Buiding u-boot-spl-k3[_HS].its is currently unconditionally verbose
about what it does. Change that by wrapping the call to k3_fit_atf.sh
into a cmd, also using that chance to reduce duplicate lines of makefile
code - only IS_HS=1 is different when CONFIG_TI_SECURE_DEVICE is on.
Signed-off-by: Jan Kiszka <jan.kiszka@siemens.com>
Acked-by: Lokesh Vutla <lokeshvutla@ti.com>
K3 HS devices require signed binaries for boot, use the SECDEV tools
to sign the boot artifacts during build.
Signed-off-by: Andrew F. Davis <afd@ti.com>
Reviewed-by: Tom Rini <trini@konsulko.com>
Reviewed-by: Andreas Dannenberg <dannenberg@ti.com>
For signing the tiboot3.bin image, an optional KEY file can be passed
using CONFIG_SYS_K3_KEY. Right now, Makefile scripts directly takes
the config value and uses it for signing. This is okay if the build
directory is a sub-directory of source tree, otherwise it fails.
Fix it by using the path relative to the source tree.
Reported-by: Jean-Jacques Hiblot <jjhiblot@ti.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
Update Makefiles to generate:
- tiboot3.bin: Image format that can be processed by ROM.
Below is the tiboot3.bin image format that is required by ROM:
_______________________
| X509 |
| Certificate |
| ____________________ |
| | | |
| | u-boot-spl.bin | |
| | | |
| |___________________| |
|_______________________|
Reviewed-by: Tom Rini <trini@konsulko.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
Signed-off-by: Andreas Dannenberg <dannenberg@ti.com>
Update Makefile to generate
- tispl.bin: First stage bootloader on ARMv8 core
- u-boot.img: Second stage bootloader on ARMv8 core.
Reviewed-by: Tom Rini <trini@konsulko.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
