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arm: mx6: specify SPL padding
Specify standard padding for payload to 68KB. This is derived from the maximum header size plus maximum SPL size. It matches the already defined offset for SD/eMMC devices (69KB) too. This allows to use the u-boot-with-spl.imx build target to generate a directly flashable image which can be flashed using: dd if=u-boot-with-spl.imx of=/dev/mmcblk0 bs=512 skip=2 While the patch has been created with SD/eMMC in mind, this also works with other boot media. The board file needs to configure the media specific (absolute) payload offset accordingly. Especially the IVT offset is boot media specific and can be retrieved from the reference manual (Table 8-25. Image Vector Table Offset and Initial Load Region Size). For NAND boot a define like this should do the job: #define CONFIG_SYS_NAND_U_BOOT_OFFS (SPL_PAD_TO + 0x400) Signed-off-by: Stefan Agner <stefan.agner@toradex.com>
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#define CONFIG_SPL_TEXT_BASE 0x00908000
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#define CONFIG_SPL_MAX_SIZE 0x10000
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#define CONFIG_SPL_STACK 0x0091FFB8
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/*
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* Pad SPL to 68KB (4KB header + 64KB max size). This allows to write the
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* SPL/U-Boot combination generated with u-boot-with-spl.imx directly to a
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* boot media (given that boot media specific offset is configured properly).
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*/
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#define CONFIG_SPL_PAD_TO 0x11000
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/* NAND support */
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#if defined(CONFIG_SPL_NAND_SUPPORT)
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