Commit graph

87793 commits

Author SHA1 Message Date
Chanho Park
43cefb4934 configs: visionfive2: add a trailing space to prompt
Adds a trailing space to SYS_PROMPT to make it easier to distinguish
between commands and the prompt.

Signed-off-by: Chanho Park <chanho61.park@samsung.com>
Reviewed-by: Leo Yu-Chi Liang <ycliang@andestech.com>
2023-07-24 13:22:02 +08:00
Xingyu Wu
9adf1cf609 clk: starfive: jh7110: Add of_xlate ops and macros for clock id conversion
Modify the drivers to add of_xlate ops and transform clock id.

Signed-off-by: Xingyu Wu <xingyu.wu@starfivetech.com>
Signed-off-by: Hal Feng <hal.feng@starfivetech.com>
Reviewed-by: Torsten Duwe <duwe@suse.de>
Reviewed-by: Leo Yu-Chi Liang <ycliang@andestech.com>
2023-07-24 13:21:16 +08:00
Xingyu Wu
9a12e304dd dt-bindings: clock: jh7110: Modify clock id to be same with Linux
The clock id needs to be changed to be consistent with Linux.

Signed-off-by: Xingyu Wu <xingyu.wu@starfivetech.com>
Signed-off-by: Hal Feng <hal.feng@starfivetech.com>
Reviewed-by: Torsten Duwe <duwe@suse.de>
Reviewed-by: Leo Yu-Chi Liang <ycliang@andestech.com>
2023-07-24 13:21:11 +08:00
Xingyu Wu
6c4b50e6de riscv: dts: jh7110: Add clock source from PLL
Change the PLL clock source from syscrg to sys_syscon child node.

Signed-off-by: Xingyu Wu <xingyu.wu@starfivetech.com>
Signed-off-by: Hal Feng <hal.feng@starfivetech.com>
Reviewed-by: Torsten Duwe <duwe@suse.de>
Reviewed-by: Leo Yu-Chi Liang <ycliang@andestech.com>
2023-07-24 13:21:06 +08:00
Xingyu Wu
005f9627d0 riscv: dts: jh7110: Add PLL clock controller node
Add child node about PLL clock controller in sys_syscon node.

Signed-off-by: Xingyu Wu <xingyu.wu@starfivetech.com>
Signed-off-by: Hal Feng <hal.feng@starfivetech.com>
Reviewed-by: Torsten Duwe <duwe@suse.de>
Reviewed-by: Leo Yu-Chi Liang <ycliang@andestech.com>
2023-07-24 13:21:01 +08:00
Xingyu Wu
2d7a578791 clk: starfive: jh7110: Separate the PLL driver
Drop the PLL part in SYSCRG driver and separate to be a single
PLL driver of which the compatible is "starfive,jh7110-pll".

Signed-off-by: Xingyu Wu <xingyu.wu@starfivetech.com>
Signed-off-by: Hal Feng <hal.feng@starfivetech.com>
Reviewed-by: Torsten Duwe <duwe@suse.de>
Reviewed-by: Leo Yu-Chi Liang <ycliang@andestech.com>
2023-07-24 13:20:44 +08:00
Bo Gan
28ff3f16c4 riscv: setup per-hart stack earlier
Harts need to use per-hart stack before any function call, even if that
function is a simple one. When the callee uses stack for register save/
restore, especially RA, if nested call, concurrent access by multiple
harts on the same stack will cause data-race.

This patch sets up SP before `board_init_f_alloc_reserve`. A side effect
of this is that the memory layout has changed as the following:

+----------------+        +----------------+ <----- SPL_STACK/
|  ......        |        |  hart 0 stack  |        SYS_INIT_SP_ADDR
|  malloc_base   |        +----------------+
+----------------+        |  hart 1 stack  |
|  GD            |        +----------------+ If not SMP, N=1
+----------------+        |  ......        |
|  hart 0 stack  |        +----------------+
+----------------+   ==>  |  hart N-1 stack|
|  hart 1 stack  |        +----------------+
+----------------+        |  ......        |
|  ......        |        |  malloc_base   |
+----------------+        +----------------+
|  hart N-1 stack|        |  GD            |
+----------------+        +----------------+
|                |        |                |

Signed-off-by: Bo Gan <ganboing@gmail.com>
Cc: Rick Chen <rick@andestech.com>
Cc: Leo <ycliang@andestech.com>
Cc: Sean Anderson <seanga2@gmail.com>
Cc: Bin Meng <bmeng.cn@gmail.com>
Cc: Lukas Auer <lukas.auer@aisec.fraunhofer.de>
Reviewed-by: Rick Chen <rick@andestech.com>
Reviewed-by: Leo Yu-Chi Liang <ycliang@andestech.com>
2023-07-24 13:17:26 +08:00
Tom Rini
be71a05a41 Merge branch '2023-07-22-TI-binman-and-K3-improvements'
- Migrate TI K3 platforms to using binman to generate all images, and
  then improve the platform slightly.
2023-07-23 21:46:05 -04:00
Kamlesh Gurudasani
e5031cc07e configs: am64: Fix booting of fitImage on AM64x
Do not limit the maximum size of the buffer that is used to decompress
the OS image in to, this causes issue while inflating the image, if image
size is greater than the buffer.
Remove CONFIG_SYS_BOOTM_LEN

Signed-off-by: Kamlesh Gurudasani <kamlesh@ti.com>
Signed-off-by: Manorit Chawdhry <m-chawdhry@ti.com>
2023-07-21 22:07:46 -04:00
Manorit Chawdhry
86fab11024 Kconfig: Enable FIT_SIGNATURE if ARM64
Enabling FIT_SIGNATURE required the old authentication method to be
disabled so disable this for K3 SOCs and enable FIT_SIGNATURE for K3
Platforms.

Signed-off-by: Kamlesh Gurudasani <kamlesh@ti.com>
[ cleanup the patch ]
Signed-off-by: Manorit Chawdhry <m-chawdhry@ti.com>
2023-07-21 22:07:46 -04:00
Manorit Chawdhry
dfe00b34ce lib: Kconfig: k3: Enable SHA512 for fit signature
We are using our custMpk for signing that is a 4096 bit key, 4096 bit
rsa key requires a SHA512 hashing algorithm to be enabled as per the
source. Even though it is not mandated but this is how it works and is
tested.

Enables SHA512 if fit signature is enabled on K3 platforms.

Signed-off-by: Manorit Chawdhry <m-chawdhry@ti.com>
2023-07-21 22:07:46 -04:00
Manorit Chawdhry
175535758a k3-*-binman: dts: Pack u-boot.dtb instead of soc specific dtb
FIT signature requires the updates to u-boot.dtb and the DTB that we
pack don't get updates with the changes of the signature node.

Pack u-boot.dtb as the default DTB so that the signature node changes
can be reflected in them.

(Note, this is only packaging the primary platform and the secondary
 platform will require manual changes for the FIT signature enablement)

Signed-off-by: Manorit Chawdhry <m-chawdhry@ti.com>
[ add additional boards that were missing ]
Signed-off-by: Kamlesh Gurudasani <kamlesh@ti.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
2023-07-21 22:07:46 -04:00
Manorit Chawdhry
d5b1ef30d7 board: ti: keys: add .key and .crt for fit signature signing
Fit signature mechanism through the standards require the presence of
.key and .crt in the folder with the same name, since we are using our
custMpk only for the signing, update the format to that of standards to
be compatible for packaging easily.

Signed-off-by: Manorit Chawdhry <m-chawdhry@ti.com>
2023-07-21 22:07:46 -04:00
Kamlesh Gurudasani
14439cd71c configs: k3: make consistent bootcmd across all k3 socs
Default to common bootcmd that is set across all k3 devices.

Signed-off-by: Manorit Chawdhry <m-chawdhry@ti.com>
Signed-off-by: Kamlesh Gurudasani <kamlesh@ti.com>
2023-07-21 22:07:45 -04:00
Manorit Chawdhry
53873974a4 include: armv7: Enable distroboot across all configs
Since K3 devices are moving towards distroboot, remove duplicates and
add it in common file to import from.

Signed-off-by: Manorit Chawdhry <m-chawdhry@ti.com>
[trini: Add am65x_evm to this patch]
Signed-off-by: Tom Rini <trini@konsulko.com>
2023-07-21 22:07:45 -04:00
Manorit Chawdhry
4ae1a2470c env: Make common bootcmd across all k3 devices
This is helpful to go forward with distro_bootcmd as default boot.

Signed-off-by: Manorit Chawdhry <m-chawdhry@ti.com>
2023-07-21 20:35:50 -04:00
Andrew Davis
913cea388d arm: k3: Add regex/gsub command handling
The 'gsub' setexpr sub command is using when creating the FIT image
configuration string on K3 devices. Enable this for K3.

Signed-off-by: Andrew Davis <afd@ti.com>
Signed-off-by: Manorit Chawdhry <m-chawdhry@ti.com>
2023-07-21 20:35:50 -04:00
Andrew Davis
052ad4ad6a configs: Enable setexpr command on TI devices
This is used when building the FIT image configuration string. Enable
it for all FIT using TI platforms.

Signed-off-by: Andrew Davis <afd@ti.com>
[ extend to other k3 boards ]
Signed-off-by: Manorit Chawdhry <m-chawdhry@ti.com>
2023-07-21 20:35:50 -04:00
Andrew Davis
014e013e78 environment: ti: Make get_fdt_mmc common
Since get_fdt_mmc is common, factor it out into mmc.env and remove
it from each platform env file along with changing the directory path to
reflect the standards. Use it in mmcloados but keep loadfdt
defined in case it is still used by some external uEnv.txt script.

Signed-off-by: Andrew Davis <afd@ti.com>
Signed-off-by: Manorit Chawdhry <m-chawdhry@ti.com>
2023-07-21 20:35:50 -04:00
Andrew Davis
d8ea68da6b environment: ti: Prefix ARM64 DTB names with directory
In Linux the ARM64 DTSs are stored in vendor directories to help organize
the files and prevent naming collisions. The deployed DTBs will mirror
this and so the vendor prefix should be added to the variable used to
locate these files.

Suggested-by: Ryan Eatmon <reatmon@ti.com>
Signed-off-by: Andrew Davis <afd@ti.com>
Signed-off-by: Manorit Chawdhry <m-chawdhry@ti.com>
Reviewed-by: Nikhil M Jain <n-jain1@ti.com>
2023-07-21 20:35:50 -04:00
Manorit Chawdhry
a5e8678e0a configs: k3: Remove saved environments
Having saved environments usually causes inconsistencies while in
development workflow. The saved environments conflict with the
default ones that U-boot should be updating during development
but that doesn't happen and the saved environments need to be
reset during bootups to test the changes causing extra debugs.

Remove the saved environments as a default. Environments can always
be re-enabled locally if one does like them or needs them for
some production environment. Optionally, Uenv.txt can also be used on
some of the boot media.

Signed-off-by: Manorit Chawdhry <m-chawdhry@ti.com>
2023-07-21 20:35:48 -04:00
Manorit Chawdhry
4ff151b4d4 include: j7*_evm.h: Cleanups to be done
Some miscellaneous cleanups for boards.

Signed-off-by: Manorit Chawdhry <m-chawdhry@ti.com>
2023-07-21 19:37:58 -04:00
Manorit Chawdhry
2bfd63d57b mach-k3: common: correct the calculations for determining firewalls
The background firewall calculations were wrong, fix that to determine
both the background and foreground correctly.

Fixes: 8bfce2f998 ("arm: mach-k3: common: reorder removal of firewalls")

Signed-off-by: Manorit Chawdhry <m-chawdhry@ti.com>
2023-07-21 19:37:58 -04:00
Kamlesh Gurudasani
40e09b6afb board: ti: am64x: am64x.env: set fdtfile env variable
Set fdtfile env variable similar to other k3 socs.

Signed-off-by: Kamlesh Gurudasani <kamlesh@ti.com>
Signed-off-by: Manorit Chawdhry <m-chawdhry@ti.com>
Reviewed-by: Nikhil M Jain <n-jain1@ti.com>
2023-07-21 19:37:57 -04:00
Manorit Chawdhry
0eef2bf36e Kconfig: j721s2: Fix the scratchpad base
Fix the regression that occurred during the alignment of binman series
merges along with these HS fixes that caused silent regression in this.

Fixes: 30a7ee87fd ("Kconfig: j721s2: Change K3_MCU_SCRATCHPAD_BASE to non firewalled region")

Signed-off-by: Manorit Chawdhry <m-chawdhry@ti.com>
2023-07-21 19:37:57 -04:00
Manorit Chawdhry
44dab78580 arch: mach-k3: security: fix the check for authentication
Fix regression occurred during refactoring for the mentioned commit.

Fixes: bd6a247593 ("arm: mach-k3: security: separate out validating binary logic")

Signed-off-by: Manorit Chawdhry <m-chawdhry@ti.com>
2023-07-21 19:37:57 -04:00
Tom Rini
f586cdaef9 CI: Make use of buildman requirements.txt
Now that buildman has a requirements.txt file we need to make use of it.

Reviewed-by: Simon Glass <sjg@chromium.org>
[n-francis@ti.com: Adding missing command from .azure-pipelines.yml]
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
Signed-off-by: Tom Rini <trini@konsulko.com>
2023-07-21 19:36:59 -04:00
Tom Rini
e381b12210 buildman: Create a requirements.txt file
At this point, buildman requires a few different modules and so we need
a requirements.txt to track what modules are needed.

Cc: Simon Glass <sjg@chromium.org>
Cc: Neha Malcom Francis <n-francis@ti.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
Signed-off-by: Tom Rini <trini@konsulko.com>
2023-07-21 19:36:59 -04:00
Andrew Davis
15432ea611 binman: Overwrite symlink if it already exists
Without this re-building will fail with an error when trying to create
the symlink for the second time with an already exists error.

Signed-off-by: Andrew Davis <afd@ti.com>
[n-francis@ti.com: Added support for test output dir and testcase]
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:59 -04:00
Neha Malcom Francis
1ee652ab2f doc: board: ti: Update documentation for binman flow
Earlier documentation specified builds for generating bootloader images
using an external TI repository k3-image-gen and core-secdev-k3. Modify
this to using the binman flow so that user understands how to build the
final boot images.

Reviewed-by: Simon Glass <sjg@chromium.org>
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:59 -04:00
Neha Malcom Francis
8db194d046 k3: tools: config.mk: Update makefile and remove scripts
Since binman is used to package bootloader images for all K3 devices, we
do not have to rely on the earlier methods to package them.

Scripts that were used to generate x509 certificate for tiboot3.bin and
generate tispl.bin, u-boot.img have been removed.

Reviewed-by: Simon Glass <sjg@chromium.org>
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:59 -04:00
Neha Malcom Francis
9da80e7917 arm: k3-am65x-iot2050: Use binman for tispl.bin for iot2050
Move to using binman to generate tispl.bin which is used to generate the
final flash.bin bootloader for iot2050 boards.

Cc: Jan Kiszka <jan.kiszka@siemens.com>
Reviewed-by: Simon Glass <sjg@chromium.org>
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:59 -04:00
Neha Malcom Francis
6d6228ab8f am62a: dts: binman: Package tiboot3.bin, tispl.bin, u-boot.img
Support added for HS-SE, HS-FS and GP boot binaries for AM62ax.

HS-SE:
    * tiboot3-am62ax-hs-evm.bin
    * tispl.bin
    * u-boot.img

HS-FS:
    * tiboot3-am62ax-hs-fs-evm.bin
    * tispl.bin
    * u-boot.img

GP:
    * tiboot3.bin --> tiboot3-am62ax-gp-evm.bin
    * tispl.bin_unsigned
    * u-boot.img_unsigned

It is to be noted that the bootflow followed by AM62ax requires:

tiboot3.bin:
	* R5 SPL
	* R5 SPL dtbs
	* TIFS
	* board-cfg
	* pm-cfg
	* sec-cfg
	* rm-cfg

tispl.bin:
	* DM
	* ATF
	* OP-TEE
	* A72 SPL
	* A72 SPL dtbs

u-boot.img:
	* A72 U-Boot
	* A72 U-Boot dtbs

Reviewed-by: Simon Glass <sjg@chromium.org>
[afd@ti.com: changed output binary names appropriately]
Signed-off-by: Andrew Davis <afd@ti.com>
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:59 -04:00
Neha Malcom Francis
01e0127753 am62a: yaml: Add board configs for AM62ax
Added YAML configs for AM62ax

Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:59 -04:00
Neha Malcom Francis
ce46f51990 am625: dts: binman: Package tiboot3.bin, tispl.bin and u-boot.img
Support added for HS-SE, HS-FS and GP boot binaries for AM62.

HS-SE:
    * tiboot3-am62x-hs-evm.bin
    * tispl.bin
    * u-boot.img

HS-FS:
    * tiboot3-am62x-hs-fs-evm.bin
    * tispl.bin
    * u-boot.img

GP:
    * tiboot3.bin --> tiboot3-am62x-gp-evm.bin
    * tispl.bin_unsigned
    * u-boot.img_unsigned

It is to be noted that the bootflow followed by AM62 requires:

tiboot3.bin:
	* R5 SPL
	* R5 SPL dtbs
	* TIFS
	* board-cfg
	* pm-cfg
	* sec-cfg
	* rm-cfg

tispl.bin:
	* DM
	* ATF
	* OP-TEE
	* A72 SPL
	* A72 SPL dtbs

u-boot.img:
	* A72 U-Boot
	* A72 U-Boot dtbs

Reviewed-by: Simon Glass <sjg@chromium.org>
[afd@ti.com: changed output binary names appropriately]
Signed-off-by: Andrew Davis <afd@ti.com>
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:59 -04:00
Neha Malcom Francis
0eba798b41 am62: yaml: Add board configs for AM62
Added YAML configs for AM62

Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:58 -04:00
Neha Malcom Francis
106589aae7 j721s2: dts: binman: Package tiboot3.bin, tispl.bin and u-boot.img
Support has been added for both HS-SE, HS-FS  and GP images.

HS-SE:
    * tiboot3-j721s2-hs-evm.bin
    * tispl.bin
    * u-boot.img

HS-FS:
    * tiboot3-j721s2-hs-fs-evm.bin
    * tispl.bin
    * u-boot.img

GP:
    * tiboot3.bin --> tiboot3-j721s2-gp-evm.bin
    * tispl.bin_unsigned
    * u-boot.img_unsigned

It is to be noted that the bootflow followed by J721S2 requires:

tiboot3.bin:
	* R5 SPL
	* R5 SPL dtbs
	* TIFS
	* board-cfg
	* pm-cfg
	* sec-cfg
	* rm-cfg

tispl.bin:
	* DM
	* ATF
	* OP-TEE
	* A72 SPL
	* A72 SPL dtbs

u-boot.img:
	* A72 U-Boot
	* A72 U-Boot dtbs

Reviewed-by: Simon Glass <sjg@chromium.org>
[afd@ti.com: changed output binary names appropriately]
Signed-off-by: Andrew Davis <afd@ti.com>
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:58 -04:00
Neha Malcom Francis
267a4845c9 j721s2: yaml: Add board configs for J721S2
Added YAML configs for J721S2

Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:58 -04:00
Neha Malcom Francis
1bc527e8f4 am64x: dts: binman: Package tiboot3.bin, tispl.bin u-boot.img
Support added for HS and GP boot binaries for AM64x.

HS-SE:
    * tiboot3-am64x_sr2-hs-evm.bin
    * tispl.bin
    * u-boot.img

HS-FS:
    * tiboot3-am64x_sr2-hs-fs-evm.bin
    * tispl.bin
    * u-boot.img

GP:
    * tiboot3.bin --> tiboot3-am64x-gp-evm.bin
    * tispl.bin_unsigned
    * u-boot.img_unsigned

Note that the bootflow followed by AM64x requires:

tiboot3.bin:
	* R5 SPL
	* R5 SPL dtbs
	* sysfw
	* board-cfg
	* pm-cfg
	* sec-cfg
	* rm-cfg

tispl.bin:
	* ATF
	* OP-TEE
	* A53 SPL
	* A53 SPL dtbs

u-boot.img:
	* A53 U-Boot
	* A53 U-Boot dtbs

Reviewed-by: Simon Glass <sjg@chromium.org>
[afd@ti.com: changed output binary names appropriately]
Signed-off-by: Andrew Davis <afd@ti.com>
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:58 -04:00
Neha Malcom Francis
640bf9dd8e am64x: yaml: Add board configs for AM64x
Added YAML configs for AM64xx

Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:58 -04:00
Neha Malcom Francis
77c29cb1b6 am65: dts: binman: Package tiboot3.bin, sysfw.itb, tispl.bin, u-boot.img
Support has been added for both HS-SE(SR 2.0) and GP(SR 2.0) images.

HS-SE:
	* tiboot3-am65x_sr2-hs-evm.bin
	* sysfw-am65x_sr2-hs-evm.itb
	* tispl.bin
	* u-boot.img

GP:
	* tiboot3.bin --> tiboot3-am65x_sr2-gp-evm.bin
	* sysfw.itb --> sysfw-am65x_sr2-gp-evm.itb
	* tispl.bin_unsigned
	* u-boot.img_unsigned

Note that the bootflow followed by AM65x requires:

tiboot3.bin:
	* R5 SPL
	* R5 SPL dtbs
sysfw.itb:
	* sysfw
	* board-cfg
	* pm-cfg
	* sec-cfg
	* rm-cfg

tispl.bin:
	* ATF
	* OP-TEE
	* A53 SPL
	* A53 SPL dtbs

u-boot.img:
	* A53 U-Boot
	* A53 U-Boot dtbs

Reviewed-by: Simon Glass <sjg@chromium.org>
[afd@ti.com: changed output binary names appropriately]
Signed-off-by: Andrew Davis <afd@ti.com>
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:58 -04:00
Neha Malcom Francis
27ebb1517f am65x: yaml: Add AM65x board config files
Added YAML configs for AM65x

Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:58 -04:00
Neha Malcom Francis
ca5f1e25e5 j7200: dts: binman: Package tiboot3.bin, tispl.bin, u-boot.img
Support has been added for both HS-SE(SR 2.0), HS-FS(SR 2.0) and GP
images.

HS-SE:
	* tiboot3-j7200_sr2-hs-evm.bin
	* tispl.bin
	* u-boot.img

HS-FS:
	* tiboot3-j7200_sr2-hs-fs-evm.bin
	* tispl.bin
	* u-boot.img

GP:
	* tiboot3.bin --> tiboot3-j7200-gp-evm.bin
	* tispl.bin_unsigned
	* u-boot.img_unsigned

It is to be noted that the bootflow followed by J7200 requires:

tiboot3.bin:
	* R5 SPL
	* R5 SPL dtbs
	* TIFS
	* board-cfg
	* pm-cfg
	* sec-cfg
	* rm-cfg

tispl.bin:
	* DM
	* ATF
	* OP-TEE
	* A72 SPL
	* A72 SPL dtbs

u-boot.img:
	* A72 U-Boot
	* A72 U-Boot dtbs

Reviewed-by: Simon Glass <sjg@chromium.org>
[afd@ti.com: changed output binary names appropriately]
Signed-off-by: Andrew Davis <afd@ti.com>
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:58 -04:00
Neha Malcom Francis
e6135b0614 j7200: yaml: Add J7200 board config files
Added YAML configs for J7200

Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:58 -04:00
Neha Malcom Francis
177178685a j721e: dts: binman: Package tiboot3.bin, sysfw.itb, tispl.bin, u-boot.img
By providing entries in the binman node of the device tree, binman will
be able to find and package board config artifacts generated by
TIBoardConfig with sysfw.bin and generate the final image sysfw.itb.
It will also pick out the R5 SPL and sign it with the help of TI signing
entry and generate the final tiboot3.bin.

Entries for A72 build have been added to k3-j721e-binman.dtsi to
generate tispl.bin and u-boot.img.

Support has been added for both HS-SE(SR 1.1), HS-FS(SR 2.0) and GP images
In HS-SE, the encrypted system firmware binary must be signed along with
the signed certificate binary.

HS-SE:
	* tiboot3-j721e_sr1_1-hs-evm.bin
	* sysfw-j721e_sr1_1-hs-evm.itb
	* tispl.bin
	* u-boot.img

HS-FS:
	* tiboot3-j721e_sr2-hs-fs-evm.bin
	* sysfw-j721e_sr2-hs-fs-evm.itb
	* tispl.bin
	* u-boot.img

GP:
	* tiboot3.bin -->tiboot3-j721e-gp-evm.bin
	* sysfw.itb --> sysfw-j721e-gp-evm.itb
	* tispl.bin_unsigned
	* u-boot.img_unsigned

It is to be noted that the bootflow followed by J721E requires:

tiboot3.bin:
	* R5 SPL
	* R5 SPL dtbs

sysfw.itb:
	* TIFS
	* board-cfg
	* pm-cfg
	* sec-cfg
	* rm-cfg

tispl.bin:
	* DM
	* ATF
	* OP-TEE
	* A72 SPL
	* A72 SPL dtbs

u-boot.img:
	* A72 U-Boot
	* A72 U-Boot dtbs

Reviewed-by: Simon Glass <sjg@chromium.org>
[afd@ti.com: changed output binary names appropriately]
Signed-off-by: Andrew Davis <afd@ti.com>
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:58 -04:00
Neha Malcom Francis
11ee37962e j721e: schema: yaml: Add general schema and J721E board config files
Schema file in YAML must be provided in board/ti/common for validating
input config files and packaging system firmware. The schema includes
entries for rm-cfg, board-cfg, pm-cfg and sec-cfg.

Board config files must be provided in board/ti/<devicename> in YAML.
These can then be consumed for generation of binaries to package system
firmware. Added YAML configs for J721E in particular.

Signed-off-by: Tarun Sahu <t-sahu@ti.com>
[n-francis@ti.com: prepared patch for upstreaming]
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:58 -04:00
Neha Malcom Francis
9b03bfe105 arm: dts: k3: Add support for packaging sysfw.itb and tiboot3.bin
Board config binary artifacts must be generated to be used by binman to
package sysfw.itb and tiboot3.bin for all K3 devices.

For devices that follow combined flow, these board configuration
binaries must again be packaged into a combined board configuration
blobs to be used by binman to package tiboot3.bin.

Add common k3-binman.dtsi to generate all the board configuration
binaries needed.

Also add custMpk.pem and ti-degenerate-key.pem needed for signing GP and
HS bootloader images common to all K3 devices.

Reviewed-by: Simon Glass <sjg@chromium.org>
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:58 -04:00
Neha Malcom Francis
78144826bb binman: ti-secure: Add support for TI signing
The ti-secure entry contains certificate for binaries that will be
loaded or booted by system firmware whereas the ti-secure-rom entry
contains certificate for binaries that will be booted by ROM. Support
for both these types of certificates is necessary for booting of K3
devices.

Reviewed-by: Simon Glass <sjg@chromium.org>
[vigneshr@ti.com: fixed inconsist cert generation by multiple packing]
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:58 -04:00
Neha Malcom Francis
6c66ccf26c binman: ti-board-config: Add support for TI board config binaries
The ti-board-config entry loads and validates a given YAML config file
against a given schema, and generates the board config binary. K3
devices require these binaries to be packed into the final system
firmware images.

Reviewed-by: Simon Glass <sjg@chromium.org>
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
2023-07-21 19:36:58 -04:00
Tom Rini
247aa5a191 Merge branch '2023-07-21-assorted-TI-platform-updates'
- The first half of a number of TI platform bugfixes and improvements,
  primarily around K3 platforms and splash screen support.
2023-07-21 19:33:05 -04:00