Instead of passing individual registers by value to board_get_mem_timings,
pass a board_mem_timings structure pointer for the board files to fill in.
Pass same structure pointer to write_sdrc_timings. This saves about
90 bytes of space in SPL.
Signed-off-by: Peter Barada <peter.barada@logicpd.com>
The total RAM size of the IGEP-based boards is 512MiB not 1GiB, the
LPDDR memory consist on two dies of 256MiB.
Signed-off-by: Enric Balletbo i Serra <eballetbo@gmail.com>
Tested-by: Javier Martinez Canillas <javier@dowhile0.org>
This patch adds SPL support for IGEP-based boards.
Tested on an IGEPv2 Rev.C board with Micron NAND Flash memory.
Signed-off-by: Javier Martinez Canillas <javier@dowhile0.org>
This is rework on config files of IGEP-based boards with the aim to remove
duplicated code to be more maintainable. Basically this patch creates a
common configuration file for both boards and only sets the specific option
in the board config file.
On board files the hardcored mach type was replaced in favour of using the
CONFIG_MACH_TYPE option.
More than 200 duplicated lines have been deleted.
Signed-off-by: Enric Balletbo i Serra <eballetbo@gmail.com>
Add parameters to the OMAP MMC initialization function so the board can
mask host capabilities and set the maximum clock frequency. While the
OMAP supports a certain set of MMC host capabilities, individual boards
may be more restricted and the OMAP may need to be configured to match
the board. The PRG_SDMMC1_SPEEDCTRL bit in the OMAP3 is an example.
Signed-off-by: Jonathan Solnit <jsolnit@gmail.com>
It can be optimised out by the compiler otherwise resulting
in obscure errors like a board not booting.
This has been documented in README since 2006 when these were
first fixed up for GCC 4.x.
Signed-off-by: John Rigby <john.rigby@linaro.org>
Fix some additional places.
Signed-off-by: Wolfgang Denk <wd@denx.de>
Acked-By: Albert ARIBAUD <albert.aribaud@free.fr>
This patch switches from the legacy mmc driver to the new generic mmc driver
Signed-off-by: Enric Balletbo i Serra <eballetbo@iseebcn.com>
Signed-off-by: Sandeep Paulraj <s-paulraj@ti.com>
The IGEP module is a low-power, high performance production-ready
system-on-module (SOM) based on TI's OMAP3 family.The IGEP module
solution based upon TI OMAP3 provides a low-power/low-cost platform
for a variety of consumer/industrial/medical devices.
Signed-off-by: Enric Balletbo i Serra <eballetbo@gmail.com>
Signed-off-by: Sandeep Paulraj <s-paulraj@ti.com>
