Instead of passing individual registers by value to board_get_mem_timings,
pass a board_mem_timings structure pointer for the board files to fill in.
Pass same structure pointer to write_sdrc_timings. This saves about
90 bytes of space in SPL.
Signed-off-by: Peter Barada <peter.barada@logicpd.com>
The total RAM size of the IGEP-based boards is 512MiB not 1GiB, the
LPDDR memory consist on two dies of 256MiB.
Signed-off-by: Enric Balletbo i Serra <eballetbo@gmail.com>
Tested-by: Javier Martinez Canillas <javier@dowhile0.org>
This patch adds SPL support for IGEP-based boards.
Tested on an IGEPv2 Rev.C board with Micron NAND Flash memory.
Signed-off-by: Javier Martinez Canillas <javier@dowhile0.org>
IGEP-based boards can have two different flash memories, a OneNAND or a
NAND device. Add a configuration option for to choose which memory to use.
Signed-off-by: Javier Martinez Canillas <javier@dowhile0.org>
Acked-by: Enric Balletbo i Serra <eballetbo@gmail.com>
This is rework on config files of IGEP-based boards with the aim to remove
duplicated code to be more maintainable. Basically this patch creates a
common configuration file for both boards and only sets the specific option
in the board config file.
On board files the hardcored mach type was replaced in favour of using the
CONFIG_MACH_TYPE option.
More than 200 duplicated lines have been deleted.
Signed-off-by: Enric Balletbo i Serra <eballetbo@gmail.com>
Add parameters to the OMAP MMC initialization function so the board can
mask host capabilities and set the maximum clock frequency. While the
OMAP supports a certain set of MMC host capabilities, individual boards
may be more restricted and the OMAP may need to be configured to match
the board. The PRG_SDMMC1_SPEEDCTRL bit in the OMAP3 is an example.
Signed-off-by: Jonathan Solnit <jsolnit@gmail.com>
The top level Makefile does not do any recursion into subdirs when
cleaning, so these clean/distclean targets in random arch/board dirs
never get used. Punt them all.
MAKEALL didn't report any errors related to this that I could see.
Signed-off-by: Mike Frysinger <vapier@gentoo.org>
It can be optimised out by the compiler otherwise resulting
in obscure errors like a board not booting.
This has been documented in README since 2006 when these were
first fixed up for GCC 4.x.
Signed-off-by: John Rigby <john.rigby@linaro.org>
Fix some additional places.
Signed-off-by: Wolfgang Denk <wd@denx.de>
Acked-By: Albert ARIBAUD <albert.aribaud@free.fr>
Before this commit, weak symbols were not overridden by non-weak symbols
found in archive libraries when linking with recent versions of
binutils. As stated in the System V ABI, "the link editor does not
extract archive members to resolve undefined weak symbols".
This commit changes all Makefiles to use partial linking (ld -r) instead
of creating library archives, which forces all symbols to participate in
linking, allowing non-weak symbols to override weak symbols as intended.
This approach is also used by Linux, from which the gmake function
cmd_link_o_target (defined in config.mk and used in all Makefiles) is
inspired.
The name of each former library archive is preserved except for
extensions which change from ".a" to ".o". This commit updates
references accordingly where needed, in particular in some linker
scripts.
This commit reveals board configurations that exclude some features but
include source files that depend these disabled features in the build,
resulting in undefined symbols. Known such cases include:
- disabling CMD_NET but not CMD_NFS;
- enabling CONFIG_OF_LIBFDT but not CONFIG_QE.
Signed-off-by: Sebastien Carlier <sebastien.carlier@gmail.com>
This patch switches from the legacy mmc driver to the new generic mmc driver
Signed-off-by: Enric Balletbo i Serra <eballetbo@iseebcn.com>
Signed-off-by: Sandeep Paulraj <s-paulraj@ti.com>
Commit 14d0a02a "Rename TEXT_BASE into CONFIG_SYS_TEXT_BASE" missed the
IGEP boards since they were just added.
Signed-off-by: Steve Sakoman <steve.sakoman@linaro.org>
Signed-off-by: Sandeep Paulraj <s-paulraj@ti.com>
The IGEP module is a low-power, high performance production-ready
system-on-module (SOM) based on TI's OMAP3 family.The IGEP module
solution based upon TI OMAP3 provides a low-power/low-cost platform
for a variety of consumer/industrial/medical devices.
Signed-off-by: Enric Balletbo i Serra <eballetbo@gmail.com>
Signed-off-by: Sandeep Paulraj <s-paulraj@ti.com>
