The ePOS EVM and EVM SK have QSPI as an option to boot. Add a qspiboot
target that utilizes QSPI for env and so forth as an example of best
practices. As QSPI is booted from directly we need to chang
CONFIG_SYS_TEXT_BASE.
Note that on ePOS EVM the QSPI and NAND are mutually exclusive choices
we need to handle that elsewhere, once NAND support is also added.
Signed-off-by: Sourav Poddar <sourav.poddar@ti.com>
Signed-off-by: Tom Rini <trini@ti.com>
Convert to using the common config files. This requires a little more
flexibility in the common files than we had been using before.
Signed-off-by: Tom Rini <trini@ti.com>
In general, we want to load the DT at base+128MB, so that we ahve
sufficient room for the kernel and a larger device tree. In the case of
OMAP3, use 64MB instead as we have a number of boards with 128MB DDR.
Signed-off-by: Tom Rini <trini@ti.com>
To deal with a reoccurring problem properly we need to specify addresses
for the Linux kernel, Flatted Device Tree and ramdisk that obey the
constraints within the kernel's Documentation/arm/Booting file but also
make sure that we relocate things within a valid address range.
It is possible with these addresses to also set fdt_high and initrd_high
to the value of 0xffffffff. We don't do this by default to allow for
the most likely success of people using custom addresses however.
Signed-off-by: Tom Rini <trini@ti.com>
This mainly converts the am335x_spl_bch driver to the "normal" format
which means a slight change to nand_info within the driver.
Acked-by: Scott Wood <scottwood@freescale.com>
Signed-off-by: Tom Rini <trini@ti.com>
If CONFIG_NR_DRAM_BANKS is not defined, we say (for simplicity) that we have
1 bank, but for some boards should be interesting that we can define
CONFIG_NR_DRAM_BANKS. To handle this possibility just define the number of
DRAM banks if is not already defined. This is useful for some OMAP3 boards
where the DRAM initialitzation is only at u-boot level.
Signed-off-by: Enric Balletbo i Serra <eballetbo@gmail.com>
The ELM hardware engine wihich is used for ECC error detections is not present
on OMAP3 SoC, so move the CONFIG_SPL_NAND_AM33XX_BCH from ti_armv7_common.h to
SoC configuration file.
Signed-off-by: Enric Balletbo i Serra <eballetbo@gmail.com>
Reviewed-by: Lokesh Vutla <lokeshvutla@ti.com>
- add omap24xx driver to new multibus/multiadpater support
- adapted all config files, which uses this driver
Tested on the am335x based siemens boards rut, dxr2 and pxm2
posted here:
http://patchwork.ozlabs.org/patch/263211/
Signed-off-by: Heiko Schocher <hs@denx.de>
Tested-by: Tom Rini <trini@ti.com>
Cc: Lars Poeschel <poeschel@lemonage.de>
Cc: Steve Sakoman <sakoman@gmail.com>
Cc: Thomas Weber <weber@corscience.de>
Cc: Tom Rix <Tom.Rix@windriver.com>
Cc: Grazvydas Ignotas <notasas@gmail.com>
Cc: Enric Balletbo i Serra <eballetbo@iseebcn.com>
Cc: Luca Ceresoli <luca.ceresoli@comelit.it>
Cc: Igor Grinberg <grinberg@compulab.co.il>
Cc: Ilya Yanok <yanok@emcraft.com>
Cc: Stefano Babic <sbabic@denx.de>
Cc: Nishanth Menon <nm@ti.com>
Cc: Pali Rohár <pali.rohar@gmail.com>
Cc: Peter Barada <peter.barada@logicpd.com>
Cc: Nagendra T S <nagendra@mistralsolutions.com>
Cc: Michael Jones <michael.jones@matrix-vision.de>
Cc: Raphael Assenat <raph@8d.com>
Acked-by: Igor Grinberg <grinberg@compulab.co.il>
Acked-by: Stefano Babic <sbabic@denx.de>
Conflicts:
arch/arm/cpu/arm926ejs/mxs/Makefile
board/compulab/cm_t35/Makefile
board/corscience/tricorder/Makefile
board/ppcag/bg0900/Makefile
drivers/bootcount/Makefile
include/configs/omap4_common.h
include/configs/pdnb3.h
Makefile conflicts are due to additions/removals of
object files on the ARM branch vs KBuild introduction
on the main branch. Resolution consists in adjusting
the list of object files in the main branch version.
This also applies to two files which are not listed
as conflicting but had to be modified:
board/compulab/common/Makefile
board/udoo/Makefile
include/configs/omap4_common.h conflicts are due to
the OMAP4 conversion to ti_armv7_common.h on the ARM
side, and CONFIG_SYS_HZ removal on the main side.
Resolution is to convert as this icludes removal of
CONFIG_SYS_HZ.
include/configs/pdnb3.h is due to a removal on ARM side.
Trivial resolution is to remove the file.
Note: 'git show' will also list two files just because
they are new:
include/configs/am335x_igep0033.h
include/configs/omap3_igep00x0.h
With changes to increase the size of the device tree (required to move
more data out of the kernel and into DT), loading the args at the old
address leads to us overwriting things later on. To correct this, load
the args file to where we load the device tree anyhow. This is also
safe for non-DT booting as in either case we use r2 to pass in the
location of things.
Signed-off-by: Tom Rini <trini@ti.com>
Re-group the general options to note things that can be removed safely
to reduce binary size when not required, and expand the comment about
what commands we do include to note it could be replaced with a specific
list of required one. While at it, move the CMD parts of various
blocks IP to the end of the list for consistency.
Signed-off-by: Tom Rini <trini@ti.com>
We only need this library when we're doing "disk" access to MMC/SD.
Update comment around the rest of CONFIG_SPL_LIB* to note that the
others are always required.
Signed-off-by: Tom Rini <trini@ti.com>
We create two new files, include/configs/ti_armv7_common.h for all of
the common IP blocks and related features / commands we share in
virtually all of our platforms. We then create
include/configs/ti_am335x_common.h for everything common to the am335x
SoC leaving just the board specific parts to
include/configs/ti_am335x_common.h.
Signed-off-by: Tom Rini <trini@ti.com>
