Commit graph

4 commits

Author SHA1 Message Date
Ladislav Michl
4c699a4747 igep00x0: move SPL routines into separate file
Avoid cluttering board file with CONFIG_SPL_BUILD ifdefs
by moving SPL related functions into separate file.

Signed-off-by: Ladislav Michl <ladis@linux-mips.org>
Tested-by: Pau Pajuelo <ppajuel@gmail.com>
Acked-by: Enric Balletbo i Serra <enric.balletbo@collabora.com>
2017-08-26 14:56:12 -04:00
Masahiro Yamada
a79854a90f board: arm: convert makefiles to Kbuild style
Signed-off-by: Masahiro Yamada <yamada.m@jp.panasonic.com>
Cc: Albert ARIBAUD <albert.u.boot@aribaud.net>
Cc: Andreas Bießmann <andreas.devel@googlemail.com>
Cc: Stefano Babic <sbabic@denx.de>
Cc: Prafulla Wadaskar <prafulla@marvell.com>
Cc: Minkyu Kang <mk7.kang@samsung.com>
Cc: Vipin Kumar <vipin.kumar@st.com>
Cc: Tom Warren <twarren@nvidia.com>
Cc: Tom Rini <trini@ti.com>
2013-11-01 11:42:12 -04:00
Wolfgang Denk
1a4596601f Add GPL-2.0+ SPDX-License-Identifier to source files
Signed-off-by: Wolfgang Denk <wd@denx.de>
[trini: Fixup common/cmd_io.c]
Signed-off-by: Tom Rini <trini@ti.com>
2013-07-24 09:44:38 -04:00
Javier Martinez Canillas
77eea28074 OMAP3: use a single board file for IGEP devices
Even when the IGEPv2 board and the IGEP Computer-on-Module
are different from a form factor point of view, they are
very similar in the fact that share many components and how
they are wired.

So, it is possible (and better) to have a single board file
for both devices and just use the CONFIG_MACH_TYPE to make
a differentiation between each board when needed.

This change avoids code duplication by removing 298 lines of
code and makes future maintenance easier.

Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk>
Acked-by: Igor Grinberg <grinberg@compulab.co.il>
2013-02-07 10:36:25 -05:00
Renamed from board/isee/igep0020/Makefile (Browse further)