The AM642 SoC belongs to the K3 Multicore SoC architecture platform,
providing advanced system integration to enable applications such as
Motor Drives, PLC, Remote IO and IoT Gateways.
Some highlights of this SoC are:
* Dual Cortex-A53s in a single cluster, two clusters of dual Cortex-R5F
MCUs, and a single Cortex-M4F.
* Two Gigabit Industrial Communication Subsystems (ICSSG).
* Integrated Ethernet switch supporting up to a total of two external
ports.
* PCIe-GEN2x1L, USB3/USB2, 2xCAN-FD, eMMC and SD, UFS, OSPI memory
controller, QSPI, I2C, eCAP/eQEP, ePWM, ADC, among other
peripherals.
* Centralized System Controller for Security, Power, and Resource
Management (DMSC).
See AM64X Technical Reference Manual (SPRUIM2, Nov 2020)
for further details: https://www.ti.com/lit/pdf/spruim2
Signed-off-by: Dave Gerlach <d-gerlach@ti.com>
The memory allocated to store the FIT image containing SYSFW and board
configuration data is statically defined to the largest size expected.
Some additions to the board configuration data has pushed us slightly
over the current defined size on some HS devices, expand to 278000.
Signed-off-by: Andrew F. Davis <afd@ti.com>
Since ROM configures OSPI controller to be in memory mapped mode in OSPI
boot, R5 SPL can directly pass the memory mapped pointer to ROM. With
this ROM can directly pull the SYSFW image from OSPI.
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
The boot parameter table index memory address for J721E was configured
to an incorrect value which prevented the use of this definition to
determine which boot parameter table is active which is needed to be
able to distinguish between primary and backup boot modes. Fix this
issue by updating the value to the correct one also in alignment with
the J721E Technical Reference Manual (TRM).
Signed-off-by: Andreas Dannenberg <dannenberg@ti.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
The memory allocated to store the FIT image containing SYSFW and board
configuration data is statically defined to the largest size expected.
This was 276000 bytes but now needs to be grown to 277000 to make room
for the slightly larger SYSFW image used on J721e High-Security devices.
Signed-off-by: Andrew F. Davis <afd@ti.com>
Reviewed-by: Lokesh Vutla <lokeshvutla@ti.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
Implement an early console functionality in SPL that can be used before
the main console is being brought up. This helps in situations where the
main console is dependent on System Firmware (SYSFW) being up and running,
which is usually not the case during the very early stages of boot. Using
this early console functionality will allow for an alternate serial port
to be used to support things like UART-based boot and early diagnostic
messages until the main console is ready to get activated.
Signed-off-by: Andreas Dannenberg <dannenberg@ti.com>
The memory allocated to store the FIT image containing SYSFW and board
configuration data is statically defined to the largest size expected.
This was 269000 bytes but now needs to be grown to 276000 to make room
for the signatures attached to the board configuration data on High
Security devices.
Signed-off-by: Andrew F. Davis <afd@ti.com>
The J721E SoC belongs to the K3 Multicore SoC architecture platform,
providing advanced system integration to enable lower system costs
of automotive applications such as infotainment, cluster, premium
Audio, Gateway, industrial and a range of broad market applications.
This SoC is designed around reducing the system cost by eliminating
the need of an external system MCU and is targeted towards ASIL-B/C
certification/requirements in addition to allowing complex software
and system use-cases.
Some highlights of this SoC are:
* Dual Cortex-A72s in a single cluster, three clusters of lockstep
capable dual Cortex-R5F MCUs, Deep-learning Matrix Multiply Accelerator(MMA),
C7x floating point Vector DSP, Two C66x floating point DSPs.
* 3D GPU PowerVR Rogue 8XE GE8430
* Vision Processing Accelerator (VPAC) with image signal processor and Depth
and Motion Processing Accelerator (DMPAC)
* Two Gigabit Industrial Communication Subsystems (ICSSG), each with dual
PRUs and dual RTUs
* Two CSI2.0 4L RX plus one CSI2.0 4L TX, one eDP/DP, One DSI Tx, and
up to two DPI interfaces.
* Integrated Ethernet switch supporting up to a total of 8 external ports in
addition to legacy Ethernet switch of up to 2 ports.
* System MMU (SMMU) Version 3.0 and advanced virtualisation
capabilities.
* Upto 4 PCIe-GEN3 controllers, 2 USB3.0 Dual-role device subsystems,
16 MCANs, 12 McASP, eMMC and SD, UFS, OSPI/HyperBus memory controller, QSPI,
I3C and I2C, eCAP/eQEP, eHRPWM, MLB among other peripherals.
* Two hardware accelerator block containing AES/DES/SHA/MD5 called SA2UL
management.
* Configurable L3 Cache and IO-coherent architecture with high data throughput
capable distributed DMA architecture under NAVSS
* Centralized System Controller for Security, Power, and Resource
Management (DMSC)
See J721E Technical Reference Manual (SPRUIL1, May 2019)
for further details: http://www.ti.com/lit/pdf/spruil1
Add base support for J721E SoC
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
Signed-off-by: Andreas Dannenberg <dannenberg@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Introduce a framework that allows loading the System Firmware (SYSFW)
binary as well as the associated configuration data from an image tree
blob named "sysfw.itb" from an FS-based MMC boot media or from an MMC
RAW mode partition or sector.
To simplify the handling of and loading from the different boot media
we tap into the existing U-Boot SPL framework usually used for loading
U-Boot by building on an earlier commit that exposes some of that
functionality.
Note that this initial implementation only supports FS and RAW-based
eMMC/SD card boot.
Signed-off-by: Andreas Dannenberg <dannenberg@ti.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
Considering the boot time requirements, Cortex-A core
should be able to start immediately after SPL on R5.
Add support for the same.
Reviewed-by: Tom Rini <trini@konsulko.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
Update Makefiles to generate:
- tiboot3.bin: Image format that can be processed by ROM.
Below is the tiboot3.bin image format that is required by ROM:
_______________________
| X509 |
| Certificate |
| ____________________ |
| | | |
| | u-boot-spl.bin | |
| | | |
| |___________________| |
|_______________________|
Reviewed-by: Tom Rini <trini@konsulko.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
Signed-off-by: Andreas Dannenberg <dannenberg@ti.com>
Add initial support for AM654 based EVM running on A53. Enable
4GB of DDR available on the EVM so that kernel DTB file
can be updated accordingly.
Reviewed-by: Tom Rini <trini@konsulko.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
[Andreas: Added 4GB ddr support]
Signed-off-by: Andreas Dannenberg <dannenberg@ti.com>
AM654 allows for booting from primary or backup boot media.
Both media can be chosen individually based on switch settings.
ROM looks for a valid image in primary boot media, if not found
then looks in backup boot media. In order to pass this boot media
information to boot loader, ROM stores a value at a particular
address. Add support for reading this information and determining
the boot media correctly.
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
Signed-off-by: Andreas Dannenberg <dannenberg@ti.com>
Signed-off-by: Vignesh R <vigneshr@ti.com>
Reviewed-by: Tom Rini <trini@konsulko.com>
The AM654 device is designed for industrial automation and PLC
controller class platforms among other applications. Introduce
base support for AM654 SoC.
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
Reviewed-by: Tom Rini <trini@konsulko.com>
