It can be optimised out by the compiler otherwise resulting
in obscure errors like a board not booting.
This has been documented in README since 2006 when these were
first fixed up for GCC 4.x.
Signed-off-by: John Rigby <john.rigby@linaro.org>
Fix some additional places.
Signed-off-by: Wolfgang Denk <wd@denx.de>
Acked-By: Albert ARIBAUD <albert.aribaud@free.fr>
Before this commit, weak symbols were not overridden by non-weak symbols
found in archive libraries when linking with recent versions of
binutils. As stated in the System V ABI, "the link editor does not
extract archive members to resolve undefined weak symbols".
This commit changes all Makefiles to use partial linking (ld -r) instead
of creating library archives, which forces all symbols to participate in
linking, allowing non-weak symbols to override weak symbols as intended.
This approach is also used by Linux, from which the gmake function
cmd_link_o_target (defined in config.mk and used in all Makefiles) is
inspired.
The name of each former library archive is preserved except for
extensions which change from ".a" to ".o". This commit updates
references accordingly where needed, in particular in some linker
scripts.
This commit reveals board configurations that exclude some features but
include source files that depend these disabled features in the build,
resulting in undefined symbols. Known such cases include:
- disabling CMD_NET but not CMD_NFS;
- enabling CONFIG_OF_LIBFDT but not CONFIG_QE.
Signed-off-by: Sebastien Carlier <sebastien.carlier@gmail.com>
This patch switches from the legacy mmc driver to the new generic mmc driver
Signed-off-by: Enric Balletbo i Serra <eballetbo@iseebcn.com>
Signed-off-by: Sandeep Paulraj <s-paulraj@ti.com>
Commit 14d0a02a "Rename TEXT_BASE into CONFIG_SYS_TEXT_BASE" missed the
IGEP boards since they were just added.
Signed-off-by: Steve Sakoman <steve.sakoman@linaro.org>
Signed-off-by: Sandeep Paulraj <s-paulraj@ti.com>
The IGEP module is a low-power, high performance production-ready
system-on-module (SOM) based on TI's OMAP3 family.The IGEP module
solution based upon TI OMAP3 provides a low-power/low-cost platform
for a variety of consumer/industrial/medical devices.
Signed-off-by: Enric Balletbo i Serra <eballetbo@gmail.com>
Signed-off-by: Sandeep Paulraj <s-paulraj@ti.com>
