Chandan Nath <chandan.nath@ti.com>
Signed-off-by: Tom Rini <trini@ti.com>
Acked-by: Igor Grinberg <grinberg@compulab.co.il>
