Commit graph

103 commits

Author SHA1 Message Date
Wolfgang Denk
071bc92330 Coding Style cleanup
Signed-off-by: Wolfgang Denk <wd@denx.de>
2010-10-27 22:48:30 +02:00
Enric Balletbo i Serra
1a832dc4f8 OMAP3: Add support for the OMAP3 IGEP module.
The IGEP module is a low-power, high performance production-ready
system-on-module (SOM) based on TI's OMAP3 family.The IGEP module
solution based upon TI OMAP3 provides a low-power/low-cost platform
for a variety of consumer/industrial/medical devices.

Signed-off-by: Enric Balletbo i Serra <eballetbo@gmail.com>
Signed-off-by: Sandeep Paulraj <s-paulraj@ti.com>
2010-10-17 20:14:42 +02:00
Enric Balletbo i Serra
8a3f6bb6fb OMAP3: Add support for the IGEP v2 board.
The IGEP v2 board is a low-cost, fan-less and industrial temperature
range single board computer that unleashes laptop-like performance and
expandability without the bulk, expense, or noise of typical desktop
machines. Its architecture shares much in common with other OMAP3 boards.

Signed-off-by: Enric Balletbo i Serra <eballetbo@gmail.com>
Acked-by: Steve Sakoman <steve.sakoman@linaro.org>
Tested-by: Steve Sakoman <steve.sakoman@linaro.org>
Signed-off-by: Sandeep Paulraj <s-paulraj@ti.com>
2010-10-17 20:14:40 +02:00